A Flash-Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin-Film μLEDs

Flexible, surface-lighting MicroLED skin patch for multiple human skincare

As the global population ages, concerns regarding aesthetic appearance have increased. Wearable light-emitting diode (LED) devices have received significant attention in the cosmetic fields due to their non-invasive, non-thermal, home-use characteristics. However, conventional bulk LED chips have limitations in flexibility and uniform irradiation, hindering efficient light penetration into the skin. Here, we introduce a flexible, surface-lighting microLED (FSLED) patch with uniform light-emission for various skincare applications. The FSLED was fabricated using a pick-and-place transfer technique, which allows for high-density irradiation over the large area, while maintaining outstanding mechanical flexibility. In addition, the FSLED was designed to deliver light efficiently and emit light evenly by conforming to the skin. Finally, we prove the effect of the FSLED for pore tightening and skin rejuvenation through clinical trials.

Oxidation-Resistant Cu-Based Nanowire Transparent Electrodes Activated by an Exothermic Reduction Reaction

This article describes an approach to making highly stable copper nanowire networks on any type of substrates. These nanostructured materials are highly sought after for, among other applications, the development of next-generation flexible electronics. Their high susceptibility to oxidation in air currently limits their use in the real world. Here, we develop a multistep chemical method to fabricate transparent electrodes (TEs) using Cu-based bimetallic NW networks on various substrates at room temperature. First, we synthesized homogeneous core@shell copper@nickel (Cu@Ni) NWs using a one-pot colloidal approach. After their deposition on a substrate, we exploited the exothermic nature of the reaction between the Ni oxide and hydrazine to eliminate the naturally formed metal oxide moieties and interlock the NW junctions of the network. Electrical measurements, at the single junction level, indicate that the exothermic reaction induces a reduction of resistance by up to 4 orders of magnitude. On a macroscopic scale, the resulting Cu-based NW networks feature an optical transmittance of 80% in the visible region and a sheet resistance of 10 Ω/sq with a record stability of over 2 years. This process offers a simple and efficient strategy for fabricating cost-effective, long-life electronic devices, as illustrated by a proof-of-concept integrating an optimized Cu@Ni-based TE as a flexible transparent heater.

Regeneration of Antifog Performance of Laser-Induced Copper-Based Micro-Nano Structured Surfaces by Rapid Thermal Treatment

In this investigation, the laser marker ablation technique was employed on Cu-coated glass to fabricate micro-nanostructured antifog glass. The resulting surfaces exhibited a quasi-periodic micron hillock-hollow structure with dispersed nanoparticles distributed throughout, which played a role in the antifog property and superhydrophilicity. However, airborne organic pollutant deposition degraded the superhydrophilicity of ablated glass surfaces and, therefore, their antifog performance, which cannot be circumvented. Conventionally, furnace annealing for at least 1 h was used to decompose the organic pollutants and restore the superhydrophilicity, limiting the throughput and application scenario. Remarkably, the rapid regeneration of this property was achieved through either a 5 min rapid thermal treatment at 400 °C or a 1 s flame treatment. These are interventions that are hitherto unreported. Such short and simple treatment methods underscore the potential of laser-ablated glass for diverse practical applications.

Light-Material Interactions Using Laser and Flash Sources for Energy Conversion and Storage Applications

This review provides a comprehensive overview of the progress in light-material interactions (LMIs), focusing on lasers and flash lights for energy conversion and storage applications. We discuss intricate LMI parameters such as light sources, interaction time, and fluence to elucidate their importance in material processing. In addition, this study covers various light-induced photothermal and photochemical processes ranging from melting, crystallization, and ablation to doping and synthesis, which are essential for developing energy materials and devices. Finally, we present extensive energy conversion and storage applications demonstrated by LMI technologies, including energy harvesters, sensors, capacitors, and batteries. Despite the several challenges associated with LMIs, such as complex mechanisms, and high-degrees of freedom, we believe that substantial contributions and potential for the commercialization of future energy systems can be achieved by advancing optical technologies through comprehensive academic research and multidisciplinary collaborations.

Crystallization of piezoceramic films on glass via flash lamp annealing

Integration of thin-film oxide piezoelectrics on glass is imperative for the next generation of transparent electronics to attain sensing and actuating functions. However, their crystallization temperature (above 650 °C) is incompatible with most glasses. We developed a flash lamp process for the growth of piezoelectric lead zirconate titanate films. The process enables crystallization on various types of glasses in a few seconds only. The functional properties of these films are comparable to the films processed with standard rapid thermal annealing at 700 °C. A surface haptic device was fabricated with a 1 μm-thick film (piezoelectric e33,f of -5 C m-2). Its ultrasonic surface deflection reached 1.5 μm at 60 V, sufficient for its use in surface rendering applications. This flash lamp annealing process is compatible with large glass sheets and roll-to-roll processing and has the potential to significantly expand the applications of piezoelectric devices on glass.

