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He H, Song L, Gao H, Xiao Y, Cao Y. Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder. ULTRASONICS SONOCHEMISTRY 2023; 92:106244. [PMID: 36508893 PMCID: PMC9763506 DOI: 10.1016/j.ultsonch.2022.106244] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 09/16/2022] [Revised: 11/16/2022] [Accepted: 11/25/2022] [Indexed: 06/17/2023]
Abstract
In this investigation, ultrasonic-assisted soldering at 260 °C in air produced high strength and high melting point Cu connections in 60 s using Ni foam reinforced Sn composite solder. Systematically examined were the microstructure, grain morphology, and shear strength of connections made with various porosities of Ni foam composite solders. Results shown that Ni foams as strengthening phases could reinforce Sn solder effectively. The addition of Ni foam accelerated the metallurgical reaction due to great amount of liquid/solid interfaces, and refined the intermetallic compounds (IMCs) grains by ultrasonic cavitation. The joints had different IMCs by using Ni foam with different porosity. Layered (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 phases both existed in Cu/Ni60-Sn/Cu joint while only (Cu,Ni)6Sn5 IMCs grew in Cu/Ni98-Sn/Cu joint. As ultrasonic time increasing, Ni skeletons were dissolved and the IMCs were peeled off from substrates and broken into small particles. And then, the IMCs gradually dissociated into refined particles and distributed homogeneously in the whole soldering seam under cavitation effects. Herein, the Cu/Ni60-Sn/Cu joint ultrasonically soldered for 60 s exhibited the highest shear strength of 86.9 MPa, as well as a high melting point about 800 ℃ for the solder seam composed of Ni skeletons and Ni-Cu-Sn IMCs. The characterization indicated that the shearing failure mainly occurred in the interlayer of the soldering seam. The homogeneous distributed granular IMCs and Ni skeletons hindered the crack propagation and improved the strength of Cu alloy joints.
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Affiliation(s)
- Huang He
- College of Mechanical and Electrical Engineering, Hubei Three Gorges Polytechnic, Yichang 443000, China; School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
| | - Lizhi Song
- School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
| | - Haitao Gao
- China-Ukraine Institute of Welding, Guangdong Academy of Sciences, Guangzhou 510650, China
| | - Yong Xiao
- School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China.
| | - Yi Cao
- Institute for Advanced Materials, Hubei Normal University, Huangshi 435002, China.
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2
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Zhang W, Cao Y, Huang J, Zhao W, Liu X, Li M, Ji H. Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: Principle, kinetics, microstructure, and joint properties. ULTRASONICS SONOCHEMISTRY 2020; 66:105090. [PMID: 32247233 DOI: 10.1016/j.ultsonch.2020.105090] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/18/2019] [Revised: 03/22/2020] [Accepted: 03/22/2020] [Indexed: 06/11/2023]
Abstract
The high-melting-point joints by transient-liquid-phase are increasingly playing a crucial role in the die bonding for the high temperature electronic components. In this study, three kinds of Sn/Ni composite solder pastes composed of different sizes of Ni particles were synthesized to accelerate metallurgical reaction among Sn/Ni interfaces under the ultrasonic-assisted transient liquid phase (U-TLP) soldering. The temperature evolution, microstructure and mechanical property in joints composed by these composite solder pastes with or without ultrasonic energy were systemically investigated. The intermetallic joint consisted of high-melting-point sole Ni3Sn4 intermetallic compound with a little residual Ni was obtained under the conditions of no pressure and lower power (200 W) in a high-temperature duration of only 10 s, its shear strength was up to 45.3 MPa. Ultrasonic effects significantly accelerated the reaction among the interfaces of liquid Sn and solid Ni, which attributed to the temperature rise caused by acoustic cavitation because of large number of liquid/solid interfaces during U-TLP, resulting in accelerated solid/liquid interfacial diffusion and growth of intermetallic compounds. This intermetallic joint formed by U-TLP soldering has a promising potential for applications in high-power device packaging.
