Intrinsically Black Polyimide with Retained Insulation and Thermal Properties: A Black Anthraquinone Derivative Capable of Linear Copolymerization

Preparation and Characterizations of Intrinsically Black Polyesterimide Films with Good Thermal Endurance at Elevated Temperatures for Potential Two-Layer Flexible Copper Clad Laminate Applications

Polymer films with combined properties of good thermoplasticity, good electrical properties, and good thermal endurance are highly required for two-layer flexible copper clad laminate (FCCL) applications. Meanwhile, the black appearance is also required for specific FCCL applications. Therefore, in the present work, a series of ester-linked polyimide (PEsI) films were designed and developed via the copolymerization chemistry of an ester-containing dianhydride of biphenyl dibenzoate-3,3',4,4'-tetracarboxylic acid dianhydride (BPTME), a rigid-rod dianhydride of 3,3',4,4'-biphenyltetracarboxylic acid dianhydride (BPDA), an ester-bridged diamine of 2-(4-aminobenzoate)-5-aminobiphenyl (ABABP), and a functional diamine of 4,4'-iminodianiline (NDA). The molar proportion of the BPTME/BPDA was fixed to be 20:80 and that of ABABP/NDA increased from 50:50 for PEsI-1 to 0:100 for PEsI-VI. The afforded PEsI films showed obviously enhanced blackness with the increasing molar ratio of NDA in the polymers. The PEsI-VI film exhibited the optical transmittance values of 0 and 27.4% at the wavelength of 500 nm (T500) and 760 nm (T760), respectively. The values were apparently lower than those of the standard PI-ref produced from common pyromellitic dianhydride (PMDA) and 4,4'-oxydianiline (ODA) (T500 = 63.2%; T760 = 86.3%). Meanwhile, the PEsI-V film showed good blackness with the CIE Lab optical parameters of 1.83 for L*, 11.46 for a*, 3.13 for b*, and 0 for haze. The PEsI samples exhibited good thermoplasticity and the storage and loss modulus of the films rapidly decreased around the glass transition temperatures (Tg) in the dynamic mechanical analysis (DMA) tests. The PEsI samples revealed the Tg values from 247.2 °C to 286.1 °C in the differential scanning calorimetry (DSC) measurements. The PEsI samples exhibited the linear coefficients of thermal expansion (CTE) of (27.1~33.4) × 10-6/K from 50 to 250 °C, which was comparable to that of the PI-ref sample (CTE = 29.5 × 10-6/K), however, a bit higher than that of the copper foil (CTE = 17.0 × 10-6/K).

Synthesis and Characterization of Polyimide with High Blackness and Low Thermal Expansion by Introducing 3,6-bis(thiophen-2-yl)diketopyrrolopyrrole-Based Chromophores

The market demand for black polyimide (BPI) has grown hugely in the field of flexible copper-clad laminates (FCCLs) as a replacement for transparent yellow polyimide. The 3,6-bis(thiophen-2-yl)diketopyrrolopyrroles (TDPP) derivative is recognized for its high molar extinction coefficient. In this research, we have synthesized a diamine monomer named 3,6-bis[5-(4-amino-3-fluorophenyl)thiophen-2-yl]-2,5-bis(2-ethylhexyl)pyrrolo[4,3-c]pyrrole-1,4-dione (DPPTENFPDA), featuring a TDPP unit attached by fluorinated benzene rings. The subsequent reaction of DPPTENFPDA with pyromellitic dianhydride (PMDA) yielded an inherent BPI (DPPTENFPPI). By introducing chromophores derived from TDPP, the light absorption spectrum of DPPTENFPPI was broadened and red-shifted, thereby achieving full absorption within the visible spectrum and producing a highly black color that has a cut-off wavelength (λcut) of 717 nm and a CIE-Lab coordinate L* of 0.86. Additionally, DPPTENFPPI exhibited a low coefficient of thermal expansion (CTE) and remarkable thermal and electrical performance. Density functional theory calculations were conducted to explore the electronic nature of DPPTENFPPI. The outcomes revealed that the excellent light absorption of DPPTENFPPI predominantly originates from the transition from HOMO to LUMO + 1 within the chromophore moiety. The FCCL made from DPPTENFPPI films has high solder heat resistance and peel strength. This research contributes valuable insights into the structure and design of high-performance intrinsically black PIs for microelectronics applications.

