Advances in Polyimide-Based Materials for Space Applications

Synthesis of High-Performance Colorless Polyimides with Asymmetric Diamine: Application in Flexible Electronic Devices

Colorless polyimides (CPIs) are widely used as high-performance materials in flexible electronic devices. From a molecular design standpoint, the industry continues to encounter challenges in developing CPIs with desired attributes, including exceptional optical transparency, excellent thermal stability, and enhanced mechanical strength. This study presents and validates a method for controlling 2-substituents, with a specific emphasis on examining how these substituents affect the thermal, mechanical, optical, and dielectric characteristics of CPIs. The presence of two CF3 groups on the same side of the diamine structure ensured the transmittance of the film. The charge transfer effect and the molecular distance are dynamically regulated by changing the 2-substituent (-OCH3/-CH3/H/F). The polyimide exhibited a well-maintained equilibrium between transparency and thermal stability, with a T500nm value ranging from 86.2 to 89.6% in the visible region, and a glass transition temperature (Tg) ranging from 358.6 to 376.0 °C. Additionally, the 6FDA-2-MTFMB compound, when combined with methyl, excels as a protective layer and base material, exhibiting excellent performance in various aspects. It has been verified as an appropriate option for flexible photodetectors and wearable piezoresistive sensors. In summary, this systematic investigation will provide a comprehensive and demonstrative methodology for developing CPIs that are capable of adapting to flexible electronic devices.

Silane modified Cr2O3/polyimide nanocomposite films with excellent surface insulation performance for space applications

The exploration of deep space significantly increases the probability of spacecraft failures due to surface electrostatic discharge, which imposes higher vacuum insulation protection requirements on polyimide (PI), the external insulation material of spacecrafts. To address this challenge, this study proposes using silane coupling agent KH550 for organic grafting treatment of Cr2O3nanoparticles, which are then used to dope and modify PI to enhance the vacuum surface insulation of PI films. The KH550 grafting improves the interface strength between the fillers and the matrix, allowing the fillers to be uniformly dispersed in the matrix. Compared to pure PI films, the prepared PI-Cr2O3@KH550 composite films exhibit significantly enhanced vacuum surface flashover voltage, improved surface/volume resistivity, and dielectric properties. The results demonstrate that PI composite films with 0.8% by mass of Cr2O3@KH550 show the most notable performance improvement, with the DC flashover voltage and impulse flashover voltage in vacuum increasing by 20.7% and 27.8%, respectively. The doping of chromium oxide nanoparticles introduces more deep traps into the PI films and reduce the surface resistivity. The higher deep trap density inhibits charge migration, thereby alleviating secondary electron emission and surface electric field distortion. Simultaneously, the lower surface resistivity facilitates dissipating surface charges and improves the surface insulation. These findings are of significant reference value for promoting the enhancement of aerospace insulation performance.

Ultrastrong, Ductile, Tear- and Folding-Resistant Polyimide Film Doubly Reinforced by an Aminated Rigid-Rod Macromolecule and Graphene Oxide

As a high-performance polymer with exceptional mechanical, thermal, and insulating properties, polyimide (PI) has been widely used as flexible circuit substrates for microelectronics, portable electronics, and wearable devices. Due to the growing demand for further thinning and lightweighting of electronic products, PI films need to have further enhanced mechanical properties. Traditional nanofiller-reinforced PI films often exhibit reduced ductility and limited improvements in strength. Therefore, it remains a challenge to simultaneously improve the strength and toughness of PI films while preserving their ductility. In this study, we report an exceptionally strong and ductile PI doubly reinforced by one-dimensional rigid-rod para-aramid, poly(p-aminophenylene aminoterephthalamide ((NH2)2-PPTA), and two-dimensional graphene oxide (GO) nanosheets. The amino side groups of (NH2)2-PPTA react with the anhydride end groups of PI, forming covalent bonds. At a (NH2)2-PPTA content of only 0.4 wt %, the (NH2)2-PPTA/PI film displays significantly enhanced mechanical properties. When 0.4 wt % of GO is added together with (NH2)2-PPTA, the tensile strength, tensile toughness, and strain at break reach 284.8 ± 5.3 MPa, 277.9 ± 7.6 MJ/m3, and 132.6 ± 3.8%, which are ∼178, ∼312, and ∼51% higher, respectively, than those of pure PI. Moreover, the doubly reinforced PI film also exhibits a 206% increase in tear strength and significantly enhanced folding resistance. The dual reinforcement of PI with (NH2)2-PPTA and GO improves the mechanical properties more efficiently than any single reinforcing agents previously reported and overcomes the disadvantage of most inorganic nanofillers that reduce ductility.

Electrical Conductivity Characteristic of Polyimide under Long-Term Combined Electron Irradiation and Thermal Cycle in Vacuum

During long-term operation, low-earth-orbit spacecraft are exposed to a severe environment of electron irradiation and thermal cycle. This affects the electric properties of polyimide, an essential insulation material for spacecraft electrical transmission equipment, particularly the conductivity characteristic. Therefore, this paper investigates the conductivity and its evolution of polyimide after the combination of 20 keV, 8 nA/cm2 electron irradiation, and 243-343 K, 5 K/min thermal cycle in a vacuum environment for 432 h. The results show that the conductivity increases by about 2 orders of magnitude over 432 h, with the threshold field for electric-field-dependent conductivity decreasing. The conductivity growth rate varies, rising during the first 192 h, then increasing in the midelectric field, and decreasing in the high electric field regions. The thermally stimulated depolarization current method demonstrates that increases in γ, β1, and β2 trap densities, associated with enhanced motility of end groups, diamines, and dianhydrides after long-chain breaks, lead to higher conductivity and growth rate. Additionally, increases in β3 and α trap densities, related to increased C═O bonds and free radicals, reduce the threshold field and the conductivity growth rate in the range of 57.0-100.0 kV/mm after 192 h. These findings provide a reference for the performance evaluation and enhancement of spacecraft polyimide materials.

From Molecular Design to Practical Applications: Strategies for Enhancing the Optical and Thermal Performance of Polyimide Films

Polyimide (PI) films are well recognized for their outstanding chemical resistance, radiation resistance, thermal properties, and mechanical strength, rendering them highly valuable in advanced fields such as aerospace, sophisticated electronic components, and semiconductors. However, improving their optical transparency while maintaining excellent thermal properties remains a significant challenge. This review systematically checks over recent advancements in enhancing the optical and thermal performance of PI films, focusing on various strategies through molecular design. These strategies include optimizing the main chain, side chain, non-coplanar structures, and endcap groups. Rigid and flexible structural characteristics in the proper combination can contribute to the balance thermal stability and optical transparency. Introducing fluorinated substituents and bulky side groups significantly reduces the formation of charge transfer complexes, enhancing both transparency and thermal properties. Non-coplanar structures, such as spiro and cardo configurations, further improve the optical properties while maintaining thermal stability. Future research trends include nanoparticle doping, intrinsic microporous PI polymers, photosensitive polyimides, machine learning-assisted molecular design, and metal coating techniques, which are expected to further enhance the comprehensive optical and thermal performance of PI films and expand their applications in flexible displays, solar cells, and high-performance electronic devices. Overall, systematic molecular design and optimization have significantly improved the optical and thermal performance of PI films, showing broad application prospects. This review aims to provide researchers with valuable references, stimulate more innovative research and applications, and promote the deep integration of PI films into modern technology and industry.