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Affiliation(s)
- Wenwu Zhang
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, Guangdong, China; Flexible Printing Electronic Technology Center, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China
| | - Yichen Cao
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, Guangdong, China; Flexible Printing Electronic Technology Center, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China
| | - Jiayi Huang
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, Guangdong, China; Flexible Printing Electronic Technology Center, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China
| | - Weiwei Zhao
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, Guangdong, China; Flexible Printing Electronic Technology Center, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China
| | - Xiangli Liu
- Shenzhen Engineering Laboratory of Aerospace Detection and Imaging, Department of Materials Science and Engineering, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China
| | - Mingyu Li
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, Guangdong, China; Flexible Printing Electronic Technology Center, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China
| | - Hongjun Ji
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, Guangdong, China; Flexible Printing Electronic Technology Center, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China.
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Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics. APPLIED SCIENCES-BASEL 2019. [DOI: 10.3390/app9030529] [Citation(s) in RCA: 7] [Impact Index Per Article: 1.4] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
Abstract
In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the Cu interconnects at 260°C. After 8 min of reflow time, a complete transformation of Cu3Sn intermetallic compound (IMC) occurred, leaving a Cu/MWCNT-Cu3Sn /Cu joint capable of withstanding the high operating temperature. Due to flake-like morphology, the Sn-Cu-MWCNT composite particles were well packed with lesser voids. The shear strength of the Cu/Cu3Sn-MWCNT/Cu joint was measured as 35.3 MPa, thus exhibiting the scope for replacing conventional transient liquid phase (TLP) powders in the future.
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Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds. Sci Rep 2018; 8:16856. [PMID: 30442896 PMCID: PMC6237854 DOI: 10.1038/s41598-018-34635-w] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/11/2018] [Accepted: 10/18/2018] [Indexed: 11/09/2022] Open
Abstract
With the aim of overcoming the limitations of traditional soldering ceramic methods for power device packaging, a simple but ultrafast bonding technology is reported. The effect and mechanism of ultrasonic action on the interfacial bonding and microstructure is investigated and thoroughly discussed. An ultrafast interfacial bond between SiC ceramics and SnAgTi active solder has been successfully achieved through a reaction at the interface at a low temperature of 250 °C in the extremely short time. High-resolution transmission electron microscopy (HRTEM) revealed that a silica layer on the surface of SiC reacted with Ti from the SnAgTi active solder to form a nanometer-thickness amorphous titania layer at the interface under the ultrasonic action, which creates an exceptional interfacial structure and facilitates bonding between the two dissimilar crystals. A discontinuous titania layer at the interface was identified within 0.1 s. With further increasing ultrasonic action time to 1 s, a continuous titania layer with a thickness of 7.6 ± 0.5 nm formed at the interface. A new interfacial reaction mechanism was revealed and it was found that ultrasound accelerated the reaction of liquid active solder/ceramic. Our finding demonstrated that ultrasound could be an effective approach for joining ceramics which is difficult to wet by a liquid metal at low temperature. The combined impact of ultrasonic cavitation and streaming dominated the mechanism and kinetics of the rapid interfacial reaction.
