Study on Vibration Transmission and Interfacial Fusion in Ultrasonic Bonding Process for Thermoplastic Micro Joint

Current and Future Trends for Polymer Micro/Nanoprocessing in Industrial Applications

Polymers are widely used in optical devices, electronic devices, energy-harvesting/storage devices, and sensors, owing to their low weight, excellent flexibility, and simple fabrication process. With advancements in micro/nanoprocessing techniques and more demanding application requirements, it is becoming necessary to realize high-resolution fabrication of polymers to prepare miniaturized devices. This is particularly because conventional processing technologies suffer from high thermal stress and strong adhesion/friction, which can irreversibly damage the micro/nanostructures of miniaturized devices. In addition, although the use of advanced fabrication methods to prepare high-resolution micro/nanostructures is explored, these methods are limited to laboratory research or small-batch production. This review focuses on the micro/nanoprocessing of polymeric materials and devices with high spatial precision and replication accuracy for industrial applications. Specifically, the current state-of-the-art techniques and future trends for micro/nanomolding, high-energy beam processing, and micro/nanomachining are discussed. Moreover, an overview of the fabrication and applications of various polymer-based elements and devices such as microlenses, biosensors, and transistors is provided. These techniques are expected to be widely applied for multiscale and multimaterial processing as well as for multifunction integration in next-generation integrated devices, such as photoelectric, smart, and biodegradable devices.

Promotion of Interface Fusion of Solid Polymer Electrolyte and Cathode by Ultrasonic Vibration

All-solid-state polymer lithium batteries have good safety, stability, and high energy densities and are employed in wireless sensors. However, the solid contact between the polymer electrolyte and the cathode leads to high interface resistance, limiting the broad application of solid-state lithium batteries. This paper proposes an ultrasonic fusion method to reduce the interface resistance between the polymer electrolyte and the cathode. The method applied a high-frequency ultrasonic vibration technique to impact the polymer electrolyte/cathode structure, melting the electrolyte at the interface and thus generating good contact at the interface. The experimental results showed that the ultrasonic fusion method decreased the interface resistance between the polymer electrolyte and the cathode by 96.2%. During the ultrasonic fusion process, high-frequency ultrasonic vibrations generated high temperatures at the interface, and the polymer electrolyte became molten, improving the contact between the electrolyte and the cathode. The ultrasonic fusion method eliminated the gaps at the interface, and the interface became more compact. Furthermore, ultrasonic vibrations made the molten electrolyte fill the holes in the cathode, and the contact area was enhanced, providing more Li⁺ ions transmission paths.

Ultrasonic vibration used for improving interfacial adhesion strength between metal substrate and high-aspect-ratio thick SU-8 photoresist mould

The fabrication of high-aspect-ratio metal micro device on metal substrate is largely limited by its poor interfacial adhesion strength between metal substrate and thick SU-8 photoresist mould. In this paper, ultrasonic treatment is introduced to improve the interfacial adhesion strength between metal substrate and a high-aspect-ratio inertial switch SU-8 mould. Firstly, a device for ultrasonic treatment was developed, ultrasonic vibration is applied to SU-8 film after post exposure baking in order to improve the interfacial adhesion strength. Compared with the traditional one, SU-8 photoresist mould treated by ultrasonic vibration can effectively improve the interfacial adhesion strength. After 90 min cavitation erosion test, SU-8 film treated by ultrasonic vibration remains 34.4% relative to nothing left of the SU-8 film without ultrasonic treatment. Besides, the mechanisms of ultrasonic treatment on improving interfacial adhesion strength are investigated. Finally, an inertial switch is successfully fabricated on metallic substrate with the ultrasonic treated SU-8 photoresist mould.