Xiao P, He X, Lu Q. Exceptionally High-Temperature-Resistant Kapton-Type Polyimides with
Tg > 520 °C: Synthesis via Incorporation of Spirobis(indene)-bis(benzoxazole)-Containing Diamines.
Polymers (Basel) 2025;
17:832. [PMID:
40219223 PMCID:
PMC11991488 DOI:
10.3390/polym17070832]
[Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/04/2025] [Revised: 03/17/2025] [Accepted: 03/19/2025] [Indexed: 04/14/2025] Open
Abstract
Polyimides (PIs), recognized for their exceptional thermal stability, are extensively employed in advanced applications, including aerospace, flexible displays, flexible solar cells, flame-retardant materials, and high-temperature filtration materials. However, with the continuous advancements in science and technology, the demand for improved thermal performance of PIs in these application areas has increased significantly. In this study, four spirobis(indene)-bis(benzoxazole) diamine monomers (5a, 5aa, 5b and 5bb) were designed and synthesized. These monomers were copolymerized with pyromellitic dianhydride (PMDA) and 4,4-diaminodiphenylmethane (ODA) to develop Kapton-type PIs. By varying the copolymerization molar ratios of the different diamines, a series of novel ultrahigh-temperature-resistant PI films were successfully prepared, and it was found that incorporating a highly rigid and twisted spirobis(indene)-bis(benzoxazole) structure into the PI matrix enhances the rigidity of the polymer chains and restricts their mobility, thereby significantly improving the thermal performance of the PI films. When 5a and ODA were copolymerized at molar ratios of 1:9 and 4:6, the glass transition temperature (Tg) of Kapton-type films significantly increased from 396 °C to 467 °C and >520 °C, respectively. These PI films also exhibit exceptional mechanical properties, with the modulus increasing from 1.6 GPa to 4.7 GPa, while demonstrating low dielectric performance, as evidenced by a decrease in the dielectric constant (Dk) from 3.51 to 3.08 under a 10 GHz high-frequency electric field. Additionally, molecular dynamics simulations were employed to further explore the relationships between polymer molecular structure, condensed states, and film properties, providing theoretical guidance for the development of polymers with ultrahigh thermal resistance and superior overall performance.
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