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For: Nain A, Wei SC, Lin YF, Tseng YT, Mandal RP, Huang YF, Huang CC, Tseng FG, Chang HT. Copper Sulfide Nanoassemblies for Catalytic and Photoresponsive Eradication of Bacteria from Infected Wounds. ACS Appl Mater Interfaces 2021;13:7865-7878. [PMID: 33586966 DOI: 10.1021/acsami.0c18999] [Citation(s) in RCA: 28] [Impact Index Per Article: 7.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/12/2023]
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