Effect of self and extrinsic encapsulation on electron resilience of porous 2D polymer nanosheets

Two- and three-dimensional electron imaging of beam-sensitive specimens

Radiation damage is the main factor that determines the spatial resolution of TEM and STEM images of beam-sensitive specimens, its influence being well represented by a dose-limited resolution (DLR). In this review, DLR is defined and evaluated for both thin and thick samples, for all common imaging modes, and for electron-accelerating voltages up to 3 MV. Damage mechanisms are discussed (including beam heating and electrostatic charge accumulation) with an emphasis on recently published work. Experimental methods for reducing beam damage are identified and future lines of investigation are suggested.

Understanding the Electron Beam Resilience of Two-Dimensional Conjugated Metal-Organic Frameworks

Knowledge of the atomic structure of layer-stacked two-dimensional conjugated metal-organic frameworks (2D c-MOFs) is an essential prerequisite for establishing their structure-property correlation. For this, atomic resolution imaging is often the method of choice. In this paper, we gain a better understanding of the main properties contributing to the electron beam resilience and the achievable resolution in the high-resolution TEM images of 2D c-MOFs, which include chemical composition, density, and conductivity of the c-MOF structures. As a result, sub-angstrom resolution of 0.95 Å has been achieved for the most stable 2D c-MOF of the considered structures, Cu3(BHT) (BHT = benzenehexathiol), at an accelerating voltage of 80 kV in a spherical and chromatic aberration-corrected TEM. Complex damage mechanisms induced in Cu3(BHT) by the elastic interactions with the e-beam have been explained using detailed ab initio molecular dynamics calculations. Experimental and calculated knock-on damage thresholds are in good agreement.