Effect of Ultraviolet Radiation on Properties of Ge2Sb2Te5 Phase Change Films

With the expanding utilization of space technology, the stability of electronic components' performance in radiation environments has garnered significant attention. In this study, we prepared Ge2Sb2Te5 phase change films and memory units on silicon substrates to explore the influence of ultraviolet (UV) radiation on their characteristics. The experimental findings revealed that UV irradiation at a power density of 450 mW/cm2 decreased the amorphous resistance and thermal stability of Ge2Sb2Te5 films, impeding their multistage storage performance. Nevertheless, the amorphous state could still undergo effective transformation into a crystalline state. Furthermore, UV irradiation triggered the photoelectric effect, narrowing the band gap and causing a redshift of the Raman peak in amorphous films. Remarkably, the surface properties of Ge2Sb2Te5 films remained unchanged under irradiation. The phase change memory device based on Ge2Sb2Te5 film retained its SET-RESET conversion capability at a pulse width of 100 ns post-UV irradiation, demonstrating resilience against UV radiation. This study offers the practical insights for the application of phase change memory in space radiation environments.

Enthalpy-Driven Self-Healing in Thin Metallic Films on Flexible Substrates

Self-healing microelectronics are needed for costly applications with limited or without access. They are needed in fields such as space exploration to increase lifetime and decrease both costs and the environmental impact. While advanced self-healing mechanisms for polymers are numerous, practical ways for self-healing in metal films have yet to be found. A concept for an autonomous intrinsic self-healing metallic film system is developed, allowing the healing of cracks in metallic films on flexible substrates. The concept relies on stabilizing metastable thin films with high mixing enthalpy via segregation barriers. This allows the films to possess autonomous intrinsic self-healing capabilities triggered by cracking at temperatures not detrimental to flexible microelectronics. The effect will be shown on metastable Mo1-xAgx thin films, stabilized via a Mo segregation barrier. Without a segregation barrier, the system is known to exhibit spontaneous Ag particle formation on the surface. This property is controlled and directed to heal cracks and partially restore the electro-mechanical properties of the multilayer system. This mechanism opens up the field of self-healing thin metallic films that could profoundly impact the design of future microelectronics.

Mechanism Analysis and Potential Applications of Atomic Oxygen Erosion Protection for Kapton-Type Polyimide Based on Molecular Dynamics Simulations

Polyimide (PI) is widely used in aerospace applications due to its excellent properties. However, the high concentration of atomic oxygen (AO) in low-earth orbit (LEO) significantly degrades its performance. This study employs reactive molecular dynamics (MD) simulations to analyze the AO erosion resistance of fluorinated polyimide (FPI) and polyhedral oligomeric silsesquioxane (POSS) composite polyimide models. The 35 ps simulation results indicate that the PI/POSS composite exhibits the best protective performance. The protection mechanism involves the formation of an SiO2 carbonized layer that prevents the transmission of AO and heat to the polyimide matrix, resulting in a normalized mass of 84.1% after erosion. The FPI model shows the second-best protective effect, where the introduction of -CF3 groups enhances the thermal stability of the polyimide matrix, resulting in a normalized mass of 80.7% after erosion. This study explores the protective effects and mechanisms of different polyimide protection methods at the molecular level, providing new insights for the design of AO erosion protection systems.

Study on the Application of Fluorinated Polyimide in the Acidic Corrosion Protection of 3-nitro-1,2,4-trizole-5-one (NTO)-Based Explosive Formulations

3-nitro-1,2,4-triazol-5-one (NTO) has been widely used as a kind of insensitive single-compound explosive owing to its excellent balance between safety and explosive energy. To reduce its possible acid corrosion and extend its application to insensitive ammunition, acid protection research on NTO-based explosives is significant. Traditionally, the acid protection effect was evaluated by metal corrosion, which is time-consuming and qualitative. An efficient and quantitative method is desirable for evaluating the acid protection effect and exploring novel protection materials. Herein, a polyimide of 4,4'-(hexafluoroisopropene)diphthalic anhydride (6FDA)/2,2-bis(trifluoromethyl)-4,4-diaminobiphenyl (TFMB) was synthesized by replacing the 4,4'-diaminodiphenyl ether (ODA) monomer with a TFMB monomer to act as an acid-protective coating material for NTO-based explosives. Compared with three other coating materials, polyvinylidene fluoride (PVDF), polyetherimide (PEI), and copolyimide (P84), the fluorinated polyimide exhibits the best acid protection effect. Moreover, a new method was constructed to obtain the pH time-dependent curve in order to evaluate efficiently the acid protection effect of the polymer materials. By the virtue of molecular dynamic simulation (Materials Studio 2023), the interfacial effects of the coating materials with NTO-based explosives were obtained. The study provides an interpretation of the acid protection effect on the molecular level, suggesting that the higher content of fluorine atoms is beneficial for stabilizing the active hydrogen atom of the NTO by forming intermolecular hydrogen bonds.

Soluble Fluorinated Cardo Copolyimide as an Effective Additive to Photopolymerizable Compositions Based on Di(meth)acrylates: Application for Highly Thermostable Primary Protective Coating of Silica Optical Fiber

The development of photocurable compositions is in high demand for the manufacture of functional materials for electronics, optics, medicine, energy, etc. The properties of the final photo-cured material are primarily determined by the initial mixture, which needs to be tuned for each application. In this study we propose to use simple systems based on di(meth)acrylate, polyimide and photoinitiator for the preparation of new photo-curable compositions. It was established that a fluorinated cardo copolyimide (FCPI) based on 2,2-bis-(3,4-dicarboxydiphenyl)hexafluoropropane dianhydride, 9,9-bis-(4-aminophenyl)fluorene and 2,2-bis-(4-aminophenyl)hexafluoropropane (1.00:0.75:0.25 mol) has excellent solubility in di(met)acrylates. This made it possible to prepare solutions of FCPI in such monomers, to study the effect of FCPI on the kinetics of their photopolymerization in situ and the properties of the resulting polymers. According to the obtained data, the solutions of FCPI (23 wt.%) in 1,4-butanediol diacrylate (BDDA) and FCPI (15 wt.%) in tetraethylene glycol diacrylate were tested for the formation of the primary protective coatings of the silica optical fibers. It was found that the new coating of poly(BDDA-FCPI23%) can withstand prolonged annealing at 200 °C (72 h), which is comparable or superior to the known most thermally stable photo-curable coatings. The proposed approach can be applied to obtain other functional materials.