Universal selective transfer printing via micro-vacuum force

Transfer printing of inorganic thin-film semiconductors has attracted considerable attention to realize high-performance soft electronics on unusual substrates. However, conventional transfer technologies including elastomeric transfer printing, laser-assisted transfer, and electrostatic transfer still have challenging issues such as stamp reusability, additional adhesives, and device damage. Here, a micro-vacuum assisted selective transfer is reported to assemble micro-sized inorganic semiconductors onto unconventional substrates. 20 μm-sized micro-hole arrays are formed via laser-induced etching technology on a glass substrate. The vacuum controllable module, consisting of a laser-drilled glass and hard-polydimethylsiloxane micro-channels, enables selective modulation of micro-vacuum suction force on microchip arrays. Ultrahigh adhesion switchability of 3.364 × 106, accomplished by pressure control during the micro-vacuum transfer procedure, facilitates the pick-up and release of thin-film semiconductors without additional adhesives and chip damage. Heterogeneous integration of III-V materials and silicon is demonstrated by assembling microchips with diverse shapes and sizes from different mother wafers on the same plane. Multiple selective transfers are implemented by independent pressure control of two separate vacuum channels with a high transfer yield of 98.06%. Finally, flexible micro light-emitting diodes and transistors with uniform electrical/optical properties are fabricated via micro-vacuum assisted selective transfer.

Preparation of Dispersed Copper(II) Oxide Nanosuspensions as Precursor for Femtosecond Reductive Laser Sintering by High-Energy Ball Milling

This contribution demonstrates and discusses the preparation of finely dispersed copper(II) oxide nanosuspensions as precursors for reductive laser sintering (RLS). Since the presence of agglomerates interferes with the various RLS sub-processes, fine dispersion is required, and oversized particles must be identified by a measurement methodology. Aside from the established method of scanning electron microscopy for imaging individual dried particles, this work applies the holistic and statistically more significant laser diffraction in combination with dynamic image analysis in wet dispersion. In addition to direct ultrasonic homogenization, high-energy ball milling is introduced for RLS, to produce stable nanosuspensions with a high fine fraction, and, above all, the absence of oversize particles. Whereas ultrasonic dispersion stagnates at particle sizes between 500 nm and 20 μm, even after 8 h, milled suspension contains a high proportion of finest particles with diameters below 100 nm, no agglomerates larger than 1 μm and a trimodal particle size distribution with the median at 50 nm already, after 100 min of milling. The precursor layers produced by doctor blade coating are examined for their quality by laser scanning microscopy. The surface roughness of such a dry film can be reduced from 1.26 μm to 88 nm by milling. Finally, the novel precursor is used for femtosecond RLS, to produce homogeneous, high-quality copper layers with a sheet resistance of 0.28Ω/sq and a copper mass concentration of 94.2%.

Flash-Induced High-Throughput Porous Graphene via Synergistic Photo-Effects for Electromagnetic Interference Shielding

Porous 2D materials with high conductivity and large surface area have been proposed for potential electromagnetic interference (EMI) shielding materials in future mobility and wearable applications to prevent signal noise, transmission inaccuracy, system malfunction, and health hazards. Here, we report on the synthesis of lightweight and flexible flash-induced porous graphene (FPG) with excellent EMI shielding performance. The broad spectrum of pulsed flashlight induces photo-chemical and photo-thermal reactions in polyimide films, forming 5 × 10 cm2-size porous graphene with a hollow pillar structure in a few milliseconds. The resulting material demonstrated low density (0.0354 g cm-3) and outstanding absolute EMI shielding effectiveness of 1.12 × 105 dB cm2 g-1. The FPG was characterized via thorough material analyses, and its mechanical durability and flexibility were confirmed by a bending cycle test. Finally, the FPG was utilized in drone and wearable applications, showing effective EMI shielding performance for internal/external EMI in a drone radar system and reducing the specific absorption rate in the human body.

Siloxane Hybrid Material-Encapsulated Highly Robust Flexible μLEDs for Biocompatible Lighting Applications

Flexible micro-light-emitting diodes (f-μLEDs) have been regarded as an attractive light source for the next-generation human-machine interfaces, thanks to their noticeable optoelectronic performances. However, when it comes to their practical utilizations fulfilling industrial standards, there have been unsolved reliability and durability issues of the f-μLEDs, despite previous developments in the high-performance f-μLEDs for various applications. Herein, highly robust flexible μLEDs (f-HμLEDs) with 20 × 20 arrays, which are realized by a siloxane-based organic-inorganic hybrid material (SHM), are reported. The f-HμLEDs are created by combining the f-μLED fabrication process with SHM synthesis procedures (i.e., sol-gel reaction and successive photocuring). The outstanding mechanical, thermal, and environmental stabilities of our f-HμLEDs are confirmed by a host of experimental and theoretical examinations, including a bending fatigue test (10⁵ bending/unbending cycles), a lifetime accelerated stress test (85 °C and 85% relative humidity), and finite element method simulations. Eventually, to demonstrate the potential of our f-HμLEDs for practical applications of flexible displays and/or biomedical devices, their white light emission due to quantum dot-based color conversion of blue light emitted by GaN-based f-HμLEDs is demonstrated, and the biocompatibility of our f-HμLEDs is confirmed via cytotoxicity and cell proliferation tests with muscle, bone, and neuron cell lines. As far as we can tell, this work is the first demonstration of the flexible μLED encapsulation platform based on the SHM, which proved its mechanical, thermal, and environmental stabilities and biocompatibility, enabling us to envisage biomedical and/or flexible display applications using our f-HμLEDs.

