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Zhang S, Xu L, Gao S, Hu P, Liu J, Zeng J, Li Z, Zhai P, Liu L, Cai L, Liu J. Schottky barrier reduction on optoelectronic responses in heavy ion irradiated WSe 2 memtransistors. NANOSCALE 2024. [PMID: 38647227 DOI: 10.1039/d4nr00011k] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 04/25/2024]
Abstract
Two-dimensional transition metal dichalcogenide-based memtransistors provide simulation, sensing, and storage capabilities for applications in a remotely operated aerospace environment. Swift heavy ion (SHI) irradiation technology is a common method to simulate the influences of radiation ions on electronic devices in space environments. Here, SHI irradiation technology under different conditions was utilized to produce complex defects in WSe2-based memtransistors. Low-resistance state to low-resistance state (LRS-LRS) switching behaviors under light illumination were achieved and photocurrent responses with different spike trains were observed in SHI-irradiated memtransistors, which facilitated the design of devices with enriched analog functions. Reduction of the Schottky barrier height due to the introduced defects at the metal/WSe2 interface was confirmed to be the major factor responsible for the observed behaviors. 1T phase and concentric circle-type vacancies were also created in the SHI-irradiated 2H-WSe2 channel besides the amorphous structure; these complex defects could seriously affect the transport properties of the devices. We believe that this work serves as a foundation for aerospace radiation applications of all-in-one devices. It also opens a new application field of heavy ion irradiation technology for the development of multiterminal memtransistor-based optoelectronic artificial synapses for neuromorphic computing.
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Affiliation(s)
- Shengxia Zhang
- Materials Research Center, Institute of Modern Physics, Chinese Academy of Sciences (CAS), Lanzhou, 730000, P. R. China.
- University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Lijun Xu
- Materials Research Center, Institute of Modern Physics, Chinese Academy of Sciences (CAS), Lanzhou, 730000, P. R. China.
| | - Shifan Gao
- Materials Research Center, Institute of Modern Physics, Chinese Academy of Sciences (CAS), Lanzhou, 730000, P. R. China.
- Northwest Normal University, Lanzhou, 730070, P. R. China
| | - Peipei Hu
- Materials Research Center, Institute of Modern Physics, Chinese Academy of Sciences (CAS), Lanzhou, 730000, P. R. China.
| | - Jiande Liu
- Materials Research Center, Institute of Modern Physics, Chinese Academy of Sciences (CAS), Lanzhou, 730000, P. R. China.
| | - Jian Zeng
- Materials Research Center, Institute of Modern Physics, Chinese Academy of Sciences (CAS), Lanzhou, 730000, P. R. China.
| | - Zongzhen Li
- Materials Research Center, Institute of Modern Physics, Chinese Academy of Sciences (CAS), Lanzhou, 730000, P. R. China.
| | - Pengfei Zhai
- Materials Research Center, Institute of Modern Physics, Chinese Academy of Sciences (CAS), Lanzhou, 730000, P. R. China.
| | - Li Liu
- Materials Research Center, Institute of Modern Physics, Chinese Academy of Sciences (CAS), Lanzhou, 730000, P. R. China.
| | - Li Cai
- Materials Research Center, Institute of Modern Physics, Chinese Academy of Sciences (CAS), Lanzhou, 730000, P. R. China.
| | - Jie Liu
- Materials Research Center, Institute of Modern Physics, Chinese Academy of Sciences (CAS), Lanzhou, 730000, P. R. China.
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Ansari S, Bianconi S, Kang CM, Mohseni H. From Material to Cameras: Low-Dimensional Photodetector Arrays on CMOS. SMALL METHODS 2024; 8:e2300595. [PMID: 37501320 DOI: 10.1002/smtd.202300595] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/08/2023] [Revised: 06/25/2023] [Indexed: 07/29/2023]
Abstract
The last two decades have witnessed a dramatic increase in research on low-dimensional material with exceptional optoelectronic properties. While low-dimensional materials offer exciting new opportunities for imaging, their integration in practical applications has been slow. In fact, most existing reports are based on single-pixel devices that cannot rival the quantity and quality of information provided by massively parallelized mega-pixel imagers based on complementary metal-oxide semiconductor (CMOS) readout electronics. The first goal of this review is to present new opportunities in producing high-resolution cameras using these new materials. New photodetection methods and materials in the field are presented, and the challenges involved in their integration on CMOS chips for making high-resolution cameras are discussed. Practical approaches are then presented to address these challenges and methods to integrate low-dimensional material on CMOS. It is also shown that such integrations could be used for ultra-low noise and massively parallel testing of new material and devices. The second goal of this review is to present the colossal untapped potential of low-dimensional material in enabling the next-generation of low-cost and high-performance cameras. It is proposed that low-dimensional materials have the natural ability to create excellent bio-inspired artificial imaging systems with unique features such as in-pixel computing, multi-band imaging, and curved retinas.
