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Zhang Y, Lee G, Li S, Hu Z, Zhao K, Rogers JA. Advances in Bioresorbable Materials and Electronics. Chem Rev 2023; 123:11722-11773. [PMID: 37729090 DOI: 10.1021/acs.chemrev.3c00408] [Citation(s) in RCA: 32] [Impact Index Per Article: 16.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 09/22/2023]
Abstract
Transient electronic systems represent an emerging class of technology that is defined by an ability to fully or partially dissolve, disintegrate, or otherwise disappear at controlled rates or triggered times through engineered chemical or physical processes after a required period of operation. This review highlights recent advances in materials chemistry that serve as the foundations for a subclass of transient electronics, bioresorbable electronics, that is characterized by an ability to resorb (or, equivalently, to absorb) in a biological environment. The primary use cases are in systems designed to insert into the human body, to provide sensing and/or therapeutic functions for timeframes aligned with natural biological processes. Mechanisms of bioresorption then harmlessly eliminate the devices, and their associated load on and risk to the patient, without the need of secondary removal surgeries. The core content focuses on the chemistry of the enabling electronic materials, spanning organic and inorganic compounds to hybrids and composites, along with their mechanisms of chemical reaction in biological environments. Following discussions highlight the use of these materials in bioresorbable electronic components, sensors, power supplies, and in integrated diagnostic and therapeutic systems formed using specialized methods for fabrication and assembly. A concluding section summarizes opportunities for future research.
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Affiliation(s)
- Yamin Zhang
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
| | - Geumbee Lee
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
| | - Shuo Li
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
| | - Ziying Hu
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
| | - Kaiyu Zhao
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States
| | - John A Rogers
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States
- Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, Illinois 60611, United States
- Department of Mechanical Engineering, Biomedical Engineering, Chemistry, Electrical Engineering and Computer Science, Northwestern University, Evanston, Illinois 60208, United States
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Danek C. Recent Advances and Future Challenges in the Additive Manufacturing of Hydrogels. Polymers (Basel) 2022; 14:polym14030494. [PMID: 35160482 PMCID: PMC8838229 DOI: 10.3390/polym14030494] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Download PDF] [Journal Information] [Subscribe] [Scholar Register] [Received: 12/16/2021] [Accepted: 01/24/2022] [Indexed: 11/16/2022] Open
Affiliation(s)
- Chris Danek
- Bessel LLC, San Carlos, CA 94070, USA;
- Mechanical Engineering Department, W.M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX 79968, USA
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Nadagouda MN, Sekhar JA, Kyu T. Editorial overview: Recent developments in additive manufacturing. Curr Opin Chem Eng 2020; 28:A1-A3. [PMID: 39736857 PMCID: PMC11684515 DOI: 10.1016/j.coche.2020.100658] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/24/2022]
Affiliation(s)
- M N Nadagouda
- U.S. Environmental Protection Agency ORD, Center for Environmental Solutions and Emergency Response Water Infrastructure Division/Chemical Methods and Treatment Branch, Cincinnati, OH USA
| | - J A Sekhar
- CEAS - Mech Eng and Materials Eng - 0012, Materials, Mechanical and Chemical Engineering, University of Cincinnati, USA
| | - T Kyu
- School of Polymer Science of Polymer Engineering, University of Akron, Akron, OH USA
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