Wettability Analysis of Water on Metal/Semiconductor Phases Selectively Structured with Femtosecond Laser-Induced Periodic Surface Structures

Wettability of Metals by Water

The wetting behavior of water on metal surfaces is important for a wide range of industries, for example, in the metallurgical industry during the preparation of metallic nanoparticles or electrochemical or electroless coating preparation from aqueous solutions, as well as in the construction industry (e.g., self-cleaning metal surfaces) and in the oil industry, in the case of water–oil separation or corrosion problems. Wettability in water/metal systems has been investigated in the literature; nevertheless, contradictions can be found in the results. Some papers have reported perfect wettability even in water/noble metal systems, while other researchers state that water cannot spread well on the surface of metals, and the contact angle is predicted at around 60°. The purpose of this paper is to resolve this contradiction and find correlations to predict the contact angle for a variety of metals. In our research, the wetting behavior of distilled water on the freshly polished surface of Ag, Au, Cu, Fe, Nb, Ni, Sn, Ti, and W substrates was investigated by the sessile drop method. The contact angle of the water on the metal was determined by KSV software. The contact angle of water is identified as being between 50° and 80°. We found that the contact angle of water on metals decreases linearly with increasing the atomic radius of the substrate. Using our new equation, the contact angle of water was identified on all of the metals in the periodic table. From the measured contact angle values, the adhesion energy of the distilled water/metal substrate interface was also determined and a correlation with the free electron density parameter of substrates was determined.