Plasma-Induced Decomposition of Copper Complex Ink for the Formation of Highly Conductive Copper Tracks on Heat-Sensitive Substrates

Liquid- liquid (Cyclohexanone: Cyclohexanol) separation using augmented tight nanofiltration membrane: A sustainable approach

Organic solvent nanofiltration (OSN) is an incipient technology in the field of organic liquid-liquid separation. The incomplete separations and complexity involved in these, forces many organic liquids to be released as effluents and the adverse effects of these on environment is enormous and irreparable. The work prominences on the complete separation of industrially significant cyclohexanone: cyclohexanol (keto-alcohol oil) and heptane: toluene mixtures. The separations of these above-mentioned organic liquid mixtures were carried out using the fabricated Lewis acid modified graphitic carbon nitride (Cu2O@g-C3N4) incorporated polyvinylidene difluoride (PVDF) composite membranes. These fabricated membranes showed a separation factor of 18.16 and flux of 1.62 Lm-2h-1 for cyclohexanone: cyclohexanol mixture and separation of heptane and toluene mixture (with heptane flux of 1.52 Lm-2h-1) showed a separation factor of 9.9. The selectivity and productivity are based on the polarity and size of the organic liquids. The role of Cu2O@g-C3N4 is influencing the pore size distribution, increased divergence from solubility parameters, polarity, solvent uptake and porosity of the composite membranes. The developed composite membranes are thus envisioned to be apt for a wide range of liquid-liquid separations due to its implicit nature.

Insight into the Types of Alkanolamines on the Properties of Copper(II) Formate-Based Conductive Ink

Conductive inks are one of the most important functional materials for printed flexible electronic devices, and their properties determine the methods of subsequent patterning and metallization. In comparison with copper nanoparticle or nanowire inks, copper particle-free inks employing copper(II) formate (Cuf) as a precursor have attracted the interest of researchers due to their flexibility in preparation, excellent stability, and lower conversion temperature. Alkanolamines can provide Cuf with excellent solubility in alcohols while being less toxic and having a certain reducibility, making them preferable ligands in comparison with aliphatic amines and pyridine. However, there have been few studies on the effects of the alkanolamine types on the performance of Cuf inks. Also, the decomposition mechanism of copper-alkanolamine complex inks is not clear. In this work, different kinds of alkanolamines were chosen as ligands to formulate Cuf inks to address the mentioned issues. The influences of amine types on the stability, wettability, thermal decomposition behavior, and electrical performance of the formulated Cuf particle-free inks were investigated in detail. The results show that the utilization of alkanolamines could provide Cuf with excellent solubility in alcohols, resulting in an ink with good stability and favorable wetting properties. The thermal decomposition temperature and electrical performance of the formulated copper ink are largely dependent on the amine used. When amines with a longer carbon chain and more branches were utilized to prepare the ink, a decreased decomposition temperature was observed on the derived inks because of the steric hindrance effect. Copper films with good morphology and conductivity could be obtained at low temperatures by selecting the appropriate alkanolamine. Copper particle-free conductive ink from 2-amino-2-methyl-1-propanol demonstrated better morphology and electrical performance (16.09 μΩ·cm) and was successfully used for conductive circuits by direct-writing.

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning capabilities, cost-effectiveness, and scalability among the various methods for manufacturing Cu and W-based films and structures. In particular, SBAM material jetting techniques, such as inkjet printing (IJP), direct ink writing (DIW), and aerosol jet printing (AJP), present a promising approach for design freedom, low material wastes, and versatility as either stand-alone printers or integrated with powder bed-based metal additive manufacturing (MAM). Thus, this review summarizes recent advancements in solution-processed Cu and W, focusing on IJP, DIW, and AJP techniques. The discussion encompasses general aspects, current status, challenges, and recent research highlights. Furthermore, this paper addresses integrating material jetting techniques with powder bed-based MAM to fabricate functional alloys and multi-material structures. Finally, the factors influencing large-scale fabrication and potential prospects in this area are explored.

