Adsorption of mercaptopropionic acid onto Au(1 1 1)

Improved Hardness and Thermal Stability of Nanocrystalline Nickel Electrodeposited with the Addition of Cysteine

Experiments were conducted for the study of the effect of cysteine addition on the microstructure of nanocrystalline Ni films electrodeposited from a nickel sulfate-based bath. Furthermore, the thermal stability of the nanostructure of Ni layers processed with cysteine addition was also investigated. It was found that with increasing cysteine content in the bath, the grain size decreased, while the dislocation density and the twin fault probability increased. Simultaneously, the hardness increased due to cysteine addition through various effects. Saturation in the microstructure and hardness was achieved at cysteine contents of 0.3-0.4 g/L. Moreover, the texture changed from (220) to (200) with increasing the concentration of cysteine. The hardness of the Ni films processed with the addition of 0.4 g/L cysteine (∼6800 MPa) was higher than the values obtained for other additives in the literature (<6000 MPa). This hardness was further enhanced to ∼8400 MPa when the Ni film was heated up to 500 K. It was revealed that the hardness remained as high as 6000 MPa even after heating up to 750 K, while for other additives, the hardness decreased below 3000 MPa at the same temperature.

Real-time tracking of metal nucleation via local perturbation of hydration layers

The real-time visualization of stochastic nucleation events at electrode surfaces is one of the most complex challenges in electrochemical phase formation. The early stages of metal deposition on foreign substrates are characterized by a highly dynamic process in which nanoparticles nucleate and dissolve prior to reaching a critical size for deposition and growth. Here, high-speed non-contact lateral molecular force microscopy employing vertically oriented probes is utilized to explore the evolution of hydration layers at electrode surfaces with the unprecedented spatiotemporal resolution, and extremely low probe-surface interaction forces required to avoid disruption or shielding the critical nucleus formation. To the best of our knowledge, stochastic nucleation events of nanoscale copper deposits are visualized in real time for the first time and a highly dynamic topographic environment prior to the formation of critical nuclei is unveiled, featuring formation/re-dissolution of nuclei, two-dimensional aggregation and nuclei growth.

Electrochemical deposition is important for industrial processes however, tracking the early stages of metallic phase nucleation is challenging. Here, the authors visualize the birth and growth of metal nuclei at electrode surfaces in real time via high-speed non-contact lateral molecular force microscopy.

Adsorption and desorption of bis-(3-sulfopropyl) disulfide during Cu electrodeposition and stripping at Au electrodes

The adsorption and desorption of bis-(3-sulfopropyl) disulfide (SPS) on Cu and Au electrodes and its electrochemical effect on Cu deposition and dissolution were examined using cyclic voltammetry stripping (CVS), field-emission scanning electron microscopy (FESEM), and X-ray photoelectron spectroscopy (XPS). SPS dissociates into 3-mercapto-1-propanesulfonate when it is contacted with Au and Cu electrodes, producing Cu(I)- and Au(I)-thiolate species. These thiolates couple with chloride ions and promote not only the reduction of Cu(2+) in Cu deposition but also the oxidation of Cu(0) to Cu(+) in Cu stripping. During Cu electrodeposition on the SPS-modified Au electrode, thiolates transfer from Au onto the Cu underpotential deposition (UPD) layer. The Cu UPD layer stabilizes a large part of the transferred thiolates which subsequently is buried by the Cu overpotential deposition (OPD) layer. The buried thiolates reappear on the Au electrode after the copper deposit is electrochemically stripped off. A much smaller part of thiolates transfers to the top of the Cu OPD layer. In contrast, when SPS preadsorbs on a Cu-coated Au electrode, almost all of the adsorbed SPS leaves the Cu surface during Cu electrochemical stripping and does not return to the uncovered Au surface. A reaction mechanism is proposed to explain these results.

Potential-induced structure changes of oligopyridine adlayers on Au(111) electrodes

The structure of a bisterpyridine-like oligopyridine (abbreviated as 2,4'-BTP) monolayer on Au(111), adsorbed from an acetone solution, was studied by in situ scanning tunneling microscopy and cyclic voltammetry in aqueous 0.1 M H2SO4. Short-range ordered adsorption with an average distance between the individual molecules of about 2 nm was observed only at electrode potentials positive of +0.4 V vs SCE, whereas at more negative potentials, no order could be found. With the help of Cu underpotential deposition, a potential-induced, fast, and fully reversible structure transition within the organic monolayer was identified at about +0.4 V vs SCE. At negative potentials the molecules apparently cluster together and consequently current-potential curves resemble those for a bare gold surface, whereas for E>+0.4 V vs SCE the molecules are spread over the entire surface in a hexagonal, close-packed fashion. This may have interesting consequences for switching between different template structures.