Molecular Understanding of Adhesion of Epoxy Resin to Graphene and Graphene Oxide Surfaces in Terms of Orbital Interactions

Molecular insights into adhesive mechanisms of phosphate-based dental adhesives on zirconia surfaces: effects of zirconia crystal structure

This paper analyses the adhesion mechanisms of phosphate-based dental adhesives to zirconia materials based on density functional theory (DFT). Zirconia can be a mixture of three crystal structures: monoclinic, tetragonal and cubic. We investigated how these crystal surfaces influence adhesion. On all crystal surfaces, proton transfer occurs from the phosphate group in the adhesive to the zirconia surface. Among the surfaces, the monoclinic surface exhibits the highest adhesive strength. Interfacial interactions involving charge transfer are observed at all adhesive interfaces, which are particularly significant on the monoclinic surface. This is attributed to the low-coordination number of zirconium atoms specific to the monoclinic surface. Moreover, the strong Lewis basicity of these low-coordination zirconium atoms induces structural changes in the methacryloyl group, which acts as polymerization sites in the adhesive. These findings provide valuable insights for guiding the design of zirconia-based dental materials.

Optimizing Epoxy Nanocomposites with Oxidized Graphene Quantum Dots for Superior Mechanical Performance: A Molecular Dynamics Approach

Due to their excellent mechanical properties, epoxy composites are widely used in low-density applications. However, the brittle epoxy matrix often serves as the principal failure point. Matrix enhancements can be achieved by optimizing polymer combinations to maximize intermolecular interactions or by introducing fillers. While nanofillers such as clay, rubber, carbon nanotubes, and nanoplatelets enhance mechanical properties, they can lead to issues like agglomeration, voids, and poor load transfer. Quantum dots, being the smallest nanofillers, offer higher dispersion and the potential to promote intermolecular interactions, enhancing stiffness, strength, and toughness simultaneously. This study employed molecular dynamics simulations to design graphene quantum dot (GQD) reinforced epoxy nanocomposites. By functionalizing GQDs with oxygen-based groups-hydroxyl, epoxide, carboxyl, and mixed chemistries-their effects on the mechanical properties of nanocomposites were systematically evaluated. Results show that hydroxyl-functionalized GQDs provide optimal performance, increasing stiffness and yield strength by 18.4 and 56.1%, respectively. Structural analysis reveals that these GQDs promote a closely packed molecular configuration, resulting in reduced free volume.

Molecular Mechanism of Physical and Mechanical Improvement in Graphene/Graphene Oxide-Epoxy Composite Materials

The performance provided by graphene (Gr) and graphene oxide (GO) additives can be improved by achieving strong adhesion and uniform dispersion in the epoxy resin matrix. In this study, molecular modeling and simulation of DGEBA/DETA based epoxy nanocomposites containing Gr and GO additives were performed. Density functional theory and molecular dynamics simulations were used to investigate interfacial interaction energies and Young's Modulus. Improvement in the interaction energies was studied by controlling the epoxy:hardener ratio, type and the number of oxygen-containing functional groups on the GO, the mass percentage of Gr/GO filler in the epoxy matrix, size and dispersion of GO in the cell. It was demonstrated that functional groups with up to 10 % oxygen content in GO significantly increase interfacial interaction energy for large size Gr/GO. Increasing DETA type amine ratio in the preparation of epoxy polymers increases the interaction energy for high oxygen content while decreasing the interaction energy for low oxygen content in GO for small size GO with edge functional groups. The performance of material dramatically decreased even at high DETA hardener and high GO mass percentages when the aggregation factor of Gr/GO was included in simulations that explain lower Gr/GO percentages in the experimental studies.