Synthesis, Characterization, and Properties of Heat-Resistant Energetic Materials Based on C-C Bridged Dinitropyrazole Energetic Materials

Polycyclic energetic materials make up a distinctive class of conjugated structures that consist of two or more rings. In this work, 1,3-bis(3,5-dinitro-1H-pyrazol-4-yl)-4,6-dinitrobenzene (BDPD) was synthesized and investigated in detail as a polycyclic heat-resistant energetic molecule that can be deprotonated by bases to obtain its anionic (3-5) salts. All compounds were thoroughly characterized by 1H and 13C NMR, infrared spectroscopy, high-resolution mass spectrometry, and elemental analysis. The structural features of BDPD and its salts were investigated by single-crystal X-ray diffraction and analyzed by different kinds of computing software, like Multiwfn, Gaussian 09W, and so on. In addition, their thermal decomposition temperatures were evaluated by differential scanning calorimetry to be 319.8-329.0 °C, revealing that they possessed high thermal stabilities. The results of impact sensitivity and friction sensitivity analysis confirm that these energetic compounds were insensitive. The detonation properties of neutral compound BDPD and all its nonmetallic salts were calculated by the EXPLO5 v6.05.04 program. The results revealed that their detonation performances were higher than those of the widely used heat-resistant explosive 2,2',4,4',6,6'-hexanitrostilbene (HNS). Combining the above results, it is reasonable to suggest that these compounds have the potential to be heat-resistant energetic materials.

Activation of polyimide by oxygen plasma for atomic layer deposition of highly compact titanium oxide coating

Titanium oxide (TiO2) coated polyimide has broad application prospects under extreme conditions. In order to obtain a high-quality ultra-thin TiO2coating on polyimide by atomic layer deposition (ALD), the polyimide was activated byin situoxygen plasma. It was found that a large number of polar oxygen functional groups, such as carboxyl, were generated on the surface of the activated polyimide, which can significantly promote the preparation of TiO2coating by ALD. The nucleation and growth of TiO2were studied by x-ray photoelectron spectroscopy monitoring and scanning electron microscopy observation. On the polyimide activated by oxygen plasma, the size of TiO2nuclei decreased and the quantity of TiO2nuclei increased, resulting in the growth of a highly uniform and dense TiO2coating. This coating exhibited excellent resistance to atomic oxygen. When exposed to 3.5 × 1021atom cm-2atomic oxygen flux, the erosion yield of the polyimide coated with 100 ALD cycles of TiO2was as low as 3.0 × 10-25cm3/atom, which is one order less than that of the standard POLYIMIDE-ref Kapton®film.

Bioinspired Flexible Capacitive Sensor for Robot Positioning in Unstructured Environments

The evolution of bionic machines into intelligent robots to adapt to real scenarios is inseparable from positioning sensors. However, traditional positioning methods such as camera arrays, ultrasound, or GPS are limited in narrow concealed spaces, harsh temperatures, or dynamic light fields, which hinder the practical application of special robots. Here, we report a flexible sensor inspired by Gnathonemus petersii that enables robots to achieve contactless and high-precision spatial localization independent of the unstructured features of the environment. Sensors are obtained from low-cost materials (carbon nanotubes and polyimides) and simple structures (fibers) and preparation processes (spin-coating). Experiments and simulations confirmed the high resolution (<1 mm) of the sensor over a large distance detection range (>150 mm) and high bandwidth (0-520 MPa) of contact force. Moreover, the sensing capability is still feasible when the sensor is bent to various curvatures and not affected under harsh conditions such as ultralow temperatures (below -78 °C), ultrahigh temperatures (over 250 °C), darkness, or brightness. We demonstrate the practical potential of the proposed sensors for a biomimetic hyper-redundant continuum robot to locate and avoid collisions in unstructured environments.

Constructing Novel High Dielectric Constant Polyimides Containing Dipolar Pendant Groups with Enhanced Orientational Polarization

Polymer dielectrics with high dielectric constant are urgently demanded for potential electrical and pulsed power applications. The design of polymers with side chains containing dipolar groups is considered an effective method for preparing materials with a high dielectric constant and low loss. This study synthesizes and comprehensively compare the dielectric properties of novel polyimides with side chains containing urea (BU-PI), carbamate (BC-PI), and sulfonyl (BS-PI) functional groups. The novel polyimides exhibit relatively high dielectric constant and low dielectric loss values due to the enhanced orientational polarization and suppressed dipole-dipole interactions of dipolar groups. In particular, BU-PI containing urea pendant groups presents the highest dielectric constant of 6.14 and reasonably low dielectric loss value of 0.0097. The strong γ transitions with low activation energies derived from dielectric spectroscopy measurements have been further evaluated to demonstrate the enhanced free rotational motion of urea pendant dipoles. In energy storage applications, BU-PI achieves a discharged energy density of 6.92 J cm-3 and a charge-discharge efficiency above 83% at 500 MV m-1. This study demonstrates that urea group, as dipolar pendant group, can provide polymers with better dielectric properties than the most commonly used sulfonyl groups.

LIBS as a novel tool for the determination of the imidization degree of polyimides

Due to their outstanding chemical and physical properties, polyimides are widely used in industrial applications. The degree of imidization of polyimides significantly influences their properties, making it an important factor in tailoring the material for specific applications. Imidization refers to the process of converting a precursor poly(amic acid) by removing water, and it is essential to analyze this process in detail to tune the final structure and properties of the material. Conventional techniques for this task include Fourier transform infrared spectroscopy (FT-IR), thermogravimetric analysis (TGA), or differential scanning calorimetry (DSC), but they lack the possibility of spatially and/or depth-resolved analysis or do not enable in-line monitoring capabilities. To overcome these limitations, we propose laser-induced breakdown spectroscopy (LIBS) as a powerful tool for the monitoring of the imidization reaction. To establish a measurement method, a total of 130 in-house prepared, self-synthesized samples were thermally cured to exhibit varying imidization degrees. IR spectroscopy served as a reference technique during method development, and a novel formula for calculating the degree of imidization, based on the C2 and H signal trends, was introduced. The calculated imidization degrees of model thin films based on LIBS were in good accordance with the IR reference method although minor differences between the two methods were expected due to varying information depth and the size of the sampled area. Additionally, the robustness of the procedure was demonstrated by depth profiling of a stacked model polymer, spiking with commercially available additives and, ultimately, by analyzing industry-relevant polymer samples.

