Synthesis and Characterization of Semiaromatic Polyimides Containing POSS in Main Chain Derived from Double-Decker-Shaped Silsesquioxane

Poly(ester imide)s with Low Linear Coefficients of Thermal Expansion and Low Water Uptake (VII): A Strategy to Achieve Ultra-Low Dissipation Factors at 10 GHz

In this study, a series of ester-linked tetracarboxylic dianhydrides (TCDAs) with 2,6-naphthalene-containing longitudinally extended structures consisting of different numbers of aromatic rings (NAr = 6-8) was synthesized to obtain novel modified polyimides, poly(ester imide)s (PEsIs). These TCDAs were fully compatible with the conventional manufacturing processes of conventional polyimide (PI) systems. As an example, the PEsI film obtained from the ester-linked TCDA (NAr = 8) and an ester-linked diamine achieved unprecedented outstanding dielectric properties without the support of fluorinated monomers, specifically an ultra-low dissipation factor (tan δ) of 0.00128 at a frequency of 10 GHz (50% RH and 23 °C), in addition to an extremely high glass transition temperature (Tg) of 365 °C, extremely low linear coefficient of thermal expansion (CTE) of 6.8 ppm K-1, suppressed water uptake (0.24%), requisite film ductility, and a low haze. Consequently, certain PEsI films developed in this study are promising candidates for heat-resistant dielectric substrates for use in 5G-compatible high-speed flexible printed circuit boards (FPCs). The chemical and physical factors denominating tan δ are also discussed.

Distinct insight into the use of difunctional double-decker silsesquioxanes as building blocks for alternating A–B type macromolecular frameworks

A distinct look at known, hydrosilylation reactions used for the formation of DDSQ-based linear A–B alternating macromolecular systems with DPn > 1000 is presented. Selected physicochemical properties of obtained hybrid co-polymers were determined.

Slick Synthetic Approach to Various Fluoroalkyl Silsesquioxanes-Assessment of their Dielectric Properties

We present a smart and efficient methodology for the synthesis of a variety of fluorinated silsesquioxanes (SQs) with diverse Si-O-Si core architecture. The protocol is based on an easy-to-handle and selective hydrosilylation reaction. An investigation on the placement of the reactive Si-HC=CH₂ vs. Si-H in the silsesquioxane, as well as silane vs. olefin structure, respectively, on the progress and selectivity of the hydrosilylation process, was studied. Two alternative synthetic pathways for obtaining a variety of fluorine-functionalized silsesquioxanes were developed. As a result, a series of mono- and octa- T₈ SQs, tri- 'open-cage' T₇ SQs, in addition to di- and tetrafunctionalized double-decker silsesquioxane (DDSQ) derivatives, were obtained selectively with high yields. All products were characterized by spectroscopic (NMR, FTIR) techniques. Selected samples were subjected to the measurements revealing their dielectric permittivity in a wide range of temperatures (from -100 °C to 100 °C) and electric field frequencies (10⁰-10⁶ Hz).

Synthesis of a Novel Bifunctional Epoxy Double-Decker Silsesquioxane: Improvement of the Thermal Stability and Dielectric Properties of Polybenzoxazine

In this study a new type of bifunctional epoxy compound (DDSQ-EP) based on double-decker silsesquioxane (DDSQ) was synthesized by process of alkaline hydrolysis condensation of phenyltrimethoxysilane and corner capping reaction with dichloromethylvinylsilane, followed by epoxidation reaction of vinyl groups. The resultant structures were confirmed using Fourier transform infrared spectrometry, nuclear magnetic resonance spectrometry and time-of-flight mass spectrometry, respectively. The DDSQ-EP was incorporated into polybenzoxazine to obtain the PBZ/DDSQ-EP nanocomposites. The uniform dispersion of DDSQ-EP in the nanocomposites was verified by X-ray diffraction and scanning electron microscope. The reactions occurred during the curing of the composites and were investigated using infrared spectroscopy of segmented cures. Dynamic mechanical analysis and thermal gravimetric analysis indicated that the storage modulus, glass transition temperature and thermal stability of PBZ/DDSQ-EP were increased in comparison with pure benzoxazine resins. Assessment of dielectric properties demonstrated that the dielectric permittivity and dielectric loss of polybenzoxazine decreased slightly because of the addition of DDSQ-EP.

