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For: Kelly J, Surisetty C, Canaperi D. Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization. CR CHIM 2013;16:15-20. [DOI: 10.1016/j.crci.2012.03.013] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/15/2022]

For:	Kelly J, Surisetty C, Canaperi D. Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization. CR CHIM 2013;16:15-20. [DOI: 10.1016/j.crci.2012.03.013] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/15/2022]

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Momose T, Sugiyama M, Kondoh E, Shimogaki Y. Design of a Multi-Wafer Reactor for Supercritical Fluid Deposition of Cu in Mass Production: (2) Benchmarks for Single- and Multiple-Wafer Reactors. JOURNAL OF CHEMICAL ENGINEERING OF JAPAN 2014. [DOI: 10.1252/jcej.13we274] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/11/2022]