Relation between surface preconditioning and metal deposition in direct galvanic metallization of insulating surfaces

The Effect of Antimony (III) Oxide on the Necessary Amount of Precursors Used in Laser-Activated Coatings Intended for Electroless Metallization

The article presents research on the potential use of organometallic compounds with the addition of antimony (III) oxide Sb₂O₃ as a coating additive that will make coatings susceptible to electroless metallization after prior surface irradiation with 193 nm wavelength laser radiation and a different number of laser pulses. The surface modification and activation effects were assessed by optical-imagining as well as by scanning electron microscopy (SEM) with energy dispersive analysis (EDX). It was found that the presence of Sb₂O₃ in the coating made it possible to reduce the content of the copper complex, causing an intensive surface ablation, resulting in the formation of a conical structure with a higher content of metallic copper nuclei.

Plasma functionalization and etching for enhancing metal adhesion onto polymeric substrates

The metallization of plastics materials, dealing with a lot of industrial applications in the field of automotive, electronic, etc.…, is generally performed by a chemical and/or electrochemical process not so ecofriendly.

Study on the pretreatment of poly(ether ether ketone)/multiwalled carbon nanotubes composites through environmentally friendly chemical etching and electrical properties of the chemically metallized composites

The high-volume resistivity and surface resistance of poly(ether ether ketone)/multiwalled carbon nanotubes (PEEK/MWCNT) composites restrict their use in an electronic field. To decrease the volume resistivity and surface resistance, we metalized the composites by electroless plating. The composites and metal coatings were characterized by SEM, XPS, AFM, EDX, and XRD spectroscopy. The swelling ratio of the composites, volume resistivity of two-side-coated composites, sheet resistance of plated composites, and adhesion between the coating and PEEK/MWCNT were tested. The results are as follows. A high roughness and a small swelling ratio were obtained by swelling in 18 mol/L H2SO4 for 3 min. Most of the MWCNT on the surface were still wrapped with PEEK after swelling. To expose the MWCNT, an environmentally friendly and effective etchant (MnO2-NaH2PO4-H2SO4) was used. After etching, not only were high roughness and partially exposed MWCNT obtained but also the percentage of hydrophilic groups on the surface was increased. A dense cauliflower-like Ni-P coating was produced, and the exposed MWCNT were embedded in the metal coating after electroless plating for 20 min. The coating exhibited an amorphous structure with a phosphorus content of 11.21 wt %. The volume resistivity of two-side-coated PEEK/MWCNT dropped sharply to 38 Ω·m after electroless plating for 5 min. The sheet resistance decreased with increasing the electroless-plating time, and it dropped to 0.88 Ω/square after electroless plating for 40 min. The adhesion of the coating reached the highest 5 B scale (ASTM D3359) and could even undergo the test 20 times.