Synthesis of Ni Nanosheets by Template-Free Method and Their Application in Conductive and Magnetic Flexible Electrons

Two-dimensional Ni nanosheets are synthesized by the template-free method using Na₃CA as an orientation agent in liquid phase, and then the conductive Ni nanosheet ink is prepared for conductive circuits on flexible electronics. The thickness of the Ni nanosheets is about 800 nm, and the diameter is about 100 μm. Na₃CA plays a structural guiding role to form Ni nanocrystals, promoting the self-assembly of Ni nanocrystals into Ni nanosheets effectively. The laminar stackable patterns of the Ni nanosheet circuits increase the contact area of the Ni nanosheets and improve the stability of the conductors under stress. Ni nanosheets can bend with the folding of the structure, while the mutual constraints between their layers promote the circuit to remain stable during the bending state. Therefore, the Ni nanosheet circuits display excellent conductive performance during the tiled and bent stages. In addition, Ni nanosheet/Ag nanowire composites are prepared to enhance conductivity to meet higher demands. Moreover, the experimental results of its application in magnetic guided switch closure circuits show that Ni nanosheet/Ag nanowire composites have the potential to participate in both conductive and magnetic field applications simultaneously.

Facile Preparation of Monodisperse Cu@Ag Core-Shell Nanoparticles for Conductive Ink in Printing Electronics

Copper-based nanoinks are emerging as promising low-cost alternatives to widely used silver nanoinks in electronic printing. However, the spontaneous oxidation of copper under ambient conditions poses significant challenges to its broader application. To address this issue, this paper presents an economical, large-scale, and environmentally friendly method for fabricating Cu@Ag nanoparticles (Cu@Ag NPs). The as-prepared nanoparticles exhibit a narrow size distribution of approximately 100 nm and can withstand ambient exposure for at least 60 days without significant oxidation. The Cu@Ag-based ink, with a 60 wt% loading, was screen-printed onto a flexible polyimide substrate and subsequently heat-treated at 290 °C for 15 minutes under a nitrogen atmosphere. The sintered pattern displayed a low electrical resistivity of 25.5 μΩ·cm (approximately 15 times the resistivity of bulk copper) along with excellent reliability and mechanical fatigue strength. The innovative Cu@Ag NPs fabrication method holds considerable potential for advancing large-scale applications of copper-based inks in flexible electronics.

Copper inks for printed electronics: a review

Conductive inks have attracted tremendous attention owing to their adaptability and the convenient large-scale fabrication. As a new type of conductive ink, copper-based ink is considered to be one of the best candidate materials for the conductive layer in flexible printed electronics owing to its high conductivity and low price, and suitability for large-scale manufacturing processes. Recently, tremendous progress has been made in the preparation of cooper-based inks for electronic applications, but the antioxidation ability of copper-based nanomaterials within inks or films, that is, long-term reliability upon exposure to water and oxygen, still needs more exploration. In this review, we present a comprehensive overview of copper inks for printed electronics from ink preparation, printing methods and sintering, to antioxidation strategies and electronic applications. The review begins with an overview of the development of copper inks, followed by a demonstration of various preparation methods for copper inks. Then, the diverse printing techniques and post-annealing strategies used to fabricate conductive copper patterns are discussed. In addition, antioxidation strategies utilized to stabilize the mechanical and electrical properties of copper nanomaterials are summarized. Then the diverse applications of copper inks for electronic devices, such as transparent conductive electrodes, sensors, optoelectronic devices, and thin-film transistors, are discussed. Finally, the future development of copper-based inks and the challenges of their application in printed electronics are discussed.

Self-Organizing, Environmentally Stable, and Low-Cost Copper-Nickel Complex Inks for Printed Flexible Electronics

Cost-effective copper conductive inks are considered as the most promising alternative to expensive silver conductive inks for use in printed electronics. However, the low stability and high sintering temperature of copper inks hinder their practical application. Herein, we develop rapidly customizable and stable copper-nickel complex inks that can be transformed in situ into uniform copper@nickel core-shell nanostructures by a self-organized process during low-temperature annealing and immediately sintered under photon irradiation to form copper-nickel alloy patterns on flexible substrates. The complex inks are synthesized within 15 min via a simple mixing process and are particle-free, air-stable, and compatible with large-area screen printing. The manufactured patterns exhibit a high conductivity of 19-67 μΩ·cm, with the value depending on the nickel content, and can maintain high oxidation resistance at 180 °C even when the nickel content is as low as 6 wt %. In addition, the printed copper-nickel alloy patterns exhibit high flexibility as a consequence of the local softening and mechanical anchoring effect between the metal pattern and the flexible substrate, showing strong potential in the additive manufacturing of highly reliable flexible electronics, such as flexible radio-frequency identification (RFID) tags and various wearable sensors.