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Xiao Y, Wang Q, Wang L, Zeng X, Li M, Wang Z, Zhang X, Zhu X. Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer. ULTRASONICS SONOCHEMISTRY 2018; 45:223-230. [PMID: 29705316 DOI: 10.1016/j.ultsonch.2018.03.005] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/08/2017] [Revised: 03/03/2018] [Accepted: 03/12/2018] [Indexed: 06/08/2023]
Abstract
In this study, Cu alloy joints were fabricated with a Ni-foam reinforced Sn-based composite solder with the assistance of ultrasonic vibration. Effects of ultrasonic soldering time on the microstructure and mechanical properties of Cu/Ni-Sn/Cu joints were investigated. Results showed that exceptional metallurgic bonding could be acquired with the assistance of ultrasonic vibration using a self-developed Ni-foam/Sn composite solder. For joint soldered for 5 s, a (Cu,Ni)6Sn5 intermetallic compound (IMC) layer was formed on the Cu substrate surface, Ni skeletons distributed randomly in the soldering seam and a serrated (Ni,Cu)3Sn4 IMC layer was formed on the Ni skeleton surface. Increasing the soldering time to 20 s, the (Ni,Cu)3Sn4 IMC layer grew significantly and exhibited a loose porous structure on the Ni skeleton surface. Further increase the soldering time to 30 s, Ni skeletons were largely dissolved in the Sn base solder, and micro-sized (Ni,Cu)3Sn4 particles were formed and dispersed homogeneously in the soldering seam. The formation of (Ni,Cu)3Sn4 particles was mainly ascribed to acoustic cavitations induced erosion and grain refining effects. The joint soldered for 30 s exhibited the highest shear strength of 64.9 ± 3.3 MPa, and the shearing failure mainly occurred at the soldering seam/Cu substrate interface.
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Affiliation(s)
- Yong Xiao
- School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
| | - Qiwei Wang
- School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
| | - Ling Wang
- China National Electric Apparatus Research Institute Co, Ltd, Guangzhou 510300, China
| | - Xian Zeng
- School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China.
| | - Mingyu Li
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Shenzhen 518055, China
| | - Ziqi Wang
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Shenzhen 518055, China
| | - Xingyi Zhang
- School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
| | - Xiaomeng Zhu
- School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
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Li ZL, Dong HJ, Song XG, Zhao HY, Tian H, Liu JH, Feng JC, Yan JC. Homogeneous (Cu, Ni) 6Sn 5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process. ULTRASONICS SONOCHEMISTRY 2018; 42:403-410. [PMID: 29429685 DOI: 10.1016/j.ultsonch.2017.12.005] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/18/2017] [Revised: 12/03/2017] [Accepted: 12/04/2017] [Indexed: 06/08/2023]
Abstract
Homogeneous (Cu, Ni)6Sn5 intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system consisted of major (Cu, Ni)6Sn5 and minor Cu3Sn IMCs, and the grain morphology of (Cu, Ni)6Sn5 IMCs subsequently exhibited fine rounded, needlelike and coarse rounded shapes from the Ni side to the Cu side, which was highly in accordance with the Ni concentration gradient across the joints. However, in the ultrasound-induced TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system only consisted of the (Cu, Ni)6Sn5 IMCs which exhibited an uniform grain morphology of rounded shape with a remarkably narrowed Ni concentration gradient. The ultrasound-induced homogeneous intermetallic joints exhibited higher shear strength (61.6 MPa) than the traditional heterogeneous intermetallic joints (49.8 MPa).
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Affiliation(s)
- Z L Li
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China
| | - H J Dong
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China
| | - X G Song
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
| | - H Y Zhao
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
| | - H Tian
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China
| | - J H Liu
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China
| | - J C Feng
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
| | - J C Yan
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China
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Ji H, Zhou J, Liang M, Lu H, Li M. Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging. ULTRASONICS SONOCHEMISTRY 2018; 41:375-381. [PMID: 29137764 DOI: 10.1016/j.ultsonch.2017.10.003] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/16/2017] [Revised: 09/15/2017] [Accepted: 10/03/2017] [Indexed: 05/02/2023]
Abstract
Sintering of low-cost Cu nanoparticles (NPs) for interconnection of chips to substrate at low temperature and in atmosphere conditions is difficult because they are prone to oxidation, but dramatically required in semiconductor industry. In the present work, we successfully synthesized Cu@Ag NPs paste, and they were successfully applied for joining Cu/Cu@Ag NPs paste/Cu firstly in air by the ultrasonic-assisted sintering (UAS) at a temperature of as low as 160 °C. Their sintered microstructures featuring with dense and crystallized cells are completely different from the traditional thermo-compression sintering (TCS). The optimized shear strength of the joints reached to 54.27 MPa, exhibiting one order of magnitude higher than TCS at the same temperature (180 °C) under the UAS. This ultra-low sintering temperature and high performance of the sintered joints were ascribed to ultrasonic effects. The ultrasonic vibrations have distinct effects on the metallurgical reactions of the joints, resulting in the contact and growth of Cu core and the stripping and connection of Ag shell, which contributes to the high shear strength. Thus, the UAS of Cu@Ag NPs paste has a great potential to be applied for high-temperature power device packaging.