Scalable synthesis of high-quality, reduced graphene oxide with a large C/O ratio and its dispersion in a chemically modified polyimide matrix for electromagnetic interference shielding applications

High-purity reduced graphene oxide (RGO or rGO) with appreciable conductivity is a desired conductive filler for lightweight polymer composites used in coatings, electronics, catalysts, electromagnetic interference (EMI) shielding, and energy storage devices. However, the intrinsic conductivity and the uniform dispersion of RGO in relatively polar matrices are challenging, leading to poor overall conductivity and performance of the composite material. The reported study improved the RGO intrinsic conductivity by increasing its C/O ratio while also simultaneously enhancing its compatibility with the polyimide (PI) matrix through ester linkages for better dispersion. A two-step reduction method drastically increased the number of structural defects and carbon content in the resulting RGO, corresponding to a maximum ID/IG and C/O of 1.54 and ∼87, respectively. Moreover, the 2D nanosheets with limited hydroxyl (-OH) groups effectively interacted with anhydride-terminated polyamic acid (AT-PAA) through chemical linkages to make high-performance RGO/PI nanocomposites. Consequently, the polymer matrix composites possessed the highest direct current conductivity of 15.27 ± 0.61 S cm-1 for 20 wt% of the prepared RGO. Additionally, the composite material was highly stiff (3.945 GPa) yet flexible (easily bent through 180°), lightweight (∼0.34 g cm-3), and capable of forming thin films (162 ± 15 μm). Unlike most polymer matrix composites, it showcased one of its class's highest thermal stabilities (a weight loss of only 5% at 638 °C). Ultimately, the composite performed as an effective electromagnetic interference (EMI) shielding material in the X-Band (8 to 12 GHz), demonstrating outstanding shielding effectiveness (SE), shielding effectiveness per unit thickness (SEt), specific shielding effectiveness (SSE), and absolute shielding effectiveness (SSEt) of 46 dB, 2778 dB cm-2, 138 dB cm3 g-1, and 8358 dB cm2 g-1, respectively. As a consequence of this research, the high-purity RGO and its high-performance PI matrix nanocomposites are anticipated to find practical applications in conductive coatings and flexible substrates demanding high-temperature stability.

Recent Progress in Sulfur-Containing High Refractive Index Polymers for Optical Applications

The development in the field of high refractive index materials is a crucial factor for the advancement of optical devices with advanced features such as image sensors, optical data storage, antireflective coatings, light-emitting diodes, and nanoimprinting. Sulfur plays an important role in high refractive index applications owing to its high molar refraction compared to carbon. Sulfur exists in multiple oxidation states and can exhibit various stable functional groups. Over the last few decades, sulfur-containing polymers have attracted much attention owing to their wide array of applications governed by the functional group of sulfur present in the polymer repeat unit. The interplay of refractive index and various other polymer properties contributes to successfully implementing a specific polymer material in optical applications. The focus on developing optoelectronic devices induced an ever-increasing need to integrate different functional materials to achieve the devices' full potential. Several devices that see the potential use of sulfur in high refractive index materials are reviewed in the study. Like sulfur, selenium also exhibits high molar refraction and unique chemical properties, making it an essential field of study. This review covers the research and development in the field of sulfur and selenium in different forms of functionality, focusing on the chemistry of bonding and the optical properties of the polymers containing the heteroatoms mentioned above. The strategy and rationale behind incorporating heteroatoms in a polymer matrix to produce high-refractive-index materials are also described in the present review.

Mode I Fatigue and Fracture Assessment of Polyimide-Epoxy and Silicon-Epoxy Interfaces in Chip-Package Components

Semiconductor advancements demand greater integrated circuit density, structural miniaturization, and complex material combinations, resulting in stress concentrations from property mismatches. This study investigates the failure in two types of interfaces found in chip packages: silicon-epoxy mold compound (EMC) and polyimide-EMC. These interfaces were subjected to quasi-static and fatigue loading conditions. Employing a compliance-based beam method, the tests determined interfacial critical fracture energy values, (GIC), of 0.051 N/mm and 0.037 N/mm for the silicon-EMC and polyimide-EMC interfaces, respectively. Fatigue testing on the polyimide-epoxy interface revealed a fatigue threshold strain energy, (Gth), of 0.042 N/mm. We also observed diverse failure modes and discuss potential mechanical failures in multi-layer chip packages. The findings of this study can contribute to the prediction and mitigation of failure modes in the analyzed chip packaging. The obtained threshold energy and crack growth rate provide insights for designing safe lives for bi-material interfaces in chip packaging under cyclic loads. These insights can guide future research directions, emphasizing the improvement of material properties and exploration of the influence of manufacturing parameters on delamination in multilayer semiconductors.

Recent Advances and Challenges in Polymer-Based Materials for Space Radiation Shielding

Space exploration requires the use of suitable materials to protect astronauts and structures from the hazardous effects of radiation, in particular, ionizing radiation, which is ubiquitous in the hostile space environment. In this scenario, polymer-based materials and composites play a crucial role in achieving effective radiation shielding while providing low-weight and tailored mechanical properties to spacecraft components. This work provides an overview of the latest developments and challenges in polymer-based materials designed for radiation-shielding applications in space. Recent advances in terms of both experimental and numerical studies are discussed. Different approaches to enhancing the radiation-shielding performance are reported, such as integrating various types of nanofillers within polymer matrices and optimizing the materials design. Furthermore, this review explores the challenges in developing multifunctional materials that are able to provide radiation protection. By summarizing the state-of-the-art research and identifying emerging trends, this review aims to contribute to the ongoing efforts to identify polymer materials and composites that are most useful to protect human health and spacecraft performance in the harsh radiation conditions that are typically found during missions in space.

Preparation and Properties of Atomic-Oxygen Resistant Polyimide Films Based on Multi-Ring Fluoro-Containing Dianhydride and Phosphorus-Containing Diamine

