Printable Self-Activated Liquid Metal Stretchable Conductors from Polyvinylpyrrolidone-Functionalized Eutectic Gallium Indium Composites

High internal phase emulsions gel ink for direct-ink-writing 3D printing of liquid metal

3D printing of liquid metal remains a big challenge due to its low viscosity and large surface tension. In this study, we use Carbopol hydrogel and liquid gallium-indium alloy to prepare a liquid metal high internal phase emulsion gel ink, which can be used for direct-ink-writing 3D printing. The high volume fraction (up to 82.5%) of the liquid metal dispersed phase gives the ink excellent elastic properties, while the Carbopol hydrogel, as the continuous phase, provides lubrication for the liquid metal droplets, ensuring smooth flow of the ink during shear extrusion. These enable high-resolution and shape-stable 3D printing of three-dimensional structures. Moreover, the liquid metal droplets exhibit an electrocapillary phenomenon in the Carbopol hydrogel, which allows for demulsification by an electric field and enables electrical connectivity between droplets. We have also achieved the printing of ink on flexible, non-planar structures, and demonstrated the potential for alternating printing with various materials.

Recent progress in multifunctional, reconfigurable, integrated liquid metal-based stretchable sensors and standalone systems

Possessing a unique combination of properties that are traditionally contradictory in other natural or synthetical materials, Ga-based liquid metals (LMs) exhibit low mechanical stiffness and flowability like a liquid, with good electrical and thermal conductivity like metal, as well as good biocompatibility and room-temperature phase transformation. These remarkable properties have paved the way for the development of novel reconfigurable or stretchable electronics and devices. Despite these outstanding properties, the easy oxidation, high surface tension, and low rheological viscosity of LMs have presented formidable challenges in high-resolution patterning. To address this challenge, various surface modifications or additives have been employed to tailor the oxidation state, viscosity, and patterning capability of LMs. One effective approach for LM patterning is breaking down LMs into microparticles known as liquid metal particles (LMPs). This facilitates LM patterning using conventional techniques such as stencil, screening, or inkjet printing. Judiciously formulated photo-curable LMP inks or the introduction of an adhesive seed layer combined with a modified lift-off process further provide the micrometer-level LM patterns. Incorporating porous and adhesive substrates in LM-based electronics allows direct interfacing with the skin for robust and long-term monitoring of physiological signals. Combined with self-healing polymers in the form of substrates or composites, LM-based electronics can provide mechanical-robust devices to heal after damage for working in harsh environments. This review provides the latest advances in LM-based composites, fabrication methods, and their novel and unique applications in stretchable or reconfigurable sensors and resulting integrated systems. It is believed that the advancements in LM-based material preparation and high-resolution techniques have opened up opportunities for customized designs of LM-based stretchable sensors, as well as multifunctional, reconfigurable, highly integrated, and even standalone systems.

Room-Temperature Liquid Metals for Flexible Electronic Devices

Room-temperature gallium-based liquid metals (RT-GaLMs) have garnered significant interest recently owing to their extraordinary combination of fluidity, conductivity, stretchability, self-healing performance, and biocompatibility. They are ideal materials for the manufacture of flexible electronics. By changing the composition and oxidation of RT-GaLMs, physicochemical characteristics of the liquid metal can be adjusted, especially the regulation of rheological, wetting, and adhesion properties. This review highlights the advancements in the liquid metals used in flexible electronics. Meanwhile related characteristics of RT-GaLMs and underlying principles governing their processing and applications for flexible electronics are elucidated. Finally, the diverse applications of RT-GaLMs in self-healing circuits, flexible sensors, energy harvesting devices, and epidermal electronics, are explored. Additionally, the challenges hindering the progress of RT-GaLMs are discussed, while proposing future research directions and potential applications in this emerging field. By presenting a concise and critical analysis, this paper contributes to the advancement of RT-GaLMs as an advanced material applicable for the new generation of flexible electronics.

Fast and Facile Liquid Metal Printing via Projection Lithography for Highly Stretchable Electronic Circuits

Soft electronic circuits are crucial for wearable electronics, biomedical technologies, and soft robotics, requiring soft conductive materials with high conductivity, high strain limit, and stable electrical performance under deformation. Liquid metals (LMs) have become attractive candidates with high conductivity and fluidic compliance, while effective manufacturing methods are demanded. Digital light processing (DLP)-based projection lithography is a high-resolution and high-throughput printing technique for primarily polymers and some metals. If LMs can be printed with DLP as well, the entire soft devices can be fabricated by one printer in a streamlined and highly efficient process. Herein, fast and facile DLP-based LM printing is achieved. Simply with 5-10 s of patterned ultraviolet (UV)-light exposure, a highly conductive and stretchable pattern can be printed using a photo-crosslinkable LM particle ink. The printed eutectic gallium indium traces feature high resolution (≈20 µm), conductivity (3 × 106 S m-1 ), stretchability (≈2500%), and excellent stability (consistent performance at different deformation). Various patterns are printed in diverse material systems for broad applications including stretchable displays, epidermal strain sensors, heaters, humidity sensors, conformal electrodes for electrography, and multi-layer actuators. The facile and scalable process, excellent performance, and diverse applications ensure its broad impact on soft electronic manufacturing.