Implantable Micro-Light-Emitting Diode (µLED)-based optogenetic interfaces toward human applications

Optogenetics has received wide attention in biomedical fields because of itsadvantages in temporal precision and spatial resolution. Beyond contributions to important advances in fundamental research, optogenetics is inspiring a shift towards new methods of improving human well-being and treating diseases. Soft, flexible and biocompatible systems using µLEDs as a light source have been introduced to realize brain-compatible optogenetic implants, but there are still many technical challenges to overcome before their human applications. In this review, we address progress in the development of implantable µLED probes and recent achievements in (i) device engineering design, (ii) driving power, (iii) multifunctionality and (iv) closed-loop systems. (v) Expanded optogenetic applications based on remarkable advances in µLED implants will also be discussed.

Mechanically Guided Hierarchical Assembly of 3D Mesostructures

3D, hierarchical micro/nanostructures formed with advanced functional materials are of growing interest due to their broad potential utility in electronics, robotics, battery technology, and biomedical engineering. Among various strategies in 3D micro/nanofabrication, a set of methods based on compressive buckling offers wide-ranging material compatibility, fabrication scalability, and precise process control. Previously reports on this type of approach rely on a single, planar prestretched elastomeric platform to transform thin-film precursors with 2D layouts into 3D architectures. The simple planar configuration of bonding sites between these precursors and their assembly substrates prevents the realization of certain types of complex 3D geometries. In this paper, a set of hierarchical assembly concepts is reported that leverage multiple layers of prestretched elastomeric substrates to induce not only compressive buckling of 2D precursors bonded to them but also of themselves, thereby creating 3D mesostructures mounted at multiple levels of 3D frameworks with complex, elaborate configurations. Control over strains used in these processes provides reversible access to multiple different 3D layouts in a given structure. Examples to demonstrate these ideas through both experimental and computational results span vertically aligned helices to closed 3D cages, selected for their relevance to 3D conformal bio-interfaces and multifunctional microsystems.

Multi-Bandgap Monolithic Metal Nanowire Percolation Network Sensor Integration by Reversible Selective Laser-Induced Redox

Active electronics are usually composed of semiconductor and metal electrodes which are connected by multiple vacuum deposition steps and photolithography patterning. However, the presence of interface of dissimilar material between semiconductor and metal electrode makes various problems in electrical contacts and mechanical failure. The ideal electronics should not have defective interfaces of dissimilar materials. In this study, we developed a novel method to fabricate active electronic components in a monolithic seamless fashion where both metal and semiconductor can be prepared from the same monolith material without creating a semiconductor-metal interface by reversible selective laser-induced redox (rSLIR) method. Furthermore, rSLIR can control the oxidation state of transition metal (Cu) to yield semiconductors with two different bandgap states (Cu₂O and CuO with bandgaps of 2.1 and 1.2 eV, respectively), which may allow multifunctional sensors with multiple bandgaps from the same materials. This novel method enables the seamless integration of single-phase Cu, Cu₂O, and CuO, simultaneously while allowing reversible, selective conversion between oxidation states by simply shining laser light. Moreover, we fabricated a flexible monolithic metal-semiconductor-metal multispectral photodetector that can detect multiple wavelengths. The unique monolithic characteristics of rSLIR process can provide next-generation electronics fabrication method overcoming the limitation of conventional photolithography methods.

Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging

Advancements in production techniques in PCB manufacturing industries are still required as compared to silicon-ICs fabrications. One of the concerned areas in PCBs fabrication is the use of conventional methodologies for metallization. Most of the manufacturers are still using the traditional Copper (Cu) laminates on the base substrate and patterning the structures using lithography processes. As a result, significant amounts of metallic parts are etched away during any mass production process, causing unnecessary disposables leading to pollution. In this work, a new approach for Cu metallization is demonstrated with considerable step-reducing pattern-transfer mechanism. In the fabrication steps, a seed layer of covalent bonded metallization (CBM) chemistry on top of a dielectric epoxy resin is polymerized using actinic radiation intensity of a 375 nm UV laser source. The proposed method is capable of patterning any desirable geometries using the above-mentioned surface modification followed by metallization. To metallize the patterns, a proprietary electroless bath has been used. The metallic layer grows only on the selective polymer-activated locations and thus is called selective metallization. The highlight of this production technique is its occurrence at a low temperature (20–45 °C). In this paper, FR-4 as a base substrate and polyurethane (PU) as epoxy resin were used to achieve various geometries, useful in electronics packaging. In addition, analysis of the process parameters and some challenges witnessed during the process development are also outlined. As a use case, a planar inductor is fabricated to demonstrate the application of the proposed technique.