Anthraquinones-based photocatalysis: A comprehensive review

In recent years, there has been significant interest in photocatalytic technologies utilizing semiconductors and photosensitizers responsive to solar light, owing to their potential for energy and environmental applications. Current efforts are focused on enhancing existing photocatalysts and developing new ones tailored for environmental uses. Anthraquinones (AQs) serve as redox-active electron transfer mediators and photochemically active organic photosensitizers, effectively addressing common issues such as low light utilization and carrier separation efficiency found in conventional semiconductors. AQs offer advantages such as abundant raw materials, controlled preparation, excellent electron transfer capabilities, and photosensitivity, with applications spanning the energy, medical, and environmental sectors. Despite their utility, comprehensive reviews on AQs-based photocatalytic systems in environmental contexts are lacking. In this review, we thoroughly describe the photochemical properties of AQs and their potential applications in photocatalysis, particularly in addressing key environmental challenges like clean energy production, antibacterial action, and pollutant degradation. However, AQs face limitations in practical photocatalytic applications due to their low electrical conductivity and solubility-related secondary contamination. To mitigate these issues, the design and synthesis of graphene-immobilized AQs are highlighted as a solution to enhance practical photocatalytic applications. Additionally, future research directions are proposed to deepen the understanding of AQs' theoretical mechanisms and to provide practical applications for wastewater treatment. This review aims to facilitate mechanistic studies and practical applications of AQs-based photocatalytic technologies and to improve understanding of these technologies.

The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide

Polyimide (PI) with ultra-high thermal resistance and stability is essential for application as a flexible substrate in electronic devices. Here, the Upilex-type polyimides, which contained flexibly "twisted" 4,4'-oxydianiline (ODA), have achieved various performance improvements via copolymerization with a diamine containing benzimidazole structure. With the rigid benzimidazole-based diamine bearing conjugated heterocyclic moieties and hydrogen bond donors fused into the PI backbone, the benzimidazole-containing PI showed outstanding thermal, mechanical, and dielectric performance. Specifically, the PI containing 50% bis-benzimidazole diamine achieved a 5% decomposition temperature at 554 °C, an excellent high glass transition temperature of 448 °C, and a coefficient of thermal expansion lowered to 16.1 ppm/K. Meanwhile, the tensile strength and modulus of the PI films containing 50% mono-benzimidazole diamine increased to 148.6 MPa and 4.1 GPa, respectively. Due to the synergistic effect of rigid benzimidazole and hinged, flexible ODA, all PI films exhibited an elongation at break above 4.3%. The electrical insulation of the PI films was also improved with a dielectric constant lowered to 1.29. In summary, with appropriate mixing of rigid and flexible moieties in the PI backbone, all the PI films showed superior thermal stability, excellent flexibility, and acceptable electrical insulation.

Overall Improvement in Dielectric, Water Resistance and Mechanical Properties of Polyimide Film via Synergy between GO and Sandwich-type Porous Structure

Simultaneous improvement in dielectric, water resistance and mechanical properties of polyimide (PI) films is critical for their practical use, but difficult to achieve. Herein, a sandwich-type porous GO/PI film with excellent comprehensive properties was obtained through integrating a GO-containing complex, fluorine-containing porous structure and sandwich-type distribution of porous structure by a simple, low-cost and green breath figure method. With the addition of only a small amount of GO-containing complex, a low dielectric constant of 2.21, water absorption of 0.51%, increment in dielectric constant after moisture treatment of 1.60% and high tensile strength of 113.1 MPa, tensile modulus of 1.70 GPa, with 35.39%, 79.42%, 81.81% of reduction and 17.22%, 21.43% of increase compared to PI film were shown, respectively. Moreover, these properties could be adjusted through regulating the component and porous structure by changing the parameters of breath figure method. These outstanding properties make the film a promising candidate for high-performance low-dielectric materials.

Optical and Flame-Retardant Properties of a Series of Polyimides Containing Side Chained Bulky Phosphaphenanthrene Units

