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For: Wang Y, Jiang W, Yao W, Liu Z, Liu Z, Wang Y, Shi L, Gao L. BiNV bond: A hole-transfer bridge for high-efficient separation and transfer of carriers. J Colloid Interface Sci 2021;590:144-153. [PMID: 33524715 DOI: 10.1016/j.jcis.2021.01.043] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 09/14/2020] [Revised: 01/12/2021] [Accepted: 01/16/2021] [Indexed: 11/28/2022]
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