Polyurethane-templated 3D BN network for enhanced thermally conductive property of epoxy composites

Simple Protein Foaming-Derived 3D Segregated MgO Networks in Epoxy Composites with Outstanding Thermal Conductivity Properties

The miniaturization and high-power density of electronic devices present new challenges for thermal management. Efficient heat dissipation in electrically insulating packaging materials is currently limited by the thermal conductivity of thermal-interface materials (TIMs) and their ability to effectively direct heat toward heat sinks. In this study, MgO-based composites with high thermal conductivities are fabricated to achieve excellent thermal performances by optimizing the heat-transfer path. These composites are produced using a protein foaming method, which effectively forms interconnected ceramic-filler networks. Additionally, the liquid phase formed during the sintering of MgO enhances the bonding with the epoxy matrix, thereby improving the thermal conductivity of the composites. As a result, the composites with 54.64 vol% MgO achieve a high thermal conductivity of 17.19 W m-1 K-1, which is 101 times higher than that of pure epoxy, 3.7 times higher than that of randomly dispersed composites, and even superior to that of nitride-based composites. Moreover, the composites also exhibited a low thermal-expansion coefficient (27.76 ppm °C-1) and high electrical-insulation strength (51.51 kV mm-1), ensuring good thermal and electrical performance for electronic-packaging applications. The strategic design of the TIM microstructures for effectively directing heat offers a promising solution for efficient thermal management in integrated electronics.

Effect of Nanoscale in Situ Interface Welding on the Macroscale Thermal Conductivity of Insulating Epoxy Composites: A Multiscale Simulation Investigation

Insulating thermally conductive polymer composites are in great demand in integrated-circuit packages, for efficient heat dissipation and to alleviative short-circuit risk. Herein, the continuous oriented hexagonal boron nitride (h-BN) frameworks (o-BN@SiC) were prepared via self-assembly and in situ chemical vapor infiltration (CVI) interface welding. The insulating o-BN@SiC/epoxy (o-BN@SiC/EP) composites exhibited enhanced thermal conductivity benefited from the CVI-SiC-welded BN-BN interface. Further, multiscale simulation, combining first-principles calculation, Monte Carlo simulation, and finite-element simulation, was performed to quantitatively reveal the effect of the welded BN-BN interface on the heat transfer of o-BN@SiC/EP composites. Phonon transmission in solders and phonon-phonon coupling of filler-solder interfaces enhanced the interfacial heat transfer between adjacent h-BN microplatelets, and the interfacial thermal resistance of the dominant BN-BN interface was decreased to only 3.83 nK·m2/W from 400 nK·m2/W, plunging by over 99%. This highly weakened interfacial thermal resistance greatly improved the heat transfer along thermal pathways and resulted in a 26% thermal conductivity enhancement of o-BN@SiC/EP composites, compared with physically contacted oriented h-BN/EP composites, at 15 vol % h-BN. This systematic multiscale simulation broke through the barrier of revealing the heat transfer mechanism of polymer composites from the nanoscale to the macroscale, which provided rational cognition about the effect of the interfacial thermal resistance between fillers on the thermal conductivity of polymer composites.

Thermal Conductivity of Polyvinylidene Fluoride Films with a Multi-Scale Framework

The orientation of amorphous regions in pure polymers has been noted to be critical to the enhancement of thermal conductivity (TC), but the available reports are still rather few. Here, we propose to prepare a polyvinylidene fluoride (PVDF) film with a multi-scale framework by introducing anisotropic amorphous nanophases in the form of cross-planar alignments among the in-planar oriented extended-chain crystals (ECCs) lamellae, which show an enhanced TC of 1.99 Wm-1 K-1 in the through-plane direction (K⟂) and 4.35 Wm-1 K-1 in the in-plane direction (K∥). Structural characterization determination using scanning electron microscopy and high-resolution synchrotron X-ray scattering showed that shrinking the dimension of the amorphous nanophases can effectively reduce entanglement and lead to alignments formation. Moreover, the thermal anisotropy of the amorphous region is quantitatively discussed with the aid of the two-phase model. Superior thermal dissipation performances are intuitively displayed by means of finite element numerical analysis and heat exchanger applications. Moreover, such unique multi-scale architecture also results in significant benefit in the improvement of dimensional stability and thermal stability. This paper provides a reasonable solution for fabricating inexpensive thermal conducting polymer films from the perspective of practical applications.

Significant Improvement of Thermal Conductivity of Polyamide 6/Boron Nitride Composites by Adding a Small Amount of Stearic Acid

This study investigates the effect of adding stearic acid (SA) on the thermal conductivity of polyamide 6 (PA6)/boron nitride (BN) composites. The composites were prepared by melt blending, and the mass ratio of PA6 to BN was fixed at 50:50. The results show that when the SA content is less than 5 phr, some SA is distributed at the interface between BN sheets and PA6, which improves the interface adhesion of the two phases. This improves the force transfer from the matrix to BN sheets, promoting the exfoliation and dispersion of BN sheets. However, when the SA content was greater than 5 phr, SA tends to aggregate and form separate domains rather than being dispersed at the interface between PA6 and BN. Additionally, the well-dispersed BN sheets act as a heterogeneous nucleation agent, significantly improving the crystallinity of the PA6 matrix. The combination of good interface adhesion, excellent orientation, and high crystallinity of the matrix leads to efficient phonon propagation, resulting in a significant improvement in the thermal conductivity of the composite. The highest thermal conductivity of the composite is achieved when the SA content is 5 phr, which is 3.59 W m^-1 K^-1. The utilization of a composite material consisting of 5phr SA as the thermal interface material displays the highest thermal conductivity, and the composite also demonstrates satisfactory mechanical properties. This study proposes a promising strategy for the preparation of composites with high thermal conductivity.