Density Functional Theory Study of Adhesion Mechanism between Epoxy Resins Cured with 4,4'-Diaminodiphenyl Sulfone and 4,4'-Diaminodiphenylmethane and Carboxyl Functionalized Carbon Fiber

The molecular mechanism of adhesion of two epoxy resins based on diglycidylether of bisphenol A (DGEBA) cured with 4,4'-diaminodiphenyl sulfone (DDS) and 4,4'-diaminodiphenylmethane (DDM) to the carbon fiber (CF) surface is investigated by employing density functional theory (DFT) calculations. The CF surface was modeled by the armchair-edge structure of graphite functionalized with carboxyl (COOH) groups. Two adhesion interfaces were constructed using the CF surface: one with the DGEBA-DDS molecule (CF/DGEBA-DDS interface) and the other with the DGEBA-DDM molecule (CF/DGEBA-DDM interface). The interfacial properties were analyzed by calculating the maximum adhesion stress (Smax) at the interface. The adhesion stress-displacement curve revealed that Smax is 1160.37 MPa, higher for the CF/DGEBA-DDS interface compared to the CF/DGEBA-DDM interface, which is 1060.48 MPa. The energy decomposition analysis showed a similar DFT contribution to adhesion stress for both interfaces, but the dispersion contribution is more significant at the CF/DGEBA-DDS interface. The crystal orbital Hamilton population (COHP) analysis revealed distinct interfacial interactions despite similar DFT contributions. Hydrogen bonding (H-bonding) between the functional groups at both interfaces including feeble OH-π interactions between the benzene rings of epoxy resins and COOH groups on the CF surface were observed. The orbital interaction energies calculated from integrated COHP, i.e., IpCOHP, revealed that the CF/DGEBA-DDS interface has six H-bonding interactions with large absolute IpCOHP values (>1 eV), whereas the CF/DGEBA-DDM interface has five. The interaction between the amine group of the DGEBA-DDM molecule and the CF surface has a large IpCOHP value among all interactions. The sulfone group being at the center of the DDS molecule and its strong surface interaction positioned the DGEBA-DDS molecule closer to the CF surface than the DGEBA-DDM molecule, enhancing dispersion interaction at the CF/DGEBA-DDS interface. Hence, the CF surface exhibits a stronger affinity toward the DGEBA-DDS molecule than the DGEBA-DDM molecule through dispersion interaction.

Thiourea as a "Polar Hydrophobic" Hydrogen-Bonding Motif: Application to Highly Durable All-Underwater Adhesion

Here, we report that, in contrast to urea, thiourea functions as a "polar hydrophobic" hydrogen-bonding motif. Although thiourea is more acidic than urea, thiourea exchanges its N-H protons with water at a rate that is 160 times slower than that for urea at 70 °C. This suggests that thiourea is much less hydrated than urea in an aqueous environment. What led us to this interesting principle was the serendipitous finding that self-healable poly(ether thiourea) adhered strongly to wet glass surfaces. This discovery enabled us to develop an exceptionally durable all-underwater adhesive that can maintain large adhesive strength for over a year even in seawater, simply by mechanically mixing three water-insoluble liquid components on target surfaces. Because thiourea is hydrophobic, its hydrogen-bonding networks within the adhesive structure and at the adhesive-target interface are presumed to be dehydrated. For comparison, a reference adhesive using urea as a representative "polar hydrophilic" hydrogen-bonding motif was durable for less than 4 days in water. Highly durable all-underwater adhesives are needed in various fields of marine engineering and biomedical sciences, but their development has been a major challenge because a hydration layer that spontaneously forms in water always inhibits adhesion.

Effects of Curing Agents on the Adhesion of Epoxy Resin to Copper: A Density Functional Theory Study

Epoxy resins are widely used adhesives in industrial fields. To use epoxy resin as an adhesive, it is necessary to mix the epoxy resin with a hardener. Hardeners have various functional groups and skeletons, and the properties of epoxy resins vary depending on the hardener. Although the adhesion of epoxy resins has been extensively studied using density functional theory (DFT) calculations, few studies have evaluated the effect of hardener molecules. Therefore, in this study, DFT calculations of adhesion energies and bonding structures on Cu (111) and Cu2O (111) surfaces are performed for model molecules of adducts of epoxy resin with hardeners having various functional groups and skeletons to evaluate the influence of the hardeners on the adhesion of epoxy resin to the metal surface. The adhesion energy to the Cu (111) surface is governed by the energy due to dispersion forces. Hardeners of the thiol type, which contain relatively heavy sulfur atoms, and hardeners with aromatic rings, displaying high planarity, enable the entire molecule to approach the metal surface, resulting in a relatively high adhesion strength. The calculations for the Cu2O (111) surface show the adhesion strength is more strongly influenced by interactions such as hydrogen bonds between the surface and adhesive molecules than by dispersion forces. Therefore, in adhesion to Cu2O (111), the benzylamine-epoxy adduct with hydrogen bonding and OH-π interactions with the surface, in addition to having a relatively flexible framework, shows a high adhesion strength.