Colorless and transparent polyimide (CPI) films with good atomic oxygen (AO) resistance and high thermal endurance are highly required in low earth orbit (LEO) space exploration. Conventional CPI films based on fluoro-containing 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) have been widely used in space applications. However, the AO erosion yields and glass transition temperatures (Tg) of the 6FDA-based CPI films have to be modified in order to meet the severe serving environments. In the current work, novel CPI films based on a multi-ring fluoro-containing 9,9-bis(trifluoromethyl)xanthene-2,3,6,7-tetracarboxylicdianhydride (6FCDA) monomer were developed. In order to enhance the AO resistance of the derived CPI film, a phosphorus-containing aromatic diamine, 2,5-bis[(4-aminophenoxy)phenyl]diphenylphosphine oxide (BADPO) was used to polymerize with the dianhydride to create the organo-soluble resin. Then, two phosphorus-containing CPI films (PPI), including PPI-1 (6FDA-BADPO) and PPI-2 (6FCDA-BADPO) were prepared by thermally curing of the PPI solutions at elevated temperatures. The PPI films maintained good optical transparency with transmittance values over 80% at a wavelength of 450 nm. PPI-2 exhibited a Tg value of 311.0 °C by differential scanning calorimetry (DSC) measurement, which was 46.7 °C higher than that of the PPI-1 counterpart (Tg = 264.3 °C). In addition, the PPI-2 film showed a coefficient of linear thermal expansion (CTE) value of 41.7 × 10-6/K in the range of 50~250 °C, which was apparently lower than that of the PPI-1 sample (CTE = 49.2 × 10-6/K). Lastly, both of the two PPI films exhibited good AO resistance with the erosion yields (Ey) of 6.99 × 10-25 cm3/atom for PPI-1 and 7.23 × 10-25 cm3/atom for PPI-2 at an exposure flux of 5.0 × 1020 atoms/cm2. The Ey values of the current PPI films were obviously lower than that of the standard polyimide (PI) film based on pyromellitic dianhydride (PMDA) and 4,4'-oxydianiline (ODA) (Ey = 3.0 × 10-24 cm3/atom).

Effects of various types of organo-mica on the physical properties of polyimide nanocomposites

Poly(amic acid) (PAA) was synthesized using dianhydride 4,4'-oxydiphthalic anhydride and diamine 3,3'-dihydroxybenzidine, and polyimide (PI) hybrid films were synthesized by dispersing organo-mica in PAA through a solution intercalation method. Hexadimethrine-mica (HM-Mica), 1,2-dimethylhexadecylimidazolium-mica (MI-Mica), and didodecyldiphenylammonium-mica (DP-Mica), which were obtained via the organic modification of pristine mica, were used as the organo-micas for the PI hybrid films. The organo-mica content was varied from 0.5 to 3.0 wt% with respect to the PI matrix. The thermomechanical properties, morphology, and optical transparency of the resultant PI hybrid films were measured and compared. Dispersion of even small amounts of organo-mica effectively improved the physical properties of the PI hybrids, and maximum enhancements in physical properties were observed at a specific critical content. Electron microscopy of the hybrid films revealed that the organo-mica uniformly dispersed throughout the polymer matrix at the nanoscale level when added at low contents but aggregated in the matrix when added at levels above the critical content. Structural changes in the organo-mica closely influenced the changes in the physical properties of the hybrid films. All PI hybrid films with various organo-mica contents showed similar optical properties, but that prepared with MI-Mica demonstrated the best thermomechanical properties. All synthesized PI hybrid films were transparent regardless of the type and content of organo-mica used.

An investigation on polymers for shielding of cosmic radiation for lunar exploration

In outer space, we find many types of radiations that are due to solar flares, radiation belt, cosmic rays, etc. We are fortunate enough to be protected from these radiations on the surface of the Earth, whereas in other celestial objects such as planets and satellites, without a protecting atmosphere, penetration of radiation that may be ionising or non-ionising is inevitable. Hence, studying radiation environment and its effect on such celestial objects is very important for establishing facilities such as satellites, payloads, vehicles and human exploration. For such cases, manufacturing the products with lightweight, thermally stable, flexible, mechanically durable materials is essential and needs to be studied for the radiation effect. Hence, in the present work, we have made an attempt to calculate the rate of absorbed dose in case of polymers such as Polyvinyl Chloride (PVC), polytetrafluoroethylene, Mylar, polystyrene and Zylon for the lunar radiation environment. From the literature, it is found that ions up to iron has a lion share in the ionic radiation in space. The simulations were carried out for ions from hydrogen to iron using the SRIM software with various energies. It is observed that the absorbed dose rate in the polymers increases with the increase in ion mass. Further, the study can be extended to get the information of various flexible materials for these ions from which a suitable material can be chosen for the different space applications.

Highly Thermally Conductive and Structurally Ultra-Stable Graphitic Films with Seamless Heterointerfaces for Extreme Thermal Management

Highly thermally conductive graphitic film (GF) materials have become a competitive solution for the thermal management of high-power electronic devices. However, their catastrophic structural failure under extreme alternating thermal/cold shock poses a significant challenge to reliability and safety. Here, we present the first investigation into the structural failure mechanism of GF during cyclic liquid nitrogen shocks (LNS), which reveals a bubbling process characterized by "permeation-diffusion-deformation" phenomenon. To overcome this long-standing structural weakness, a novel metal-nanoarmor strategy is proposed to construct a Cu-modified graphitic film (GF@Cu) with seamless heterointerface. This well-designed interface ensures superior structural stability for GF@Cu after hundreds of LNS cycles from 77 to 300 K. Moreover, GF@Cu maintains high thermal conductivity up to 1088 W m-1 K-1 with degradation of less than 5% even after 150 LNS cycles, superior to that of pure GF (50% degradation). Our work not only offers an opportunity to improve the robustness of graphitic films by the rational structural design but also facilitates the applications of thermally conductive carbon-based materials for future extreme thermal management in complex aerospace electronics.

Exploring the Impact of Blend and Graft of Quinoline Derivative in Low-Temperature Curable Polyimides

The utilization of accelerators has been a common approach to prepare low-temperature curable polyimide (PI). However, the accelerators have gradually fallen out of favor because of their excessive dosages and negative effect on the properties of PI. In this work, a new strategy of introducing accelerators by grafting to eliminate these disadvantages is presented. A novel quinoline derivative named 6-([1,1'-biphenyl]-4-yl)-4-chloroquinoline (NQL) is designed for this purpose, and an ultralow dosage of only 2.5 mol% is sufficient to prepare low-temperature curable PI. The favorable low-temperature curing effect of NQL is attributed to its strong alkalinity (pKa = 18.47) and electron-donating ability. At a curing temperature of 200 °C, the PI with 2.5 mol% NQL showed outstanding properties (Young's modulus of 5.73 GPa, elongation of 37.3%, tensile strength of 237 MPa, and coefficient of thermal expansion of 16 ppm K-1 ). In particular, NQL can even lower the curing temperature to 180 °C and the ultralow temperature curable PI film still retains excellent properties. These results demonstrate that introducing low-temperature curable accelerators by partial grafting instead of blending is a promising way to furnish low-temperature curable PI, and provide insights into the preparation of polyimide with high performance in advanced packaging.

