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For: Ani FC, Jalar A, Ismail R, Othman NK, Abdullah MZ, Aziz MSA, Khor CY, Bakar MA. Reflow Optimization Process: Thermal Stress Using Numerical Analysis and Intermetallic Spallation in Backwards Compatibility Solder Joints. Arab J Sci Eng 2015. [DOI: 10.1007/s13369-015-1653-6] [Citation(s) in RCA: 8] [Impact Index Per Article: 0.9] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/28/2022]
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Study on the Fluid–Structure Interaction at Different Layout of Stacked Chip in Molded Packaging. ARABIAN JOURNAL FOR SCIENCE AND ENGINEERING 2017. [DOI: 10.1007/s13369-017-2659-z] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.1] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 10/19/2022]
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