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Affiliation(s)
- Hongjun Ji
- Shenzhen Key Laboratory of Advanced Materials, Shenzhen Graduate School, Harbin Institute of Technology, HIT Campus, Shenzhen University Town, Xili, Nanshan, Shenzhen 518055, PR China.
| | - Junbo Zhou
- Shenzhen Key Laboratory of Advanced Materials, Shenzhen Graduate School, Harbin Institute of Technology, HIT Campus, Shenzhen University Town, Xili, Nanshan, Shenzhen 518055, PR China
| | - Meng Liang
- Shenzhen Key Laboratory of Advanced Materials, Shenzhen Graduate School, Harbin Institute of Technology, HIT Campus, Shenzhen University Town, Xili, Nanshan, Shenzhen 518055, PR China
| | - Huajun Lu
- Shenzhen Key Laboratory of Advanced Materials, Shenzhen Graduate School, Harbin Institute of Technology, HIT Campus, Shenzhen University Town, Xili, Nanshan, Shenzhen 518055, PR China
| | - Mingyu Li
- Shenzhen Key Laboratory of Advanced Materials, Shenzhen Graduate School, Harbin Institute of Technology, HIT Campus, Shenzhen University Town, Xili, Nanshan, Shenzhen 518055, PR China
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Growth kinetics of Cu 6Sn 5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current. Sci Rep 2018; 8:1775. [PMID: 29379073 PMCID: PMC5788868 DOI: 10.1038/s41598-018-20100-1] [Citation(s) in RCA: 19] [Impact Index Per Article: 3.2] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 11/02/2017] [Accepted: 01/10/2018] [Indexed: 11/08/2022] Open
Abstract
In this paper, electric currents with the densities of 1.0 × 102 A/cm2 and 2.0 × 102 A/cm2 were imposed to the Cu-liquid Sn interfacial reaction at 260 °C and 300 °C with the bonding times from 15 min to 960 min. Unlike the symmetrical growth following a cubic root dependence on time during reflowing, the Cu6Sn5 growth enhanced by solid-liquid electromigration followed a linear relationship with time. The elevated electric current density and reaction temperature could greatly accelerate the growth of Cu6Sn5, and could induce the formation of cellular structures on the surfaces because of the constitutional supercooling effect. A growth kinetics model of Cu6Sn5 based on Cu concentration gradient was presented, in which the dissolution of cathode was proved to be the controlling step. This model indicates that higher current density, higher temperature and larger joint width were in favor of the dissolution of Cu. Finally, the shear strengths of joints consisted of different intermetallic compound microstructures were evaluated. The results showed that the Cu6Sn5-based joint could achieve comparable shear strength with Sn-based joint.
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9
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Li Y, Long W, Hu X, Fu Y. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging. MATERIALS 2018; 11:ma11010084. [PMID: 29316625 PMCID: PMC5793582 DOI: 10.3390/ma11010084] [Citation(s) in RCA: 9] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 11/29/2017] [Revised: 01/03/2018] [Accepted: 01/04/2018] [Indexed: 11/23/2022]
Abstract
In order to accelerate the growth of interfacial intermetallic compound (IMC) layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i) Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii) The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii) The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv) Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time.
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Affiliation(s)
- Yulong Li
- Key Lab of Robot & Welding Automation of Jiangxi Province, Mechanical & Electrical Engineering School, Nanchang University, Nanchang 330031, China.