Metallic core-shell nanoparticles for conductive coatings and printing

The review is focused on bimetallic nanoparticles composed of a core formed by low-cost metal having high electrical conductivity, such as Cu and Ni, and a protective shell composed of stable to oxidation noble metal such as Ag or Au. We present the chemical and physical approaches for synthesis of such particles, as well as the combination of the two, the stability to oxidation of core-shell nanoparticles at various conditions, and the formulation of conductive compositions and their application in conductive coatings and printed electronics.

MODs vs. NPs: Vying for the Future of Printed Electronics

This Minireview compares two distinct ink types, namely metal-organic decomposition (MOD) and nanoparticle (NP) formulations, for use in the printing of some of the most conductive elements: silver, copper and aluminium. Printing of highly conductive features has found purpose across a broad array of electronics and as processing times and temperatures reduce, the avenues of application expand to low-cost flexible substrates, materials for wearable devices and beyond. Printing techniques such as screen, aerosol jet and inkjet printing are scalable, solution-based processes that historically have employed NP formulations to achieve low resistivity coatings printed at high resolution. Since the turn of the century, the rise in MOD inks has vastly extended the range of potentially applicable compounds that can be printed, whilst simultaneously addressing shelf life and sintering issues. A brief introduction to the field and requirements of an ink will be presented followed by a detailed discussion of a wide array of synthetic routes to both MOD and NP inks. Unindustrialized materials will be discussed, with the challenges and outlook considered for the market leaders: silver and copper, in comparison with the emerging field of aluminium inks.

Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics

Printed copper materials have been attracting significant attention prominently due to their electric, mechanical, and thermal properties. The emerging copper-based flexible electronics and energy-critical applications rely on the control of electric conductivity, current-carrying capacity, and reliability of copper nanostructures and their printable ink materials. In this review, we describe the growth of copper nanostructures as the building blocks for printable ink materials on which a variety of conductive features can be additively manufactured to achieve high electric conductivity and stability. Accordingly, the copper-based flexible hybrid electronics and energy-critical devices printed by different printing techniques are reviewed for emerging applications.

Mechanistic Insight into Bis(amino) Copper Formate Thermochemistry for Conductive Molecular Ink Design

Increasing attention has been given to amine-copper formate complexes for their use as low-cost printable conductive inks. The structure of amine ligands coordinated to copper centers has been reported to dictate the properties of copper molecular inks, such as stability and printability, thereby influencing the copper reduction pathway during the thermolysis. Yet, the underlying mechanism by which formate is oxidized when complexed with amine ligands is still not fully understood. Here, we propose a mechanistic pathway of copper formate dehydrogenation and decarboxylation and examine the critical role that amine ligands play in their thermal decomposition by employing first-principles electronic structure computations and experimental analyses of thermolysis reactions. Based on the computational characterization of the relevant reaction pathways for a number of primary and secondary amines as well as pyridine ligand complexes, we are the first to show that the hydrogen bonds formed between the amine ligand and formate are the key factors governing the activation energy, providing a design principle for the synthesis of organic ligands that can tune the height of the reaction barriers of the dehydrogenation and decarboxylation reactions. The calculations, confirmed by NMR studies, show that the reduction of Cu(II) to Cu(I) occurs in concert with the release of H₂ via the dimerization of Cu(II) hydride. This result suggests that the monomeric elimination of H₂ is not favorable for the Cu(II) to Cu(I) reduction and thus identifies dimeric amino copper formate as an important intermediate for copper reduction whose thermodynamic stabilities are also dictated by the nature of the amine ligands.

