Direct Writing of Silver Nanowire Patterns with Line Width down to 50 μm and Ultrahigh Conductivity

High-Precision Printing Sandwich Flexible Transparent Silver Mesh for Tunable Electromagnetic Interference Shielding Visualization Windows

Flexible transparent conductive films (FTCFs) with electromagnetic interference (EMI) shielding performance are increasingly crucial as visualization windows in optoelectronic devices due to their capabilities to block electromagnetic radiation (EMR) generated during operation. Metal mesh-based FTCFs have emerged as a promising representative in which EMI shielding effectiveness (SE) can be enhanced by increasing the line width, reducing the line spacing, or increasing mesh thickness. However, these conventional approaches decrease optical transmittance or increase material consumption, thus compromising the optical performance and economic viability. Hence, a significant challenge still remains in the realm of metal mesh-based FTCFs to enhance EMI SE while maintaining their original optical transmittance and equivalent material usage. Herein, we propose an innovative symmetric structural optimization strategy to create silver mesh-based sandwich-FTCFs with arbitrary customized sizes through high-precision extrusion printing technology for tunable EMI shielding performance. The meticulous adjustment of xy-axis offsets and printing starting point ensures perfect alignment of the silver mesh on both sides of the transparent substrate. This approach yields sandwich-FTCFs with optical transmittance equivalent to single-layer-FTCFs under identical parameters while simultaneously achieving up to 40% enhanced EMI SE. This improvement stems from the synergistic effect of multiple internal reflections and wave interference between the symmetric silver meshes. The excellent shielding performance of sandwich-FTCFs is evidenced through effectively blocking electromagnetic waves from common devices such as mobile phones, Bluetooth earphones, and smartwatches. Our work represents a significant advancement in balancing optical transmittance, EMI SE, and material efficiency in high-performance and cost-effective FTCFs.

Wet Film Leveling for Promoting the Uniformity and Conductivity of Silver Nanowire Transparent Electrode

Wet film leveling can greatly promote film uniformity. However, in the field of metal nanowire, wet film leveling is rarely mentioned. For low-viscosity inks like metal nanowire ink, how to realize wet film leveling is still unclear. Herein, we study the wet film leveling of silver nanowire ink and systematically investigate the relationship between leveling effect and influence factors: (1) there is a uniformity-promotion limit for traditional methods, while wet film leveling can break through this limit and further promote the film uniformity; (2) for wet film leveling, lowering ink's surface tension has no effect, and eliminating surface tension gradient by high-surface-tension leveling agent is the main task; (3) leveling process includes wet film destruction process and ink reflow process; (4) in the destruction process, the leveling-agent solubility and quantity dominate the leveling effect, while the influence of surface tension is little; (5) for solubility and quantity, there is a suitable range to realize optimum leveling effect, and the leveling effect exhibits a contrary relationship with the solubility in a suitable range (2-11%); (6) in the reflow process, the main influence factor is ink viscosity, and the leveling effect exhibits a contrary relationship with ink viscosity. After being leveled by 1.5% n-pentanol, the sheet resistance and sheet-resistance variation coefficient of film decrease from 38.3 Ω/sq/3.83% to 25.7 Ω/sq/1.88%. Further study reveals that the film improvement is not from the ink wettability and drying. Above theoretical results possess certain universality for film preparation by a wet process and can be used by the science and industry field.