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Kim SH, Shin SJ, Bhandarkar SD, Baumann TF. Preparation of Macroscopic Low-Density Gold Foams with Good Machinability. FUSION SCIENCE AND TECHNOLOGY 2023. [DOI: 10.1080/15361055.2023.2173514] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 03/18/2023]
Affiliation(s)
- Sung Ho Kim
- Lawrence Livermore National Laboratory, 7000 East Avenue, Livermore, California 94550
| | - Swanee J. Shin
- Lawrence Livermore National Laboratory, 7000 East Avenue, Livermore, California 94550
| | - Suhas D. Bhandarkar
- Lawrence Livermore National Laboratory, 7000 East Avenue, Livermore, California 94550
| | - Theodore F. Baumann
- Lawrence Livermore National Laboratory, 7000 East Avenue, Livermore, California 94550
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Shin JH, Park JH, Seo J, Im TH, Kim JC, Lee HE, Kim DH, Woo KY, Jeong HY, Cho YH, Kim TS, Kang IS, Lee KJ. A Flash-Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin-Film μLEDs. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2021; 33:e2007186. [PMID: 33634556 DOI: 10.1002/adma.202007186] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/21/2020] [Revised: 12/18/2020] [Indexed: 05/04/2023]
Abstract
A robust Cu conductor on a glass substrate for thin-film μLEDs using the flash-induced chemical/physical interlocking between Cu and glass is reported. During millisecond light irradiation, CuO nanoparticles (NPs) on the display substrate are transformed into a conductive Cu film by reduction and sintering. At the same time, intensive heating at the boundary of CuO NPs and glass chemically induces the formation of an ultrathin Cu2 O interlayer within the Cu/glass interface for strong adhesion. Cu nanointerlocking occurs by transient glass softening and interface fluctuation to increase the contact area. Owing to these flash-induced interfacial interactions, the flash-activated Cu electrode exhibits an adhesion energy of 10 J m-2 , which is five times higher than that of vacuum-deposited Cu. An AlGaInP thin-film vertical μLED (VLED) forms an electrical interconnection with the flash-induced Cu electrode via an ACF bonding process, resulting in a high optical power density of 41 mW mm-2 . The Cu conductor enables reliable VLED operation regardless of harsh thermal stress and moisture infiltration under a high-temperature storage test, temperature humidity test, and thermal shock test. 50 × 50 VLED arrays transferred onto the flash-induced robust Cu electrode show high illumination yield and uniform distribution of forward voltage, peak wavelength, and device temperature.
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Affiliation(s)
- Jung Ho Shin
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Jung Hwan Park
- Department of Mechanical Engineering (Department of Aeronautics, Mechanical and Electronic Convergence Engineering), Kumoh National Institute of Technology, 61 Daehak-ro, Gumi, Gyeongbuk, 39177, Republic of Korea
| | - Jeongmin Seo
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Tae Hong Im
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Jong Chan Kim
- UNIST Central Research Facilities (UCRF) and School of Materials Science and Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan, 44919, Republic of Korea
| | - Han Eol Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Do Hyun Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Kie Young Woo
- Department of Physics, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Hu Young Jeong
- UNIST Central Research Facilities (UCRF) and School of Materials Science and Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan, 44919, Republic of Korea
| | - Yong-Hoon Cho
- Department of Physics, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Taek-Soo Kim
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Il-Suk Kang
- National Nanofab Center, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Keon Jae Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
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Kim SH, Jackson JA, Oakdale JS, Forien JB, Lenhardt JM, Yoo JH, Shin SJ, Lepró X, Moran BD, Aracne-Ruddle CM, Baumann TF, Jones OS, Biener J. A simple, highly efficient route to electroless gold plating on complex 3D printed polyacrylate plastics. Chem Commun (Camb) 2018; 54:10463-10466. [DOI: 10.1039/c8cc05368e] [Citation(s) in RCA: 9] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/21/2022]
Abstract
We develop a simple, highly efficient route to electroless gold plating on complex 3D printed polyacrylate plastics.
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Affiliation(s)
- Sung Ho Kim
- Lawrence Livermore National Laboratory
- Livermore
- USA
| | | | | | | | | | | | | | - Xavier Lepró
- Lawrence Livermore National Laboratory
- Livermore
- USA
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