Effectiveness of Ligand Denticity-Dependent Oxidation Protection in Copper MOD Inks

The recent cost-driven transition from silver- to copper-based inks for printing on flexible substrates is connected with new key challenges. Given the high oxidation sensitivity of copper inks before, during, and after the curing process, the conductivity and thereby the device performance can be affected. Strategies to limit or even avoid this drawback include the development of metal organic decomposition (MOD) inks with selected "protective" ligands. In this study, the influence of the ligand on the oxide formation during the ink decomposition process is described using a wide variety of in situ characterization techniques. It is demonstrated that bidentate ligands provide an improved oxidation barrier, although the copper preservation mechanism has its limits: oxygen can interfere in every reduction pathway depending on the curing duration and atmospheric conditions. The generated insights can be applied in the further evolution toward ambient-curable copper MOD inks.

Formulation of Screen-Printable Cu Molecular Ink for Conductive/Flexible/Solderable Cu Traces

Screen printing is the most common method used for the production of printed electronics. Formulating copper (Cu) inks that yield conductive fine features with oxidation and mechanical robustness on low-temperature substrates will open up opportunities to fabricate cost-effective devices. We have formulated a screen-printable Cu metal-organic decomposition (MOD) ink comprising Cu formate coordinated to 3-(diethylamino)-1,2-propanediol, a fractional amount of Cu nanoparticles (CuNPs), and a binder. This simple formulation enables ∼70-550 μm trace widths with excellent electrical [∼8-15 mΩ/□/mil or 20-38 μΩ·cm] and mechanical properties with submicron-thick traces obtained by intense pulse light (IPL) sintering on Kapton and poly(ethylene terephthalate) (PET) substrates. These traces are mechanically robust to flexing and creasing where less than 10% change in resistance is observed on Kapton and ∼20% change is observed on PET. Solderable Cu traces were obtained only with the combination of the Cu MOD precursor, CuNP, and polymer binder. Both thermally and IPL sintered traces showed shelf stability (<10% change in resistance) of over a month in ambient conditions and 10-70% relative humidity, suitable for day-to-day fabrication. To demonstrate utility, light-emitting diodes (LEDs) were directly soldered to IPL sintered Cu traces in a reflow oven without the need for a precious metal interlayer. The LEDs were functional not only during bending and creasing of the Cu traces but even after 180 min at 140 °C in ambient air without losing illumination intensity. High definition television antennas printed on Kapton and PET were found to perform well in the ultrahigh frequency region. Lastly, single-walled carbon nanotube-based thin-film transistors on a silicon wafer were fabricated with a screen-printed Cu source and drain electrodes, which performed comparably to silver electrodes with mobility values of 12-15 cm² V^-1 s^-1 and current on/off ratios of ∼10⁵ and as effective ammonia sensors providing parts per billion-level detection.

Sintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed Light

In this study, an ink formulation was developed to prepare conductive copper thin films with compact structure by using intense pulsed light (IPL) sintering. To improve inter-particle connections in the sintering process, a cuprous oxide shell was synthesized over copper nanoparticles (CuNP). This cuprous oxide shell can be reduced by IPL with the presence of a reductant and fused to form connection between large copper particles. However, the thermal yield stress after strong IPL sintering resulted in cracks of conductive copper film. Thus, a multiple pulse sintering with an off time of 2 s was needed to reach a low resistivity of 10^-5 Ω·cm. To increase the light absorption efficiency and to further decrease voids between CuNPs in the copper film, cupric oxide nanoparticles (CuONP) of 50 nm, were also added into ink. The results showed that these CuONPs can be reduced to copper with a single pulse IPL and fused with the surrounding CuNPs. With an optimal CuNP/CuONP weight ratio of 1/80, the copper film showed a lowest resistivity of 7 × 10^-5 Ω·cm, ~25% conductivity of bulk copper, with a single sintering energy at 3.08 J/cm². The ink can be printed on flexible substrates as conductive tracks and the resistance remained nearly the same after 10,000 bending cycles.