Fabrication of Lightweight Polyimide Foams with Exceptional Mechanical and Thermal Properties

Lightweight polyimide foams (PIFs) with exceptional thermal resistance and compressive properties are fabricated by heating polyester ammonium salts (PEASs) which are prepared by copolymerizing 4, 4'-diaminobenzanilide (DABA), 4, 4'-diaminodiphenyl methane (MDA) and 3, 3', 4, 4'-benzophenone tetracarboxylic dianhydride (BTDA). Hydrogen bonds are formed between CONH and CO in the PI chains due to the addition of DABA and the melt viscosity of PEAS precursors increase with increasing content of DABA, which is advantageous to bind the foaming gases for cell expansion. The expansion ratio of PEAS precursors is increased from 633% to 1133% when the molar ratio of MDA/DABA is changed from 10:0 to 6:4. The compressive strength and modulus of PIFM9D1 (i.e., the molar ratio of MDA/DABA is 9:1, foam density: 120.8 kg m-3 ) reach as high as 0.59 and 15.0 MPa, respectively. The PIFs possess prominent thermal performance with the initial thermal degradation temperatures (under both nitrogen and air atmosphere) and glass transition temperatures (as assessed by DSC and DMA) exceeding 511 and 292 °C, respectively. The thermal conductivity of PIFs is lower than 0.049 W m-1 K-1 , which exhibits promising applications for serving as high-temperature thermal insulation materials in the fields of aerospace, marine, and nuclear sectors among others.

New Fluorine-Containing Diamine Monomers for Potentially Improved Polyimides

Two new fluorine-containing diamine monomers were designed with the goal of reducing charge transfer complex (CTC) interactions between neighboring chains in polyimides (i.e., high transparency/low color) while hopefully maintaining the well-known thermal stability and flexibility generally associated with polyimides. The proposed diamines have been prepared through (1) the functionalization of 1,3-bis[(pentafluorobenzyl)oxy]benzene with 4-aminophenol and (2) the addition of 2-chloro-5-nitrobenzotrifluoride to 4,4'-bicyclohexanol followed by reduction of the resulting dinitro compound. The new compounds have been characterized by multinuclear NMR and IR spectroscopy and high-resolution liquid chromatography-mass spectrometry as well as single-crystal X-ray diffraction on the new diamine prepared from 4,4'-bicyclohexanol. Not only was the structure of the proposed new diamine confirmed, but another interesting example of hydrogen bonding between an N-H proton and the π-system of an aromatic ring was observed and documented. Initial polymerizations have been carried out via the two-step imidization process.

A Comprehensive Review on the Thermal Stability Assessment of Polymers and Composites for Aeronautics and Space Applications

This review article provides an exhaustive survey on experimental investigations regarding the thermal stability assessment of polymers and polymer-based composites intended for applications in the aeronautical and space fields. This review aims to: (1) come up with a systematic and critical overview of the state-of-the-art knowledge and research on the thermal stability of various polymers and composites, such as polyimides, epoxy composites, and carbon-filled composites; (2) identify the key factors, mechanisms, methods, and challenges that affect the thermal stability of polymers and composites, such as the temperature, radiation, oxygen, and degradation; (3) highlight the current and potential applications, benefits, limitations, and opportunities of polymers and composites with high thermal stability, such as thermal control, structural reinforcement, protection, and energy conversion; (4) give a glimpse of future research directions by providing indications for improving the thermal stability of polymers and composites, such as novel materials, hybrid composites, smart materials, and advanced processing methods. In this context, thermal analysis plays a crucial role in the development of polyimide-based materials for the radiation shielding of space solar cells or spacecraft components. The main strategies that have been explored to improve the processability, optical transparency, and radiation resistance of polyimide-based materials without compromising their thermal stability are highlighted. The combination of different types of polyimides, such as linear and hyperbranched, as well as the incorporation of bulky pendant groups, are reported as routes for improving the mechanical behavior and optical transparency while retaining the thermal stability and radiation shielding properties. Furthermore, the thermal stability of polymer/carbon nanocomposites is discussed with particular reference to the role of the filler in radiation monitoring systems and electromagnetic interference shielding in the space environment. Finally, the thermal stability of epoxy-based composites and how it is influenced by the type and content of epoxy resin, curing agent, degree of cross-linking, and the addition of fillers or modifiers are critically reviewed. Some studies have reported that incorporating mesoporous silica micro-filler or microencapsulated phase change materials (MPCM) into epoxy resin can enhance its thermal stability and mechanical properties. The mesoporous silica composite exhibited the highest glass transition temperature and activation energy for thermal degradation among all the epoxy-silica nano/micro-composites. Indeed, an average activation energy value of 148.86 kJ/mol was recorded for the thermal degradation of unfilled epoxy resin. The maximum activation energy range was instead recorded for composites loaded with mesoporous microsilica. The EMC-5p50 sample showed the highest mean value of 217.6 kJ/mol. This remarkable enhancement was ascribed to the polymer invading the silica pores and forging formidable interfacial bonds.

Tailoring Organic/Inorganic Interface Trap States of Metal Oxide/Polyimide toward Improved Vacuum Surface Insulation

High-voltage and high-power devices are indispensable in spacecraft for outer space explorations, whose operations require aerospace materials with adequate vacuum surface insulation performance. Despite persistent attempts to fabricate such materials, current efforts are restricted to trial-and-error methods and a universal design guideline is missing. The present work proposes to improve the vacuum surface insulation by tailoring the surface trap state density and energy level of the metal oxides with varied bandgaps, using coating on a polyimide (PI) substrate, aiming for a more systematical workflow for the insulation material design. First-principle calculations and trap diagnostics are employed to evaluate the material properties and reveal the interplay between trap states and the flashover threshold, supported by dedicated analyses of the flashover voltage, secondary electron emission (SEE) from insulators, and surface charging behaviors. Experimental results suggest that the coated PI (i.e., CuO@PI, SrO@PI, MgO@PI, and Al2O3@PI) can effectively increase the trap density and alter the trap energy levels. Elevated trap density is demonstrated to always yield lower SEE. In addition, increasing shallow trap density accelerates surface charge dissipation, which is favorable for improving surface insulation. CuO@PI exhibits the most remarkable increase in shallow trap density, and accordingly, the highest flashover voltage is 42.5% higher than that of pristine PI. This study reveals the critical role played by surface trap states in flashover mitigation and offers a novel strategy to optimize the surface insulation of materials.

Colorless and transparent poly(amide imide) nanocomposites containing organically modified hectorite

Polyamic acid (PAA) was synthesized using the diamine monomer N,N'-[2,2'-bis(trifluoromethyl)-4,4'-biphenylene]bis(4-aminobenzamide) and dianhydride monomer 4,4'-oxydiphthalic anhydride. Colorless and transparent poly(amide imide) (CPAI) hybrid films were prepared via multi-step thermal imidization of PAA in which various contents of nano-filler were dispersed. The CPAI hybrid films were prepared by dispersing organoclay STN, which was obtained by organically modifying hectorite, in CPAI by solution intercalation with various contents ranging from 1 to 7 wt%. The thermomechanical properties, morphologies, and optical transparencies of the obtained CPAI hybrid films were investigated based on the dispersed STN content, and the results were compared. Some of the clay in the CPAI hybrid film were agglomerated, which was observed using a transmission electron microscope; however, most clays were well-dispersed, with a nano-size of less than 10 nm. The best thermomechanical properties of the CPAI hybrid film were exhibited with an STN content of 3 wt%, but these properties decreased above the critical content. The coefficients of thermal expansion of all the hybrid films were below 20 ppm per °C regardless of the amount of STN, and the yellow index was 1-2 even when the STN content increased to 7 wt%.