Molecular Understanding of the Distinction between Adhesive Failure and Cohesive Failure in Adhesive Bonds with Epoxy Resin Adhesives

In the development of adhesives, an understanding of the fracture behavior of the bonded joints is inevitable. Two typical failure modes are known: adhesive failure and cohesive failure. However, a molecular understanding of the cohesive failure process is not as advanced as that of the adhesive failure process. In this study, research was developed to establish a molecular understanding of cohesive failure using the example of a system in which epoxy resin is bonded to a hydroxyl-terminated self-assembled monolayer (SAM) surface. Adhesive failure was modeled as a process in which an epoxy molecule is pulled away from the SAM surface. Cohesive failure, on the other hand, was modeled as the process of an epoxy molecule separating from another epoxy molecule on the SAM surface or breaking of a covalent bond within the epoxy resin. The results of the simulations based on the models described above showed that the results of the calculations using the model of cohesive failure based on the breakdown of intermolecular interactions agreed well with the experimental results in the literature. Therefore, it was suggested that the cohesive failure of epoxy resin adhesives is most likely due to the breakdown of intermolecular interactions between adhesive molecules. We further analyzed the interactions at the adhesive failure and cohesive failure interfaces and found that the interactions at the cohesive failure interface are mainly accounted for by dispersion forces, whereas the interactions at the adhesive failure interface involve not only dispersion forces but also various chemical interactions, including hydrogen bonds. The selectivity between adhesive failure and cohesive failure was explained by the fact that varying the functional group density affected the chemical interactions but not the dispersion forces.

Elucidating the Effects of Chemisorbed Water Molecules on the Adhesive Interactions of Epoxy Resin to γ-Alumina Surfaces

The adhesion mechanism of epoxy resin to the γ-alumina (110) surface was investigated using first-principles density functional theory (DFT). Aluminum materials are lightweight and are used in a wide range of industrial fields. Its surface is oxidized to alumina, and the stable surface is known as the γ-alumina (110) surface. The coverage of hydroxy groups by chemisorbed water molecules on this surface varied depending on the pretreatment temperature. In this study, we investigated the adhesive interactions of epoxy resin on four alumina surfaces with different densities of surface hydroxy groups (0, 3, 6, and 9 OH/nm2) and have discussed their effects. At each interface, the energy curves of the vertically displaced epoxy resin were calculated and the adhesive forces were estimated by differentiating these curves. As the coverage of the surface hydroxy groups increased from 0 to 6 OH/nm2, the adhesive strength gradually decreased. However, the adhesive strength at 9 OH/nm2 was relatively large and almost equal to that at 3 OH/nm2. This inverse volcano-type behavior was analyzed via the decomposition of adhesive forces and the crystal orbital Hamilton population (COHP). The decomposition of adhesive forces into DFT and dispersion components revealed that the inverse volcano-type behavior is derived from the DFT component, and the interfacial interactions owing to the DFT component are accompanied by charge transfer. These were investigated using a COHP analysis, which revealed that this behavior was caused by changes in the activity of the aluminum atoms on the surface and surface reconstruction by chemisorbed water molecules. It is noteworthy that the adhesive strength for 9 OH/nm2 was only 6.9% lower than that for 0 OH/nm2 wherein the chemisorbed water molecules were completely removed from the surface. These results are expected to provide a guideline for the adhesion of epoxy resin to aluminum materials.