Patterning Cu nanostructures tailored for CO2 reduction to electrooxidizable fuels and oxygen reduction in alkaline media

Due to the limited availability of noble metal catalysts, such as platinum, palladium, or gold, their substitution by more abundant elements is highly advisable. Considerably challenging is the controlled and reproducible synthesis of stable non-noble metallic nanostructures with accessible active sites. Here, we report a method of preparation of bare (ligand-free) Cu nanostructures from polycrystalline metal in a controlled manner. This procedure relies on heterogeneous localized electrorefining of polycrystalline Cu on indium tin oxide (ITO) and glassy carbon as model supports using scanning electrochemical microscopy (SECM). The morphology of nanostructures and thus their catalytic properties are tunable by adjusting the electrorefining parameters, i.e., the electrodeposition voltage, the translation rate of the metal source and the composition of the supporting electrolyte. The activity of the obtained materials towards the carbon dioxide reduction reaction (CO₂RR), oxygen reduction reaction (ORR) in alkaline media and hydrogen evolution reaction (HER), is studied by feedback mode SECM. Spiky Cu nanostructures obtained at a high concentration of chloride ions exhibit enhanced electrocatalytic activity. Nanostructures deposited under high cathodic overpotentials possess a high surface-to-volume ratio with a large number of catalytic sites active towards the reversible CO₂RR and ORR. The CO₂RR yields easily electrooxidizable compounds - formic acid and carbon monoxide. The HER seems to occur efficiently at the crystallographic facets of Cu nanostructures electrodeposited under mild polarization.

Laser-Induced Selective Metallization on Polymer Substrates Using Organocopper for Portable Electronics

Our work proposed a facile strategy for selective fabrication of the precise metalized patterns onto polymer substrates through the laser direct structuring (LDS) technology using organocopper compounds. Copper oxalate (CuC₂O₄) and copper acetylacetonate [Cu(acac)₂] which can be used as laser sensitizers were first introduced into an acrylonitrile-butadiene-styrene (ABS) matrix for preparing LDS materials. After the activation with 1064 nm pulsed near-infrared laser, the Cu⁰ (metal copper) was generated from CuC₂O₄ and Cu(acac)₂ and then served as catalyst species for the electroless copper plating (ECP). A series of characterizations were conducted to investigate the morphology and analyze the surface chemistry of ABS/CuC₂O₄ and ABS/Cu(acac)₂ composites. Specially, the X-ray photoelectron spectroscopy analysis indicated that 58.3% Cu²⁺ in ABS/CuC₂O₄ was reduced to Cu⁰, while this value was 63.9% for ABS/Cu(acac)₂. After 30 min ECP, the conductivities of copper circuit on ABS/CuC₂O₄ and ABS/Cu(acac)₂ composites were 1.22 × 10⁷ and 1.58 × 10⁷ Ω^-1·m^-1, respectively. Moreover, the decorated patterns and near-field communication circuit were demonstrated by this LDS technology. We believe that this study paves the way for developing organocopper-based LDS materials, which have the potential for industrial applications.

Conductive nanomaterials for 2D and 3D printed flexible electronics

This review describes recent developments in the field of conductive nanomaterials and their application in 2D and 3D printed flexible electronics, with particular emphasis on inks based on metal nanoparticles and nanowires, carbon nanotubes, and graphene sheets. We present the basic properties of these nanomaterials, their stabilization in dispersions, formulation of conductive inks and formation of conductive patterns on flexible substrates (polymers, paper, textile) by using various printing technologies and post-printing processes. Applications of conductive nanomaterials for fabrication of various 2D and 3D electronic devices are also briefly discussed.

A rugged, self-sterilizing antimicrobial copper coating on ultra-high molecular weight polyethylene: a preliminary study on the feasibility of an antimicrobial prosthetic joint material

We report here for the first time how a copper coating bond to ultra-high molecular weight polyethylene (UHMWPE) via low temperature aerosol assisted chemical vapour deposition.

