Gauge Factor of Titanium/Platinum Thin Films up to 350°C

High-temperature strain sensor based on sapphire fiber Bragg grating

Sapphire fiber Bragg grating (SFBG) is a promising high-temperature strain sensor due to its melting point of 2045°C. However, the study on the long-term stability of SFBG under high temperature with an applied strain is still missing. In this paper, we reported for the first time to our knowledge on the critical temperature point of plastic deformation of the SFBG and demonstrated that the SFBG strain sensor can operate stably below 1200°C. At first, we experimentally investigated the topography and the spectral characteristics of the SFBG at different temperatures (i.e., 25°C, 1180°C, and 1600°C) with applied 650 µε. The reflection peak of the SFBG exhibits a redshift of about 15 nm and broadens gradually within 8 h at 1600°C, and the tensile force value decreases by 0.60 N in this process. After the test, the diameter of the SFBG region decreases from 100 to 88.6 µm, and the grating period is extended from 1.76 to 1.79 µm. This indicates that the plastic deformation of the SFBG happened indeed, and it was elongated irreversibly. Moreover, the stability of the Bragg wavelength of the SFBG under high temperature with the applied strain was evaluated. The result demonstrates the SFBG can be used to measure strain reliably below 1200°C. Furthermore, the strain experiments of SFBG at 25°C, 800°C, and 1100°C have been carried out. A linear fitting curve with high fitness (R2 > 0.99) and a lower strain measurement error (<15 µε) can be obtained. The aforementioned results make SFBG promising for high-temperature strain sensing in many fields, such as, power plants, gas turbines, and aerospace vehicles.

Structural Uncertainty Analysis of High-Temperature Strain Gauge Based on Monte Carlo Stochastic Finite Element Method

The high-temperature strain gauge is a sensor for strain measurement in high-temperature environments. The measurement results often have a certain divergence, so the uncertainty of the high-temperature strain gauge system is analyzed theoretically. Firstly, in the conducted research, a deterministic finite element analysis of the temperature field of the strain gauge is carried out using MATLAB software. Then, the primary sub-model method is used to model the system; an equivalent thermal load and force are loaded onto the model. The thermal response of the grid wire is calculated by the finite element method (FEM). Thermal-mechanical coupling analysis is carried out by ANSYS, and the MATLAB program is verified. Finally, the stochastic finite element method (SFEM) combined with the Monte Carlo method (MCM) is used to analyze the effects of the physical parameters, geometric parameters, and load uncertainties on the thermal response of the grid wire. The results show that the difference of temperature and strain calculated by ANSYS and MATLAB is 1.34% and 0.64%, respectively. The calculation program is accurate and effective. The primary sub-model method is suitable for the finite element modeling of strain gauge systems, and the number of elements is reduced effectively. The stochastic uncertainty analysis of the thermal response on the grid wire of a high-temperature strain gauge provides a theoretical basis for the dispersion of the measurement results of the strain gauge.

Development of platinum strain gauge based on Ni-Co metal substrate for smart catheter application

Rapid diagnosis and treatment are required when blood clots build up in a blood vessel and clog up the vessel. This study proposes novel smart catheters that can simultaneously diagnose and treat blood vessel disease. This quick treatment increases survival probability and can prevent various complications. In the design of the smart catheters, Pt strain gauges can be used to measure the inside diameter of the vessel. This paper proposes a new fabrication process of the Pt strain gauges based on metal substrates made of Ni and Co alloy (referred to as “Ni-Co” in this paper). In the fabrication process, a Ni-Co thin film was deposited onto a silicon carrier wafer by electroplating and patterned into individual shapes by a liftoff process. Then, a multilayered Pt strain gauge consisting of insulation, adhesive layers, and Pt metallization was formed on the Ni-Co flexible substrate. Subsequently, the Pt strain gauges were peeled off from the carrier wafer by a new release process. To evaluate the performance of the strain gauges in terms of gauge factor and nonlinearity, tensile and compression tests were conducted by attaching Pt strain gauges to the constant stress beam.

Metal and Polymeric Strain Gauges for Si-Based, Monolithically Fabricated Organs-on-Chips

Organ-on-chip (OOC) is becoming the alternative tool to conventional in vitro screening. Heart-on-chip devices including microstructures for mechanical and electrical stimulation have been demonstrated to be advantageous to study structural organization and maturation of heart cells. This paper presents the development of metal and polymeric strain gauges for in situ monitoring of mechanical strain in the Cytostretch platform for heart-on-chip application. Specifically, the optimization of the fabrication process of metal titanium (Ti) strain gauges and the investigation on an alternative material to improve the robustness and performance of the devices are presented. The transduction behavior and functionality of the devices are successfully proven using a custom-made set-up. The devices showed resistance changes for the pressure range (0-3 kPa) used to stretch the membranes on which heart cells can be cultured. Relative resistance changes of approximately 0.008% and 1.2% for titanium and polymeric strain gauges are respectively reported for membrane deformations up to 5%. The results demonstrate that both conventional IC metals and polymeric materials can be implemented for sensing mechanical strain using robust microfabricated organ-on-chip devices.

A Review on Surface Stress-Based Miniaturized Piezoresistive SU-8 Polymeric Cantilever Sensors

In the last decade, microelectromechanical systems (MEMS) SU-8 polymeric cantilevers with piezoresistive readout combined with the advances in molecular recognition techniques have found versatile applications, especially in the field of chemical and biological sensing. Compared to conventional solid-state semiconductor-based piezoresistive cantilever sensors, SU-8 polymeric cantilevers have advantages in terms of better sensitivity along with reduced material and fabrication cost. In recent times, numerous researchers have investigated their potential as a sensing platform due to high performance-to-cost ratio of SU-8 polymer-based cantilever sensors. In this article, we critically review the design, fabrication, and performance aspects of surface stress-based piezoresistive SU-8 polymeric cantilever sensors. The evolution of surface stress-based piezoresistive cantilever sensors from solid-state semiconductor materials to polymers, especially SU-8 polymer, is discussed in detail. Theoretical principles of surface stress generation and their application in cantilever sensing technology are also devised. Variants of SU-8 polymeric cantilevers with different composition of materials in cantilever stacks are explained. Furthermore, the interdependence of the material selection, geometrical design parameters, and fabrication process of piezoresistive SU-8 polymeric cantilever sensors and their cumulative impact on the sensor response are also explained in detail. In addition to the design-, fabrication-, and performance-related factors, this article also describes various challenges in engineering SU-8 polymeric cantilevers as a universal sensing platform such as temperature and moisture vulnerability. This review article would serve as a guideline for researchers to understand specifics and functionality of surface stress-based piezoresistive SU-8 cantilever sensors.