Nacre-Inspired Bacterial Cellulose/Mica Nanopaper with Excellent Mechanical and Electrical Insulating Properties by Biosynthesis

The exploration of extreme environments has become necessary for understanding and changing nature. However, the development of functional materials suitable for extreme conditions is still insufficient. Herein, a kind of nacre-inspired bacterial cellulose (BC)/synthetic mica (S-Mica) nanopaper with excellent mechanical and electrical insulating properties that has excellent tolerance to extreme conditions is reported. Benefited from the nacre-inspired structure and the 3D network of BC, the nanopaper exhibits excellent mechanical properties, including high tensile strength (375 MPa), outstanding foldability, and bending fatigue resistance. In addition, S-Mica arranged in layers endows the nanopaper with remarkable dielectric strength (145.7 kV mm^-1 ) and ultralong corona resistance life. Moreover, the nanopaper is highly resistant to alternating high and low temperatures, UV light, and atomic oxygen, making it an ideal candidate for extreme environment-resistant materials.

Synergistic Effect of Metal Oxide and Carbon Nanoparticles on the Thermal and Mechanical Properties of Polyimide Composite Films

In this paper, we report on novel polyimide (PI) nanocomposites filled with binary mixtures of metal oxide (either TiO₂ or ZrO₂) nanoparticles and nanocarbon (either carbon nanofibers (CNFs) or functionalized carbon nanotubes (CNT_fs)). The structure and morphology of the materials obtained were comprehensively studied. An exhaustive investigation of their thermal and mechanical properties was performed. We revealed a synergistic effect of the nanoconstituents with regard to a number of functional characteristics of the PIs compared with single-filler nanocomposites, including thermal stability, stiffness (below and above glass transition temperature), yield point, and temperature of flowing. Moreover, the possibility of manipulating the properties of the materials by choosing a proper combination of the nanofillers was demonstrated. The results obtained can become a platform in the design of PI-based engineering materials with tailored characteristics capable of operating in extreme conditions.

Tough Structural Adhesives with Ultra-Resistance to Both High and Cryogenic Temperature

Structural adhesion at high temperature has been a challenge for organic adhesives, and the commercially available adhesives that can work at a temperature above 150 °C is rather limited. Herein, two novel polymers were designed and synthesized via facile strategy, which involves polymerization between melamine (M) and M-Xylylenediamine (X), as well as copolymerization of MX and urea (U). With well-balanced rigid-flexible structures, the obtained MX and MXU resins were proved to be outstanding structural adhesives at a wide range temperature of -196~200 °C. They provided room-temperature bonding strength of 13~27 MPa for various substrates, steel bonding strength of 17~18 MPa at cryogenic temperature (-196 °C), and 15~17 MPa at 150 °C. Remarkably, high bonding strength of 10~11 MPa was retained even at 200 °C. Such superior performances were attributed to a high content of aromatic units, which leads to high glass transition temperature (T_g) up to ~179 °C, as well as the structural flexibility endowed by the dispersed rotatable methylene linkages.

Preparation of crystalline polyimide nanofibers via solution crystallization

Two crystalline polyimide nanofibers (PINFs) with different morphologies were prepared. The crystalline unit cells of the aromatic PI crystals and the crystal morphologies of the fabricated PINFs were examined. PINF-I (lengths = 305 ± 152 nm and diameters = 12 ± 2 nm) was crystallized from crystalline PI dissolved in a concentrated sulfuric acid solution. The resulting PINF-I was isolated from this solution, and it did not aggregate in water. PINF-II with diameters of 105 ± 99 nm was prepared by dispersing PINF-I in a mixed water and t-butanol (TBA) solution (water:TBA = 4:1), followed by freeze-drying. Then, the PINF-II was heated to enhance its crystallinity. X-ray diffraction and transmission electron microscopy studies of the heat-treated PINF-II revealed a PI crystalline unit cell [orthorhombic, a = 1.21 nm, b = 0.88 nm, and c = 2.23 nm (molecular chain axis direction)]. The crystal structure of the heat-treated PINF-II suggested that highly crystalline PINFs were fabricated in which the PI molecular chains were oriented along the direction of the fiber lengths.

Additive Manufactured Strain Sensor Using Stereolithography Method with Photopolymer Material

As a result of the developments in additive manufacturing (AM) technology, 3D printing is transforming from a method used only in rapid prototyping to a technique used to produce large-scale equipment. This study presents the fabrication and experimental studies of a 3D-printed strain sensor that can be used directly in soft applications. Photopolymer-based conductive and flexible ultraviolet (UV) resin materials are used in the fabrication of the sensor. A Stereolithography (SLA)-based printer is preferred for 3D fabrication. The bottom base of the sensor, which consists of two parts, is produced from flexible UV resin, while the channels that should be conductive are produced from conductive UV resin. In total, a strain sensor with a thickness of 2 mm was produced. Experimental studies were carried out under loading and unloading conditions to observe the hysteresis effect of the sensor. The results showed a close linear relationship between the strain sensor and the measured resistance value. In addition, tensile test specimens were produced to observe the behavior of conductive and non-conductive materials. The tensile strength values obtained from the test results will provide information about the sensor placement. In addition, the flexible structure of the strain sensor will ensure its usability in many soft applications.

Research Progress and Application of Polyimide-Based Nanocomposites

Polyimide (PI) is one of the most dominant engineering plastics with excellent thermal, mechanical, chemical stability and dielectric performance. Further improving the versatility of PIs is of great significance, broadening their application prospects. Thus, integrating functional nanofillers can finely tune the individual characteristic to a certain extent as required by the function. Integrating the two complementary benefits, PI-based composites strongly expand applications, such as aerospace, microelectronic devices, separation membranes, catalysis, and sensors. Here, from the perspective of system science, the recent studies of PI-based composites for molecular design, manufacturing process, combination methods, and the relevant applications are reviewed, more relevantly on the mechanism underlying the phenomena. Additionally, a systematic summary of the current challenges and further directions for PI nanocomposites is presented. Hence, the review will pave the way for future studies.

