Facile Strategy for Constructing Highly Thermally Conductive Epoxy Composites Based on a Salt Template-Assisted 3D Carbonization Nanohybrid Network

Constructing binder-free 3D thermal networks with hexagonal boron nitride of varying sizes to enhance polydimethylsiloxane composites: a comparative study

As electronic devices become more compact and power-dense, the demand for efficient thermal management materials continues to rise. To address the common issues in conventional thermally conductive composites-namely, poor filler dispersion, high interfacial thermal resistance caused by binders, and complex fabrication processes-this study proposes a novel strategy for constructing binder-free three-dimensional hexagonal boron nitride thermal networks (3D BN) within a polydimethylsiloxane (PDMS) matrix. By leveraging the decomposition behavior of ammonium bicarbonate (NH4HCO3), this approach enables the fabrication of composites with enhanced thermal conductivity and simplified processing. The 3D BN/PDMS composites were prepared via a straightforward process involving blending, cold pressing, drying, and vacuum impregnation. Characterization and testing reveal that the 3D BN thermal network and BN particle size are critical factors influencing the composites' TCs. The resulting 3D BN/PDMS composites exhibit an outstanding TC of 3.889 W m-1 K-1 when the BN particle size is 20 μm and the filler content is 40.70 vol%. This study offers a novel approach to designing and developing high-performance thermally conductive composites, with significant potential for practical applications.

Graphene-based polymer composites in thermal management: materials, structures and applications

Graphene, with its high thermal conductivity (k), excellent mechanical properties, and thermal stability, is an ideal filler for developing advanced high k and heat dissipation materials. However, creating graphene-based polymer nanocomposites (GPNs) with high k remains a significant challenge to meet the demand for efficient heat dissipation. Here, the effects of graphene material and structure on thermal properties are investigated from both microscopic and macroscopic perspectives. Initially, it briefly introduces the influence of graphene structural parameters on its intrinsic k, along with summarizing methods to adjust these parameters. Various techniques for establishing different thermal conductivity pathways at the macroscopic scale (including filler hybridization, 3D networks, horizontal alignment, and vertical alignment) are reviewed, along with their respective advantages and disadvantages. Furthermore, we discuss the applications of GPNs as thermal interface materials (TIMs), phase change materials (PCMs), and smart responsive thermal management materials in the field of thermal management. Finally, the current challenges and future perspectives of GPN research are discussed. This review offers researchers a comprehensive overview of recent advancements in GPNs for thermal management and guidance for developing the next generation of thermally conductive polymer composites.

Rapid Thermochromic and Highly Thermally Conductive Nanocomposite Based on Silicone Rubber for Temperature Visualization Thermal Management in Electronic Devices

Effective heat dissipation and real-time temperature monitoring are crucial for ensuring the long-term stable operation of modern, high-performance electronic products. This study proposes a silicon rubber polydimethylsiloxane (PDMS)-based nanocomposite with a rapid thermal response and high thermal conductivity. This nanocomposite enables both rapid heat dissipation and real-time temperature monitoring for high-performance electronic products. The reported material primarily consists of a thermally conductive layer (Al2O3/PDMS composites) and a reversible thermochromic layer (organic thermochromic material, graphene oxide, and PDMS nanocoating; OTM-GO/PDMS). The thermal conductivity of OTM-GO/Al2O3/PDMS nanocomposites reached 4.14 W m-1 K-1, reflecting an increase of 2200% relative to that of pure PDMS. When the operating temperature reached 35, 45, and 65 °C, the surface of OTM-GO/Al2O3/PDMS nanocomposites turned green, yellow, and red, respectively, and the thermal response time was only 30 s. The OTM-GO/Al2O3/PDMS nanocomposites also exhibited outstanding repeatability and maintained excellent color stability over 20 repeated applications.

Facile and Scalable Strategy for Fabricating Highly Thermally Conductive Epoxy Composites Utilizing 3D Graphitic Carbon Nitride Nanosheet Skeleton

The application of high-performance thermal interface materials (TIMs) for thermal management is commonly used to tackle the problem of heat accumulation, which influences the performance and reliability of microelectronic devices. Herein, a novel three-dimensional (3D) carbon nitride nanosheet (CNNS)/epoxy composite with high thermal conductivity was developed by introducing 3D CNNS skeleton fillers prepared by a facile and scalable strategy assisted by a salt template. Benefiting from the continuous heat transfer pathways formed in the CNNS skeleton, 17.0 wt % 3D CNNS/epoxy composites achieve a superior thermal conductivity of 1.27 W/m·K, which is 6.35 and 1.57 times higher than those of epoxy resin and convention CNNS/epoxy, respectively. With the aid of theoretical model analysis and finite element simulation, the pronounced enhancement effect of the 3D CNNS skeleton on the thermal conductivity of epoxy composites is found to be attributed to the continuous 3D CNNS thermally conductive network, the diminished CNNS-CNNS interfacial thermal resistance, and the effective interfacial interactions between epoxy and CNNS. In addition, the 3D CNNS/epoxy composites possess high electrical insulation and desirable mechanical strength. Therefore, 3D CNNS/epoxy composites are promising TIMs for advanced electronic thermal management.