In Situ Actuators with Gallium Liquid Metal Alloys and Polypyrrole-Coated Electrodes

Gallium liquid metal alloys (GLMAs) such as Galinstan and gallium-indium eutectic (EGaIn) are interesting materials due to their high surface tensions, low viscosities, and electrical conductivities comparable to classical solid metals. They have been used for applications in microelectromechanical systems (MEMS) and, more recently, liquid metal microfluidics (LMMF) for setting up devices like actuators. However, their high tendency to alloy with the most common metals used for electrodes such as gold (Au), platinum (Pt), titanium (Ti), nickel (Ni), and tungsten-titanium (WTi) is a major problem limiting the scaleup and applicability, e.g., liquid metal actuators. Stable electrodes are key elements for many applications and thus, the lack of an electrode material compatible with GLMAs is detrimental for many potential application scenarios. In this work, we study the effect of actuating Galinstan on various solid metal electrodes and present an electrode protection methodology that, first, prevents alloying and, second, prevents electrode corrosion. We demonstrate reproducible actuation of GLMA segments in LMMF, showcasing the stability of the proposed protective coating. We investigated a range of electrode materials including Au, Pt, Ti, Ni, and WTi, all in aqueous environments, and present the resulting corrosion/alloying effects by studying the interface morphology. Our proposed protective coating is based on a simple method to electrodeposit electrically conductive polypyrrole (PPy) on the electrodes to provide a conductive alloying-barrier layer for applications involving direct contact between GLMAs and electrodes. We demonstrate the versatility of this approach by direct three-dimensional (3D) printing of a 500 μm microfluidic chip on a set of electrodes onto which PPy is electrodeposited in situ for actuation of Galinstan plugs. The developed protection protocol will provide a generic, widely applicable strategy to protect a wide range of electrodes from alloying and corrosion and thus form a key element in future applications of GLMAs.

Recent progress in fiber-based soft electronics enabled by liquid metal

Soft electronics can seamlessly integrate with the human skin which will greatly improve the quality of life in the fields of healthcare monitoring, disease treatment, virtual reality, and human-machine interfaces. Currently, the stretchability of most soft electronics is achieved by incorporating stretchable conductors with elastic substrates. Among stretchable conductors, liquid metals stand out for their metal-grade conductivity, liquid-grade deformability, and relatively low cost. However, the elastic substrates usually composed of silicone rubber, polyurethane, and hydrogels have poor air permeability, and long-term exposure can cause skin redness and irritation. The substrates composed of fibers usually have excellent air permeability due to their high porosity, making them ideal substrates for soft electronics in long-term applications. Fibers can be woven directly into various shapes, or formed into various shapes on the mold by spinning techniques such as electrospinning. Here, we provide an overview of fiber-based soft electronics enabled by liquid metals. An introduction to the spinning technology is provided. Typical applications and patterning strategies of liquid metal are presented. We review the latest progress in the design and fabrication of representative liquid metal fibers and their application in soft electronics such as conductors, sensors, and energy harvesting. Finally, we discuss the challenges of fiber-based soft electronics and provide an outlook on future prospects.

Conformally Adhesive, Large-Area, Solidlike, yet Transient Liquid Metal Thin Films and Patterns via Gelatin-Regulated Droplet Deposition and Sintering

Adhesion and spreading of liquid metals (LMs) on substrates are essential steps for the generation of flexible electronics and thermal management devices. However, the controlled deposition is limited by the high surface tension and peculiar wetting and adhesion behavior of LMs. Herein, we introduce gelatin-regulated LM droplet deposition and sintering (GLMDDS), for the upscalable production of conformally adhesive, solidlike, yet transient LM thin films and patterns on diverse substrates. This method involves four steps: homogeneous deposition of LM microdroplets, gelation of the LM-gelatin solution, toughening of the gelatin hydrogel by solvent displacement, and peeling-induced sintering of LM microdroplets. The LM thin film exhibits a three-layer structure, comprising an LM microdroplet-embedded tough organohydrogel adhesion layer, a continuous LM layer, and an oxide skin. The composite exhibits high stretchability and mechanical robustness, conformal adhesion to various substrates, high conductivity (4.35 × 10⁵ S·m^-1), and transience (86% LM recycled). Large-scale deposition (i.e., 5.6 dm²) and the potential for patterns on diverse substrates demonstrate its upscalability and broad suitability. Finally, the LM thin films and patterns are applied for flexible and wearable devices, i.e., pressure sensors, heaters, human motion tracking devices, and thermal management devices, illustrating the broad applicability of this strategy.