Among the multitude of polymers with carbon-based macromolecular architectures that easily ignite in certain applications where short circuits may occur, polyimide has evolved as a class of polymers with high thermal stability while exhibiting intrinsic flame retardancy at elevated temperatures via a char-forming mechanism. However, high amounts of aromatic rings in the macromolecular backbone are required for these results, which may affect other properties such as film-forming capacity or mechanical properties; thus, much work has been done to structurally derivatize or make hybrid polyimide systems. In this respect, flexible polyimide films (PI(1–4)) containing bulky 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) units have been developed starting from commercial dianhydrides and an aromatic diamine containing two side chain bulky DOPO groups. The chemical structure of PI(1–4)) was characterized by 1H NMR, 13C NMR and 31P NMR spectroscopy. The optical properties, including absorption and luminescence spectra of these polymers, were analyzed. All polyimides containing DOPO derivatives emitted blue light with an emission maxima in the range of 340–445 nm, in solvents such as N,N-dimethylformamide, N-methyl-2-pyrrolidone, chloroform, and N,N-dimethylacetamide, while green light emission (λem = 487 nm for PI-4) was evidenced in a thin-film state. The thermal decomposition mechanism and flame-retardant behavior of the resulting materials were investigated by pyrolysis-gas-chromatography spectrometry (Py-GC), scanning electron microscopy (SEM), EDX maps and FTIR spectroscopy. The residues resulting from the TGA experiments were examined by SEM microscopy images and FTIR spectra to understand the pyrolysis mechanism.

Preparation and Properties of Intrinsically Black Polyimide Films with CIE Lab Color Parameters Close to Zero and High Thermal Stability for Potential Applications in Flexible Printed Circuit Boards

Black polymer films with high thermal stability are highly desired in flexible electrical and electronic fields. Conventional black polymer films based on high-temperature resistant polymers and black inorganic dyes are usually suffered from the poor electrical and tensile properties. In the current work, a series of intrinsically black polyimide (BPI) films with International Commission on Illumination (CIE) Lab optical parameters close to zero and high thermal stability have been designed and prepared. For this purpose, an electron-rich aromatic diamine, 4,4′-iminodianiline (NDA), was copolymerized with 1,4-phenylenediamine (PDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (sBPDA) to afford a series of poly(amic acid) (PAA) solutions, which were then thermally dehydrated to provide the final BPI films at elevated temperatures up to 400 °C in air. The molar fraction of NDA in the total diamine monomers was 0 for BPI-0 (sBPDA-PDA), 10% for BPI-1, 20% for BPI-2, 30% for BPI-3, 40% for BPI-4, 50% for BPI-5, and 100% for BPI-6. For comparison, two referenced polyimide (PI) films, including PI-ref1 and PI-ref2, were prepared according to a similar procedure. The former was derived from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA) and the latter was from PMDA and NDA. The BPI films exhibited an increasing degree of blackness with the increasing contents of NDA units in the polymer films. For example, the BPI-6 (sBPDA-NDA) film exhibited the optical transmittance of 1.4% at a wavelength of 650 nm (T₆₅₀), which was obviously lower than those of PI-ref1 (T₆₅₀ = 74.6%) and PI-ref2 (T₆₅₀ = 3.6%). In addition, the BPI-6 film showed the CIE Lab parameters of 0.39 for L*, 2.65 for a*, 0.66 for b*, and haze of 1.83, which was very close to the criterion of “pure blackness” for polymer films (L* = a* = b* = 0). At last, incorporation of the NDA units in the rigid-rod BPI-0 (BPDA-PDA) film slightly deteriorated the high-temperature dimensional stability of the derived BPI films. BPI-6 film showed a linear coefficient of thermal expansion (CTE) value of 34.8 × 10⁻⁶/K in the temperature range of 50 to 250 °C, which was higher than those of the BPI-0 (CTE = 12.3 × 10⁻⁶/K), PI-ref1 (CTE = 29.5 × 10⁻⁶/K), and PI-ref2 (CTE = 18.8 × 10⁻⁶/K) films. Nevertheless, the BPI films maintained good thermal stability with the 5% weight loss temperatures (T_5%) higher than 590 °C, and the glass transition temperatures (T_g) higher than 340 °C.

Progress in Aromatic Polyimide Films for Electronic Applications

Aromatic polyimides have excellent thermal stability, mechanical strength and toughness, high electric insulating properties, low dielectric constants and dissipation factors, and high radiation and wear resistance, among other properties, and can be processed into a variety of materials, including films, fibers, carbon fiber composites, engineering plastics, foams, porous membranes, coatings, etc. Aromatic polyimide materials have found widespread use in a variety of high-tech domains, including electric insulating, microelectronics and optoelectronics, aerospace and aviation industries, and so on, due to their superior combination characteristics and variable processability. In recent years, there have been many publications on aromatic polyimide materials, including several books available to readers. In this review, the representative progress in aromatic polyimide films for electronic applications, especially in our laboratory, will be described.