|
51
|
Huerta Garrido M, Pritzker M. EIS and statistical analysis of copper electrodeposition accounting for multi-component transport and reactions. J Electroanal Chem (Lausanne) 2006. [DOI: 10.1016/j.jelechem.2006.05.026] [Citation(s) in RCA: 22] [Impact Index Per Article: 1.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/29/2022]
|
|
52
|
BaŞol BM, Uzoh CE, Talieh H, Wang T, Guo G, Erdemli S, Cornejo M, Bogart J, Basol EC. PLANAR COPPER PLATING AND ELECTROPOLISHING TECHNIQUES. CHEM ENG COMMUN 2006. [DOI: 10.1080/00986440500267410] [Citation(s) in RCA: 3] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/24/2022]
|
|
53
|
Gabrielli C, Moçotéguy P, Perrot H, Nieto-Sanz D, Zdunek A. A model for copper deposition in the damascene process. Electrochim Acta 2006. [DOI: 10.1016/j.electacta.2005.02.127] [Citation(s) in RCA: 53] [Impact Index Per Article: 2.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/25/2022]
|
|
54
|
Calculation of the current density distribution of submicron copper electroplating based on uneven adsorption of poly(ethylene glycol). J APPL ELECTROCHEM 2005. [DOI: 10.1007/s10800-004-7274-5] [Citation(s) in RCA: 3] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/25/2022]
|
|
55
|
Impurity Incorporation during Copper Electrodeposition in the Curvature-Enhanced Accelerator Coverage Regime. ACTA ACUST UNITED AC 2005. [DOI: 10.1149/1.1922872] [Citation(s) in RCA: 21] [Impact Index Per Article: 1.1] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
|
|
56
|
|
|
57
|
Additive-Free Superfilling in Damascene Cu Electrodeposition Using Microcontact Printing. ACTA ACUST UNITED AC 2004. [DOI: 10.1149/1.1778932] [Citation(s) in RCA: 6] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
|
|
58
|
Drews TO, Webb EG, Ma DL, Alameda J, Braatz RD, Alkire RC. Coupled mesoscale?continuum simulations of copper electrodeposition in a trench. AIChE J 2004. [DOI: 10.1002/aic.10021] [Citation(s) in RCA: 43] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/07/2022]
|
|
59
|
|
|
60
|
Bottom-Up Fill of Copper in Deep Submicrometer Holes by Electroless Plating. ACTA ACUST UNITED AC 2004. [DOI: 10.1149/1.1707029] [Citation(s) in RCA: 75] [Impact Index Per Article: 3.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
|
|
61
|
|
|
62
|
Padhi D, Gandikota S, Nguyen HB, McGuirk C, Ramanathan S, Yahalom J, Dixit G. Electrodeposition of copper–tin alloy thin films for microelectronic applications. Electrochim Acta 2003. [DOI: 10.1016/s0013-4686(02)00774-0] [Citation(s) in RCA: 34] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/24/2022]
|
|
63
|
Baker BC, Witt C, Wheeler D, Josell D, Moffat TP. Superconformal Silver Deposition Using KSeCN Derivatized Substrates. ACTA ACUST UNITED AC 2003. [DOI: 10.1149/1.1561280] [Citation(s) in RCA: 41] [Impact Index Per Article: 1.9] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
|
|
64
|
|
|
65
|
Interactions Between Brightener and Chloride Ions on Copper Electroplating for Laser-Drilled Via-Hole Filling. ACTA ACUST UNITED AC 2003. [DOI: 10.1149/1.1595311] [Citation(s) in RCA: 84] [Impact Index Per Article: 3.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
|
|
66
|
Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers. ACTA ACUST UNITED AC 2003. [DOI: 10.1149/1.1605271] [Citation(s) in RCA: 131] [Impact Index Per Article: 6.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
|
|
67
|
Modeling Pattern Density Dependent Bump Formation in Copper Electrochemical Deposition. ACTA ACUST UNITED AC 2003. [DOI: 10.1149/1.1541256] [Citation(s) in RCA: 22] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
|
|
68
|
Effects of Leveler on the Trench Filling during Damascene Copper Plating. JOURNAL OF THE KOREAN ELECTROCHEMICAL SOCIETY 2002. [DOI: 10.5229/jkes.2002.5.3.153] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.1] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/15/2022]
|
|
69
|
Moffat TP, Wheeler D, Witt C, Josell D. Superconformal Electrodeposition Using Derivitized Substrates. ACTA ACUST UNITED AC 2002. [DOI: 10.1149/1.1521290] [Citation(s) in RCA: 62] [Impact Index Per Article: 2.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
|
|
70
|
Superconformal Deposition by Surfactant-Catalyzed Chemical Vapor Deposition. ACTA ACUST UNITED AC 2002. [DOI: 10.1149/1.1449304] [Citation(s) in RCA: 26] [Impact Index Per Article: 1.1] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022]
|
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71
|
|
|
72
|
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