Dynamic Sustainable Polyimide Film Combining Hardness with Softness via a "Mimosa-Like" Bionic Strategy

Dielectric polyimides (PIs) are ubiquitous as insulation in electrical power systems and electronic devices. Generally, dynamic polyimide is required to solve irreversible failure processes of electrical or mechanical damage, for example, under high temperature, pressure, and field strength. The challenge lies in the design of the molecular structure of rigid polyimide to achieve dynamic reversibility. Herein, a low-molecular-weight polyimide gene unit is designed to crosslink with polyimide ligase to prepare the smart film. Interestingly, due to the variability of gene unit and ligase combinations, the polyimide films combining hardness with softness are designed into three forms via a "Mimosa-like" bionic strategy to adapt to different application scenarios. Meanwhile, the films have good degradation efficiency, excellent recyclability, and can be self-healable, which makes them reuse. Clearly, the films can be used in the preparation of ultrafast sensors with a response time ≈0.15 s and the application of corona-resistant films with 100% recovery. Furthermore, the construction of polyimide and carbon-fiber-reinforced composites (CFRCs) has been verified to apply to the worse environment. Nicely, the composites have the property of multiple cycles and the non-destructive recycle rate of carbon fiber (CF) is as high as 100%. The design idea of preparing high-strength dynamic polyimide by crosslinking simple polyimide gene unit with ligase could provide a good foundation and a clear case for the sustainable development of electrical and electronic polyimides, from the perspective of Mimosa bionics.

Property investigation for high-Performance Polyimides fabricated via compression molding in solid-like state

A compacted body was fabricated by pulverulent polyimide (PI) block copolymers using solid-like state compression molding (SCM) technique. Polymer heated to solid-like state, i.e. the high-elastic non-melting state above the glass transition temperature ( Tg) and well below melting temperature, could achieve plasticity due to dramatic decreases in elastic modulus. Tensile properties were taken as response values, and the results of single-factor experiments indicated that molding temperature was the dominant parameter on mechanical performances, followed by molding pressure and holding time. Within this context, the SCM process possesses a longer processing time window whereas the processing temperature is narrow. The manufacturing defects induced by inappropriate processing conditions also hurt the tribological performance of PIs. Particles in a solid-like state could coalesce tightly only by exerting both high temperature and pressure in the SCM process. Thermoforming mechanism examined by atomic-scale molecular dynamics simulation indicated that non-bonding interaction forces, especially van der Waals forces play a key role in fusing among polymeric particles. This study is devoted to establishing the interdependence of structure-formability-property for high-temperature polymers that are not melt processible.

Preparation of a Crosslinked Poly(imide-siloxane) for Application to Transistor Insulation

Insulated gate bipolar transistor (IGBT) is an important power device for the conversion, control, and transmission of semiconductor power, and is used in various industrial fields. The IGBT module currently uses silicone gel as an insulating layer. Since higher power density and more severe temperature applications have become the trend according to the development of electronic device industry, insulating materials with improved heat resistance and insulation performances should be developed. In this study, we intended to synthesize a new insulating material with enhanced thermal stability and reduced thermal conductivity. Poly(imide-siloxane) (PIS) was prepared and crosslinked through a hydrosilylation reaction to obtain a semi-solid Crosslinked PIS. Thermal decomposition temperature, thermal conductivity, optical transparency, dielectric constant, and rheological property of the Crosslinked PIS were investigated and compared to those of a commercial silicone gel. The Crosslinked PIS showed high thermal stability and low thermal conductivity, along with other desirable properties, and so could be useful as an IGBT-insulating material.

Novel Synthesis of Polyimide Foams with Aromatic and 1,6-Diaminohexane Imide Bonding

A novel type of polyimide foams (PIFs) with chemically inserted flexible aliphatic diamine (1,6-diaminohexane (HMDA)) segments was successfully synthesized and characterized in this research. The aliphatic HMDA segments were randomly incorporated in the long chain aromatic imide bonds. The obtained PIFs containing various HMDA contents (0 to 20 mol%) exhibited different morphologies such as lowered density and larger cell diameter (with higher HMDA content), and open cell ratio was increased as well. HMDA rendered flexibility to the copolymer leading to decreased rigidity. Compared to using 4,4 $\prime$ -oxydianiline (ODA) as the sole diamine source, incorporating low cost of HMDA would increase the PIF’s flexibility and improve its processibility while making the production more cost effective. Within some range of compromised thermal and mechanical properties, this proposed method could be feasible for industrial applications.

Comparison of the properties of polyimide nanocomposite films containing functionalized-graphene and organoclay as nanofillers

Poly(amic acid) (PAA) is prepared by the reaction of dianhydride 4,4'-biphthalic anhydride and diamine bis[4-(3-aminophenoxy)phenyl]sulfone in N,N'-dimethylacetamide. Two types of fillers were dispersed in the as-synthesized PAA via a solution intercalation method; polyimide (PI) hybrid films were synthesized under various heat treatment conditions. Octylamine (C8) was introduced into graphene sheets (C8-GS) and bentonite (C8-BTN), which were then used as nanofillers in the PI hybrid films. The synthesized nanofillers were used in varying amounts of 0.25-1.00 wt% with respect to the matrix PI. The thermal and morphological properties and optical transparency of the hybrid films were investigated and compared for both C8-GS and C8-BTN at varying nanofiller content. The C8-BTN nanocomposite showed superior thermal properties, and optical transparency, and the filler was well dispersed in the PI matrix compared to the C8-GS nanocomposite. The thermal stability of the hybrid films improved upon the addition of small amounts of the nanofiller. However, beyond a certain critical filler concentration, the thermal stability declined. These results were verified through the dispersion of fillers via transmission electron microscopy.

Synthesis and Characterization of Polyimides with Naphthalene Ring Structure Introduced in the Main Chain

In this paper, a new aromatic diamine monomer 4,4'-(2,6-naphthalenediyl)bis[benzenamine]) (NADA) was synthesized and a series of modified PI films containing naphthalene ring structure obtained by controlling the molar ratio of NADA monomer, ternary polymerization with 4,4'-oxydianiline (ODA), and pyromellitic dianhydride (PMDA). The effects of the introduction of the naphthalene ring on the free volume and various properties of PI were investigated by molecular dynamic simulations. The results show that the comprehensive properties of the modified films are all improved to some extent, with 5% thermal weight loss temperature (T_d5%) of 569 °C, glass transition temperature (Tg) of 381 °C, tensile strength of 96.41 MPa, and modulus of elasticity of 2.45 GPa. Dielectric property test results show that the dielectric constant (Dk) of the film at 1 MHz is reduced from 3.21 to 2.82 and dielectric loss (Df) reduced from 0.0091 to 0.0065. It is noteworthy that the PI-1 dielectric constant is reduced from 3.26 to 3.01 at 10 GHz with only 5% NADA doping, which is expected to yield the best ratio and provide the possibility of industrial production.