Scalable Strategy to Directly Prepare 2D and 3D Liquid Metal Circuits Based on Laser-Induced Selective Metallization

Electrochemical Redox Synergism-Enhanced Liquid Metal Locomotion for Unrestricted Circuit Substrate Patterning

The critical challenge in advancing liquid metal circuits (LMCs) lies in achieving interfacial compatibility with diverse substrates while dynamically balancing fabrication efficiency and quality to ensure robust conductive stability. Here we introduce an electrochemical redox synergistic liquid metal (E-rsLM) that enables the controllable generation of diverse intermetallic bond transition layers (Cu, Au, or Fe-based) between liquid metal and unrestricted substrate surfaces, applicable in pH-universal electrolytes. It involves enhanced locomotion of the liquid metal, driven by synergistic electrochemical energy transduction from cyclic changes in gallium redox states. Characterized by expansion-contraction-expansion, it enables unique self-propelled bouncing, tuning spreading speed (up to ~26.8 mm/s) and elongation rate (up to 1192 %) with a volume of only 80 μL. Additionally, we demonstrate the adaptability of E-rsLM fabrication across 30 different substrates, highlighting its versatility. The patterning displays the superimposed efficiency and self-indicated quality, leading to superior conductivity (with time-cost savings of 30.7 % and 13.4 % in heating-cooling cycles, and a nearly 90 % reduction in output resistance). The practical viability of these circuits is further showcased by the assembly of integrated circuits, marking a significant step in expanding LMCs applications beyond laboratory-scale prototypes.

In Situ Laser Direct Writing of Graphene-Based Layered Hybrid Materials with Superhydrophilicity

Laser-induced graphene (LIG) has attracted extensive attention as an electrode material. However, it usually exhibits limited electrochemical performance in many applications due to the limited electrical conductivity and charge storage properties. Herein, we proposed a simple and environmentally friendly strategy for in situ preparation of flexible Au/LIG/PI layered hybrid materials using laser direct writing. The transformation from hydrophobic to superhydrophilic of hybrid materials was successfully achieved. At a laser power of 6.0 W during laser reirradiation, the contact angle of the prepared Au/LIG/PI layered hybrid material was 0°. Characterizations confirmed a formed continuous Au layer covered on the porous LIG skeleton with a uniform distribution. The superhydrophilicity resulting from this unique microstructure greatly enhanced the electrochemical performance of the microsupercapacitors (MSCs) designed and fabricated based on Au/LIG/PI hybrid materials. Meanwhile, this MSC demonstrated excellent flexibility due to the PI substrate. The in situ preparation of superhydrophilic Au/LIG/PI layered hybrid materials provides a strategy for improving the performance of LIG-based MSCs, thereby enhancing their application potential.

Deterministic Fabrication of Liquid Metal Nanopatterns for Nanophotonics Applications

Gallium-based liquid metals (LMs) are widely used for stretchable and reconfigurable electronics thanks to their fluidic nature and excellent conductivity. These LMs possess attractive optical properties for photonics applications as well. However, due to the high surface tension of the LMs, it is challenging to form LM nanostructures with arbitrary shapes using conventional nanofabrication techniques. As a result, LM-based nanophotonics has not been extensively explored. Here, a simple yet effective technique is demonstrated to deterministically fabricate LM nanopatterns with high yield over a large area. This technique demonstrates for the first time the capability to fabricate LM nanophotonic structures of various precisely defined shapes and sizes using two different LMs, that is, liquid gallium and liquid eutectic gallium-indium alloy. High-density arrays of LM nanopatterns with critical feature sizes down to ≈100 nm and inter-pattern spacings down to ≈100 nm are achieved, corresponding to the highest resolution of any LM fabrication technique developed to date. Additionally, the LM nanopatterns demonstrate excellent long-term stability under ambient conditions. This work paves the way toward further development of a wide range of LM nanophotonics technologies and applications.

Microconfined Assembly of High-Resolution and Mechanically Robust EGaIn Liquid Metal Stretchable Electrodes for Wearable Electronic Systems

Stretchable electrodes based on liquid metals (LM) are widely used in human-machine interfacing, wearable bioelectronics, and other emerging technologies. However, realizing the high-precision patterning and mechanical stability remains challenging due to the poor wettability of LM. Herein, a method is reported to fabricate LM-based multilayer solid-liquid electrodes (m-SLE) utilizing electrohydrodynamic (EHD) printed confinement template. In these electrodes, LM self-assembled onto these high-resolution templates, assisted by selective wetting on the electrodeposited Cu layer. This study shows that a m-SLE composed of PDMS/Ag/Cu/EGaIn exhibits line width of ≈20 µm, stretchability of ≈100%, mechanical stability ≈10 000 times (stretch/relaxation cycles), and recyclability. The multi-layer structure of m-SLE enables the adjustability of strain sensing, in which the strain-sensitive Ag part can be used for non-distributed detection in human health monitoring and the strain-insensitive EGaIn part can be used as interconnects. In addition, this study demonstrates that near field communication (NFC) devices and multilayer displays integrated by m-SLEs exhibit stable wireless signal transmission capability and stretchability, suggesting its applicability in creating highly-integrated, large-scale commercial, and recyclable wearable electronics.