Ultrahigh Conductivity and Superior Interfacial Adhesion of a Nanostructured, Photonic-Sintered Copper Membrane for Printed Flexible Hybrid Electronics

Inkjet-printed electronics using metal particles typically lack electrical conductivity and interfacial adhesion with an underlying substrate. To address the inherent issues of printed materials, this Research Article introduces advanced materials and processing methodologies. Enhanced adhesion of the inkjet-printed copper (Cu) on a flexible polyimide film is achieved by using a new surface modification technique, a nanostructured self-assembled monolayer (SAM) of (3-mercaptopropyl)trimethoxysilane. A standardized adhesion test reveals the superior adhesion strength (1192.27 N/m) of printed Cu on the polymer film, while maintaining extreme mechanical flexibility proven by 100 000 bending cycles. In addition to the increased adhesion, the nanostructured SAM treatment on printed Cu prevents formation of native oxide layers. The combination of the newly synthesized Cu ink and associated sintering technique with an intense pulsed ultraviolet and visible light absorption enables ultrahigh conductivity of printed Cu (2.3 × 10^-6 Ω·cm), which is the highest electrical conductivity reported to date. The comprehensive materials engineering technologies offer highly reliable printing of Cu patterns for immediate use in wearable flexible hybrid electronics. In vivo demonstration of printed, skin-conformal Cu electrodes indicates a very low skin-electrode impedance (<50 kΩ) without a conductive gel and successfully measures three types of biopotentials, including electrocardiograms, electromyograms, and electrooculograms.

Precursors for Atmospheric Plasma-Enhanced Sintering: Low-Temperature Inkjet Printing of Conductive Copper

Bidentate diamine and amino-alcohol ligands have been used to form solid, water-soluble, and air-stable monomeric copper complexes of the type [Cu(NH2CH2CH(R)Y)2(NO3)2] (1, R=H, Y=NH2; 2, R=H, Y=OH; 3, R=Me, Y=OH). The complexes were characterized by elemental analysis, mass spectrometry, infrared spectroscopy, thermal gravimetric analysis, and single-crystal X-ray diffraction. Irrespective of their decomposition temperature, precursors 1-3 yield highly conductive copper features [1.5×10-6 Ω m (±5×10-7 Ω m)] upon atmospheric-pressure plasma-enhanced sintering.

Copper-Plated Paper for High-Performance Lithium-Ion Batteries

Paper is emerging as a promising flexible, high surface-area substrate for various new applications such as printed electronics, energy storage, and paper-based diagnostics. Many applications, however, require paper that reaches metallic conductivity levels, ideally at low cost. Here, an aqueous electroless copper-plating method is presented, which forms a conducting thin film of fused copper nanoparticles on the surface of the cellulose fibers. This paper can be used as a current collector for anodes of lithium-ion batteries. Owing to the porous structure and the large surface area of cellulose fibers, the copper-plated paper-based half-cell of the lithium-ion battery exhibits excellent rate performance and cycling stability, and even outperforms commercially available planar copper foil-based anode at ultra-high charge/discharge rates of 100 C and 200 C. This mechanically robust metallic-paper composite has promising applications as the current collector for light-weight, flexible, and foldable paper-based 3D Li-ion battery anodes.

A PEG/copper(i) halide cluster as an eco-friendly catalytic system for C-N bond formation

The catalytic activities of eight copper(i) halide clusters assembled from copper(i) halide and ferrocenyltelluroethers, 1-8, were investigated in C-N formation under various conditions. A catalytic procedure using poly(ethylene glycol) (PEG-400) as a greener alternative organic solvent has been developed. The PEG-400/5 system can achieve 99% targeted yield with a mild reaction temperature and short reaction time. After the isolation of the products by extraction with diethyl ether, this PEG-400/cluster system could be easily recycled. Spectroscopic studies elucidate a stepwise mechanism: firstly, proton-coupled electron transfer (PCET) involving the transfer of an electron from Cu+ and a proton from imidazole results in the formation of a labile penta-coordinated Cu2+ and aryl radical; the following effective electron transfer from the ferrocene unit reduces Cu2+ and forms the target product; finally, the ferrocenium unit is reduced by the I- anion. The merits of this eco-friendly synthesis are the efficient utilization of reagents and easy recyclability.

