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For: Arun Negemiya A, Rajakumar S, Balasubramanian V. Diffusion bonding of a titanium alloy to austenitic stainless steel using copper as an interlayer. SN Appl Sci 2019. [DOI: 10.1007/s42452-019-1189-6] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/28/2022] Open

For:	Arun Negemiya A, Rajakumar S, Balasubramanian V. Diffusion bonding of a titanium alloy to austenitic stainless steel using copper as an interlayer. SN Appl Sci 2019. [DOI: 10.1007/s42452-019-1189-6] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/28/2022] Open

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(The first 100,000 artilces are displayed in RCA.)