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Affiliation(s)
- Samaneh Ansari
- Electrical and Computer Engneering Department, Northwestern University, Evanston, IL, 60208, USA
| | - Simone Bianconi
- Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA, 91109, USA
| | - Chang-Mo Kang
- Photonic Semiconductor Research Center, Korea Photonics Technology Institute, Gwangju, 61007, Republic of Korea
| | - Hooman Mohseni
- Electrical and Computer Engneering Department, Northwestern University, Evanston, IL, 60208, USA
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Kim SM, Chang YR, Lee YJ. Single-detector double-beam modulation for high-sensitivity infrared spectroscopy. Sci Rep 2023; 13:18231. [PMID: 37880230 PMCID: PMC10600177 DOI: 10.1038/s41598-023-44740-0] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 08/09/2023] [Accepted: 10/11/2023] [Indexed: 10/27/2023] Open
Abstract
Balanced detection based on double beams is widely used to reduce common-mode noises, such as laser intensity fluctuation and irregular wavelength scanning, in absorption spectroscopy. However, employing an additional detector can increase the total system noise due to added non-negligible thermal noise of the detector, particularly with mid-infrared (IR) detectors. Herein, we demonstrate a new optical method based on double-beam modulation (DBM) that uses a single-element detector but keeps the advantage of double-beam balanced detection. The sample and reference path beams were modulated out-of-phase with each other at a high frequency, and their average and difference signals were measured by two lock-in amplifiers and converted into absorbance. DBM was coupled with our previously reported solvent absorption compensation (SAC) method to eliminate the IR absorption contribution of water in aqueous solutions. The DBM-SAC method enabled us to acquire IR absorption spectra of bovine serum albumin solutions down to 0.02 mg/mL. We investigated the noise characteristics of DBM measurements when the wavelength was either fixed or scanned. The results demonstrate that DBM can lower the limit of detection by ten times compared to the non-modulation method.
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Affiliation(s)
- Seong-Min Kim
- Biosystems and Biomaterials Division, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA
| | - Yow-Ren Chang
- Biosystems and Biomaterials Division, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA
| | - Young Jong Lee
- Biosystems and Biomaterials Division, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA.
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Low-Dimensional Layered Light-Sensitive Memristive Structures for Energy-Efficient Machine Vision. ELECTRONICS 2022. [DOI: 10.3390/electronics11040619] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 02/04/2023]
Abstract
Layered two-dimensional (2D) and quasi-zero-dimensional (0D) materials effectively absorb radiation in the wide ultraviolet, visible, infrared, and terahertz ranges. Photomemristive structures made of such low-dimensional materials are of great interest for creating optoelectronic platforms for energy-efficient storage and processing of data and optical signals in real time. Here, photosensor and memristor structures based on graphene, graphene oxide, bismuth oxyselenide, and transition metal dichalcogenides are reviewed from the point of view of application in broadband image recognition in artificial intelligence systems for autonomous unmanned vehicles, as well as the compatibility of the formation of layered neuromorphic structures with CMOS technology.
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Wei M, Zhang D, Zhang L, Jin L, Zhang H. High-Performance Multifunctional Photodetector and THz Modulator Based on Graphene/TiO 2/p-Si Heterojunction. NANOSCALE RESEARCH LETTERS 2021; 16:134. [PMID: 34417916 PMCID: PMC8380209 DOI: 10.1186/s11671-021-03589-w] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 04/19/2021] [Accepted: 08/04/2021] [Indexed: 06/13/2023]
Abstract
In this paper, we have reported a multifunctional device from graphene/TiO2/p-Si heterojunction, followed by its systematical analysis of optical response in a device under ultraviolet-visible-infrared band and transmission changes of terahertz waves in the 0.3-1.0 THz band under different bias voltages. It is found that photodetector in the "back-to-back" p-n-p energy band structure has a seriously unbalanced distribution of photogenerated carriers in the vertical direction when light is irradiated from the graphene side. So this ensures a higher optical gain of the device in the form of up to 3.6 A/W responsivities and 4 × 1013 Jones detectability under 750 nm laser irradiation. Besides, the addition of TiO2 layer in this terahertz modulator continuously widens the carrier depletion region under negative bias, thereby realizing modulation of the terahertz wave, making the modulation depth up to 23% under - 15 V bias. However, almost no change is observed in the transmission of terahertz wave when a positive bias is applied. A similar of an electronic semiconductor diode is observed that only allows the passage of terahertz wave for negative bias and blocks the positive ones.
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Affiliation(s)
- Miaoqing Wei
- School of Electronic Science and Engineering (National Exemplary School of Microelectronics), University of Electronic Science and Technology of China, Chengdu, 611731 China
| | - Dainan Zhang
- School of Electronic Science and Engineering (National Exemplary School of Microelectronics), University of Electronic Science and Technology of China, Chengdu, 611731 China
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 611731 China
| | - Lei Zhang
- School of Electronic Science and Engineering (National Exemplary School of Microelectronics), University of Electronic Science and Technology of China, Chengdu, 611731 China
| | - Lichuan Jin
- School of Electronic Science and Engineering (National Exemplary School of Microelectronics), University of Electronic Science and Technology of China, Chengdu, 611731 China
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 611731 China
| | - Huaiwu Zhang
- School of Electronic Science and Engineering (National Exemplary School of Microelectronics), University of Electronic Science and Technology of China, Chengdu, 611731 China
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 611731 China
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