Fast and Facile Liquid Metal Printing via Projection Lithography for Highly Stretchable Electronic Circuits

Soft electronic circuits are crucial for wearable electronics, biomedical technologies, and soft robotics, requiring soft conductive materials with high conductivity, high strain limit, and stable electrical performance under deformation. Liquid metals (LMs) have become attractive candidates with high conductivity and fluidic compliance, while effective manufacturing methods are demanded. Digital light processing (DLP)-based projection lithography is a high-resolution and high-throughput printing technique for primarily polymers and some metals. If LMs can be printed with DLP as well, the entire soft devices can be fabricated by one printer in a streamlined and highly efficient process. Herein, fast and facile DLP-based LM printing is achieved. Simply with 5-10 s of patterned ultraviolet (UV)-light exposure, a highly conductive and stretchable pattern can be printed using a photo-crosslinkable LM particle ink. The printed eutectic gallium indium traces feature high resolution (≈20 µm), conductivity (3 × 106 S m-1), stretchability (≈2500%), and excellent stability (consistent performance at different deformation). Various patterns are printed in diverse material systems for broad applications including stretchable displays, epidermal strain sensors, heaters, humidity sensors, conformal electrodes for electrography, and multi-layer actuators. The facile and scalable process, excellent performance, and diverse applications ensure its broad impact on soft electronic manufacturing.

Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing

Direct Laser Writing (DLW) has been increasingly selected as a microfabrication route for efficient, cost-effective, high-resolution material synthesis and conversion. Concurrently, lasers participate in the patterning and assembly of functional geometries in several fields of application, of which electronics stand out. In this review, recent advances and strategies based on DLW for electronics microfabrication are surveyed and outlined, based on laser material growth strategies. First, the main DLW parameters influencing material synthesis and transformation mechanisms are summarized, aimed at selective, tailored writing of conductive and semiconducting materials. Additive and transformative DLW processing mechanisms are discussed, to open space to explore several categories of materials directly synthesized or transformed for electronics microfabrication. These include metallic conductors, metal oxides, transition metal chalcogenides and carbides, laser-induced graphene, and their mixtures. By accessing a wide range of material types, DLW-based electronic applications are explored, including processing components, energy harvesting and storage, sensing, and bioelectronics. The expanded capability of lasers to participate in multiple fabrication steps at different implementation levels, from material engineering to device processing, indicates their future applicability to next-generation electronics, where more accessible, green microfabrication approaches integrate lasers as comprehensive tools.

Recent progress in multifunctional, reconfigurable, integrated liquid metal-based stretchable sensors and standalone systems

Possessing a unique combination of properties that are traditionally contradictory in other natural or synthetical materials, Ga-based liquid metals (LMs) exhibit low mechanical stiffness and flowability like a liquid, with good electrical and thermal conductivity like metal, as well as good biocompatibility and room-temperature phase transformation. These remarkable properties have paved the way for the development of novel reconfigurable or stretchable electronics and devices. Despite these outstanding properties, the easy oxidation, high surface tension, and low rheological viscosity of LMs have presented formidable challenges in high-resolution patterning. To address this challenge, various surface modifications or additives have been employed to tailor the oxidation state, viscosity, and patterning capability of LMs. One effective approach for LM patterning is breaking down LMs into microparticles known as liquid metal particles (LMPs). This facilitates LM patterning using conventional techniques such as stencil, screening, or inkjet printing. Judiciously formulated photo-curable LMP inks or the introduction of an adhesive seed layer combined with a modified lift-off process further provide the micrometer-level LM patterns. Incorporating porous and adhesive substrates in LM-based electronics allows direct interfacing with the skin for robust and long-term monitoring of physiological signals. Combined with self-healing polymers in the form of substrates or composites, LM-based electronics can provide mechanical-robust devices to heal after damage for working in harsh environments. This review provides the latest advances in LM-based composites, fabrication methods, and their novel and unique applications in stretchable or reconfigurable sensors and resulting integrated systems. It is believed that the advancements in LM-based material preparation and high-resolution techniques have opened up opportunities for customized designs of LM-based stretchable sensors, as well as multifunctional, reconfigurable, highly integrated, and even standalone systems.

Shaping a Soft Future: Patterning Liquid Metals

This review highlights the unique techniques for patterning liquid metals containing gallium (e.g., eutectic gallium indium, EGaIn). These techniques are enabled by two unique attributes of these liquids relative to solid metals: 1) The fluidity of the metal allows it to be injected, sprayed, and generally dispensed. 2) The solid native oxide shell allows the metal to adhere to surfaces and be shaped in ways that would normally be prohibited due to surface tension. The ability to shape liquid metals into non-spherical structures such as wires, antennas, and electrodes can enable fluidic metallic conductors for stretchable electronics, soft robotics, e-skins, and wearables. The key properties of these metals with a focus on methods to pattern liquid metals into soft or stretchable devices are summari.

Surface-Embedded Liquid Metal Electrodes with Abrasion Resistance via Direct Magnetic Printing

Gallium-based liquid metals (LMs) featuring both high conductivity and fluidity are ideal conductors for soft and stretchable electronics. However, their liquid nature is a double-edged sword in many key applications since LMs are inherently prone to mechanical damage. Although additional encapsulation is frequently used for the protection of delicate LM electrodes, it hinders the electrical interfacing with other objects for interconnection, sensing, and stimulation. Here, different from conventional patterning methods that deposit LM on or inside substrates, we for the first time report a simple strategy to create surface-embedded LM of eutectic gallium-indium (EGaIn) circuits with mechanical damage endurance. This was achieved by using direct magnetic printing to overcome the high surface tension of LM, allowing it to be passively filled into the laser-patterned microgrooves on soft substrates. We show that the surface-embedded LM circuits are resistant to mechanical erasure, washing, and peeling. We also show the applications of our surface-embedded LM electrodes in respiration monitoring and electrical stimulation of nerves. This work provides a simple and efficient way to create mechanically reliable LM microelectrodes, holding great promise for wearable and implantable bioelectronics.