Multicoils-based inductive links dedicated to power up implantable medical devices: modeling, design and experimental results

Chip-Scale Coils for Millimeter-Sized Bio-Implants

Next generation implantable neural interfaces are targeting devices with mm-scale form factors that are freely floating and completely wireless. Scalability to more recording (or stimulation) channels will be achieved through distributing multiple devices, instead of the current approach that uses a single centralized implant wired to individual electrodes or arrays. In this way, challenges associated with tethers, micromotion, and reliability of wiring is mitigated. This concept is now being applied to both central and peripheral nervous system interfaces. One key requirement, however, is to maximize specific absorption rate (SAR) constrained achievable wireless power transfer efficiency (PTE) of these inductive links with mm-sized receivers. Chip-scale coil structures for microsystem integration that can provide efficient near-field coupling are investigated. We develop near-optimal geometries for three specific coil structures: in-CMOS, above-CMOS (planar coil post-fabricated on a substrate), and around-CMOS (helical wirewound coil around substrate). We develop analytical and simulation models that have been validated in air and biological tissues by fabrications and experimental measurements. Specifically, we prototype structures that are constrained to a 4 mm 4 mm silicon substrate, i.e., the planar in-/above-CMOS coils have outer diameters 4 mm, whereas the around-CMOS coil has an inner diameter of 4 mm. The in-CMOS and above-CMOS coils have metal film thicknesses of 3- m aluminium and 25- m gold, respectively, whereas the around-CMOS coil is fabricated by winding a 25-m gold bonding wire around the substrate. The measured quality factors (Q) of the mm-scale Rx coils are 10.5 @450.3 MHz (in-CMOS), 24.61 @85 MHz (above-CMOS), and 26.23 @283 MHz (around-CMOS). Also, PTE of 2-coil links based on three types of chip-scale coils is measured in air and tissue environment to demonstrate tissue loss for bio-implants. The SAR-constrained maximum PTE measured (together with resonant frequencies, in tissue) are 1.64% @355.8 MHz (in-CMOS), 2.09% @82.9 MHz (above-CMOS), and 3.05% @318.8 MHz (around-CMOS).

Feasibility Study on Active Back Telemetry and Power Transmission Through an Inductive Link for Millimeter-Sized Biomedical Implants

This paper presents a feasibility study of wireless power and data transmission through an inductive link to a 1-mm ² implant, to be used as a free-floating neural probe, distributed across a brain area of interest. The proposed structure utilizes a four-coil inductive link for back telemetry, shared with a three-coil link for wireless power transmission. We propose a design procedure for geometrical optimization of the inductive link in terms of power transmission efficiency (PTE) considering specific absorption rate and data rate. We have designed a low-power pulse-based active data transmission circuit and characterized performance of the proposed inductive link in terms of its data rate and bit error rate (BER). The 1-mm² data-Tx/power-Rx coil is implemented using insulated bonding wire with diameter, resulting in measured PTE in tissue media of 2.01% at 131 MHz and 1.8-cm coil separation distance when the resonator coil inner radius is 1 cm. The measured BER at 1-Mbps data rate was and in the air and tissue environments, respectively.

Fully Integrated On-Chip Coil in 0.13 μm CMOS for Wireless Power Transfer Through Biological Media

Delivering milliwatts of wireless power at centimeter distances is advantageous to many existing and emerging biomedical applications. It is highly desirable to fully integrate the receiver on a single chip in standard CMOS with no additional post-processing steps or external components. This paper presents a 2 × 2.18 mm(2) on-chip wireless power transfer (WPT) receiver (Rx) coil fabricated in 0.13 μm CMOS. The WPT system utilizes a 14.5 × 14.5 mm(2) transmitter (Tx) coil that is fabricated on a standard FR4 substrate. The on-chip power harvester demonstrates a peak WPT efficiency of -18.47 dB , -20.96 dB and -20.15 dB at 10 mm of separation through air, bovine muscle and 0.2 molar NaCl, respectively. The achieved efficiency enables the delivery of milliwatts of power to application circuits while staying below safe power density and electromagnetic (EM) exposure limits.

Geometrical Design of a Scalable Overlapping Planar Spiral Coil Array to Generate a Homogeneous Magnetic Field

We present a design methodology for an overlapping hexagonal planar spiral coil (hex-PSC) array, optimized for creation of a homogenous magnetic field for wireless power transmission to randomly moving objects. The modular hex-PSC array has been implemented in the form of three parallel conductive layers, for which an iterative optimization procedure defines the PSC geometries. Since the overlapping hex-PSCs in different layers have different characteristics, the worst case coil-coupling condition should be designed to provide the maximum power transfer efficiency (PTE) in order to minimize the spatial received power fluctuations. In the worst case, the transmitter (Tx) hex-PSC is overlapped by six PSCs and surrounded by six other adjacent PSCs. Using a receiver (Rx) coil, 20 mm in radius, at the coupling distance of 78 mm and maximum lateral misalignment of 49.1 mm (1/√3 of the PSC radius) we can receive power at a PTE of 19.6% from the worst case PSC. Furthermore, we have studied the effects of Rx coil tilting and concluded that the PTE degrades significantly when θ > 60°. Solutions are: 1) activating two adjacent overlapping hex-PSCs simultaneously with out-of-phase excitations to create horizontal magnetic flux and 2) inclusion of a small energy storage element in the Rx module to maintain power in the worst case scenarios. In order to verify the proposed design methodology, we have developed the EnerCage system, which aims to power up biological instruments attached to or implanted in freely behaving small animal subjects' bodies in long-term electrophysiology experiments within large experimental arenas.

Inductive and ultrasonic multi-tier interface for low-power, deeply implantable medical devices

We report the development of a novel multi-tier interface which enables the wireless, noninvasive transfer of sufficient amounts of power as well as the collection and transmission of data from low-power, deeply implantable analog sensors. The interface consists of an inductive coupling subsystem and an ultrasonic subsystem. The designed and experimentally verified inductive subsystem ensures that 5 W of power is transferred across 10 mm of air gap between a single pair of PCB spiral coils with an efficiency of 83% using our prototype CMOS logic gate-based driver circuit. The implemented ultrasonic subsystem, based on ultrasonic PZT ceramic discs driven in their low-frequency, radial/planar-excitation mode, further ensures that 29 μW of power is delivered 70 mm deeper inside a homogenous liquid environment-with no acoustic matching layer employed-with an efficiency of 1%. Overall system power consumption is 2.3 W. The implant is intermittently powered every 800 msec; charging a capacitor which provides sufficient power for a duration of ~ 18 msec; sufficient for an implant μC operating at a frequency of 500 KHz to transmit a nibble (4 bits) of digitized sensed data.

Theoretical study for safe and efficient energy transfer to deeply implanted devices using ultrasound

The goal of this paper is to prove that a safe and efficient energy transfer is possible between an external transducer located on the patient's skin and a device deeply implanted in the abdomen. An ultrasound propagation model based on the Rayleigh-Sommerfeld diffraction integral is coupled with the data from the Visible Human Project to account for the geometry of the organs in the body. The model is able to predict the amount of acoustic power received by the device for different acoustic paths. The acoustic model is validated by comparison with measurements in water and in heterogeneous liquid phantoms. Care is taken to minimize adverse bioeffects-mainly temperature rise and cavitation in tissues. Simulations based on the bio-heat transfer equation are performed to check that thermal effects are indeed small.