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
| | - Weifeng Long
- Key Lab of Robot & Welding Automation of Jiangxi Province, Mechanical & Electrical Engineering School, Nanchang University, Nanchang 330031, China.
| | - Xiaowu Hu
- Key Lab of Robot & Welding Automation of Jiangxi Province, Mechanical & Electrical Engineering School, Nanchang University, Nanchang 330031, China.
| | - Yanshu Fu
- Key Lab of Robot & Welding Automation of Jiangxi Province, Mechanical & Electrical Engineering School, Nanchang University, Nanchang 330031, China.
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Li ZL, Dong HJ, Song XG, Zhao HY, Feng JC, Liu JH, Tian H, Wang SJ. Rapid formation of Ni 3Sn 4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process. ULTRASONICS SONOCHEMISTRY 2017; 36:420-426. [PMID: 28069229 DOI: 10.1016/j.ultsonch.2016.12.026] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/26/2016] [Revised: 12/18/2016] [Accepted: 12/18/2016] [Indexed: 06/06/2023]
Abstract
High melting point Ni3Sn4 joints for the die attachment of SiC-based high temperature power devices was successfully achieved using an ultrasound-induced transient liquid phase (TLP) bonding process within a remarkably short bonding time of 8s. The formed intermetallic joints, which are completely composed of the refined equiaxial Ni3Sn4 grains with the average diameter of 2μm, perform the average shear strength of 26.7MPa. The sonochemical effects of ultrasonic waves dominate the mechanism and kinetics of the rapid formation of Ni3Sn4 joints.
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Affiliation(s)
- Z L Li
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China
| | - H J Dong
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China
| | - X G Song
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
| | - H Y Zhao
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
| | - J C Feng
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
| | - J H Liu
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China
| | - H Tian
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China
| | - S J Wang
- Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China
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Liu Z, Rakita M, Xu W, Wang X, Han Q. Ultrasound assisted combustion synthesis of TiC in Al-Ti-C system. ULTRASONICS SONOCHEMISTRY 2015; 27:631-637. [PMID: 25937509 DOI: 10.1016/j.ultsonch.2015.04.025] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/12/2014] [Revised: 10/14/2014] [Accepted: 04/18/2015] [Indexed: 06/04/2023]
Abstract
This research investigated the effects of high-intensity ultrasound on the combustion synthesis of TiC particles in Al-Ti-C system. The process involved that high-intensity ultrasound was applied on the surface of a compacted Al-Ti-C pellet directly through a Nb probe during the thermal explosion reaction. By comparing with the sample without ultrasonic treatment, it was found that the thermal explosion reaction for synthesizing TiC phase could take place thoroughly in the ultrasonically treated sample. During the process of synthesizing TiC phase, the dissolution of solid graphite particles into the Al-Ti melt, as well as the nucleation and growth of TiC particles could be promoted effectively due to the effects of ultrasound, leading to an enhancement of the formation of TiC particles. Ultrasound assisted combustion synthesis as a simple and effective approach was proposed for synthesizing materials in this research.
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Affiliation(s)
- Zhiwei Liu
- Department of Mechanical Engineering Technology, Purdue University, 401 North Grant Street, West Lafayette, IN 47906, USA.
| | - Milan Rakita
- Department of Mechanical Engineering Technology, Purdue University, 401 North Grant Street, West Lafayette, IN 47906, USA
| | - Wilson Xu
- Department of Mechanical Engineering Technology, Purdue University, 401 North Grant Street, West Lafayette, IN 47906, USA
| | - Xiaoming Wang
- Department of Mechanical Engineering Technology, Purdue University, 401 North Grant Street, West Lafayette, IN 47906, USA
| | - Qingyou Han
- Department of Mechanical Engineering Technology, Purdue University, 401 North Grant Street, West Lafayette, IN 47906, USA.
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