Crystal structure of tetra-kis-[μ-2-(meth-oxy-carbon-yl)benzoato-κ2O1:O1']bis-[(N,N-di-methyl-formamide-κO)copper(II)](Cu-Cu) di-methyl-formamide disolvate

The title compound, [Cu2(C9H7O4)4(C3H7NO)2]·2C3H7NO, crystallizes in the monoclinic P21/c space group, with the binuclear copper unit occupying a special position on an inversion center, i.e. the asymmetric unit of the crystal consists of one CuII ion, two 2-(meth-oxy-carbon-yl)benzoate ligands, and two DMF mol-ecules (one coordinated and one solvate). The binuclear complex displays a paddle-wheel-shaped structure with the two copper atoms being in a Jahn-Teller-distorted octa-hedral coordination environment. Each 2-(meth-oxy-carbon-yl)benzoate substituent acts as a bridging ligand and links two Cu atoms with a Cu-Cu distance of 2.633 (1) Å. The carboxyl-ate groups of the 2-(meth-oxy-carbon-yl)benzoate ligands adopt bidentate syn-syn bridging modes, with dihedral angles between the carboxyl-ate planes and the aromatic rings of 18.427 (4) and 43.029 (6)°. In the crystal, adjacent DMF mol-ecules coordinated to copper atoms are arranged in a mutual 'head-to-tail' manner by offset face-to-face π-π stacking inter-actions, resulting in chains along the c-axis direction. The planes of the coordinated DMF mol-ecules are parallel to each other, the distance between them being 3.33 (1) Å. A three-dimensional structure is assembled from the chains by weak C-H⋯O and C-H⋯π inter-molecular inter-actions involving the DMF solvent mol-ecules. One of the methyl ester groups is disordered over two sites with an occupancy ratio of 0.751 (12):0.249 (12).

Patterned Arrays of Functional Lateral Heterostructures via Sequential Template-Directed Printing

The precise integration of microscale dots and lines with controllable interfacing connections is highly important for the fabrication of functional devices. To date, the solution-processible methods are used to fabricate the heterogeneous micropatterns for different materials. However, for increasingly miniaturized and multifunctional devices, it is extremely challenging to engineer the uncertain kinetics of a solution on the microstructures surfaces, resulting in uncontrollable interface connections and poor device performance. Here, a sequential template-directed printing process is demonstrated for the fabrication of arrayed microdots connected by microwires through the regulation of the Rayleigh-Taylor instability of material solution or suspension. Flexibility in the control of fluidic behaviors can realize precise interface connection between the micropatterns, including the microwires traversing, overlapping or connecting the microdots. Moreover, various morphologies such as circular, rhombic, or star-shaped microdots as well as straight, broken or curved microwires can be achieved. The lateral heterostructure printed with two different quantum dots displays bright dichromatic photoluminescence. The ammonia gas sensor printed by polyaniline and silver nanoparticles exhibits a rapid response time. This strategy can construct heterostructures in a facile manner by eliminating the uncertainty of the multimaterials interface connection, which will be promising for the development of novel lateral functional devices.

Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °C

Cu-Ag complex inks are developed for printing conductive tracks of low cost, high stability, and high conductivity on heat-sensitive substrates such as polyethylene terephthalate (PET) substrates. The inks show an obvious self-catalyzed characteristic due to the in situ formation of fresh metal nanoparticles which promote rapid decomposition and sintering of the inks at a low temperature below 100 °C. The temperature is 40-60 °C lower than those of general Cu complex inks and 100-120 °C lower than those of general Cu/Ag particle inks. Highly conductive Cu-Ag tracks of 2.80 × 10^-5 Ω cm and 6.40 × 10^-5 Ω cm have been easily realized at 100 °C and 80 °C, respectively. In addition, the printed Cu-based tracks not only show high oxidation resistance at high temperatures of up to 140 °C (the maximum tolerable temperature of current PET substrate) but also show excellent stability at high humidity of 85% because of the very uniform Cu-Ag hybrid structure. The printable tracks exhibit great potential application in various wearable devices fabricated on textiles, papers, and other heat-sensitive substrates.

Chemical formation of soft metal electrodes for flexible and wearable electronics

Efficient chemical approaches to fabricating soft metal electrodes aiming at wearable electronics are summarized and reviewed.

Inkjet printed nanomaterial based flexible radio frequency identification (RFID) tag sensors for the internet of nano things

The Internet of Things (IoT) has limitless possibilities for applications in the entire spectrum of our daily lives, from healthcare to automobiles to public safety.