High Thermal Resistance of Epoxy/Cyanate Ester Hybrids Incorporating an Inorganic Double-Decker-Shaped Polyhedral Silsesquioxane Nanomaterial

In this study, we prepared a difunctionalized cyanate ester double-decker silsesquioxane (DDSQ-OCN) cage with a char yield and thermal decomposition temperature (T_d) which were both much higher than those of a typical bisphenol A dicyanate ester (BADCy, without the DDSQ cage) after thermal polymerization. Here, the inorganic DDSQ nanomaterial improved the thermal behavior through a nano-reinforcement effect. Blending the inorganic DDSQ-OCN cage into the epoxy resin improved its thermal and mechanical stabilities after the ring-opening polymerization of the epoxy units during thermal polymerization. The enhancement in the physical properties arose from the copolymerization of the epoxy and OCN units to form the organic/inorganic covalently bonded network structure, as well as the hydrogen bonding of the OH groups of the epoxy with the SiOSi moieties of the DDSQ units. For example, the epoxy/DDSQ-OCN = 1/1 hybrid, prepared without Cu(II)-acac as a catalyst, exhibited a glass transition temperature, thermal decomposition temperature (T_d), and char yield (166 °C, 427 °C, and 51.0 wt%, respectively) that were significantly higher than those obtained when applying typical organic curing agents in the epoxy resin. The addition of Cu(II)-acac into the epoxy/BADCy and epoxy/DDSQ-OCN hybrids decreased the thermal stability (as characterized by the values of T_d and the char yields) because the crosslinking density and post-hardening also decreased during thermal polymerization; nevertheless, it accelerated the thermal polymerization to a lower curing peak temperature, which is potentially useful for real applications as epoxy molding compounds.

Double-Decker-Shaped Polyhedral Silsesquioxanes Reinforced Epoxy/Bismaleimide Hybrids Featuring High Thermal Stability

In this study, we synthesized bismaleimide into a functionalized double-decker silsesquioxane (DDSQ) cage. This was achieved by hydrosilylation of DDSQ with nadic anhydride (ND), reacting it with excess p-phenylenediamine to obtain DDSQ-ND-NH₂, and treating with maleic anhydride (MA), which finally created a DDSQ-BMI cage structure. We observed that the thermal decomposition temperature (T_d) and char yield were both increased upon increasing the thermal polymerization temperature, and that these two values were both significantly higher than pure BMI without the DDSQ cage structure since the inorganic DDSQ nanoparticle could strongly enhance the thermal stability based on the nano-reinforcement effect. Based on FTIR, TGA, and DMA analyses, it was found that blending epoxy resin with the DDSQ-BMI cage to form epoxy/DDSQ-BMI hybrids could also enhance the thermal and mechanical properties of epoxy resin due to the organic/inorganic network formation created by the ring-opening polymerization of the epoxy group and the addition polymerization of the BMI group due to the combination of the inorganic DDSQ cage structure and hydrogen bonding effect. The epoxy/DDSQ-BMI = 1/1 hybrid system displayed high T_g value (188 °C), T_d value (397 °C), and char yield (40.4 wt%), which was much higher than that of the typical DGEBA type epoxy resin with various organic curing agents.

Soluble and processable thermoplastic hybrid polyimides containing POSS in main chains

The combination of 3,13-bis(3-aminopropyl)-double-decker-shaped-silsesquioxane and a fluorinated dianhydride produces a flexible polyimide with a low Tg, high heat resistance, and excellent solvent solubility. The fluorinated dianhydride loosened the interchain packing to suppress CT interactions, leading to the formation of a colorless polyimide.

Preparation of Soluble POSS-Linking Polyamide and Its Application in Antifogging Films

In this study, we prepared a polyhedral oligomeric silsesquioxane (POSS)-linking polyamide (POSS polyamide) by a polycondensation of ammonium-functionalized POSS (POSS-A) and carboxyl-functionalized POSS (POSS-C) in dehydrated dimethyl sulfoxide (DMSO) using 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride (EDC) and N-hydroxysuccinimide (NHS) as condensing agents. The obtained POSS polyamide was soluble in various highly polar solvents, and it could form a self-standing film. FT-IR, ¹H NMR, and ²⁹Si NMR analyses showed that POSS polyamide is a polymer in which POSS-A and POSS-C are linked almost linearly by amide bonds. Furthermore, the cast film obtained by heat-treating the polymer at 150 °C for 30 min exhibited excellent transparency and hard-coating (pencil scratch test: 5H) and antifogging properties (evaluation by water vapor exposure).

Organocatalytic controlled/living ring-opening polymerization of 1,3,5-triphenyl-1,3,5-tri-p-tolylcyclotrisiloxane for the precise synthesis of fusible, soluble, functionalized, and solid poly[phenyl(p-tolyl)siloxane]s

An organocatalytic controlled/living ring-opening polymerization (ROP) of 1,3,5-triphenyl-1,3,5-tri(p-tolyl)cyclotrisiloxane (PT3) produced linear poly[phenyl(p-tolyl)siloxane] (PPTS) with controlled structures.

Hybrid polyurethanes composed of isobutyl-substituted open-cage silsesquioxane in the main chains: synthesis, properties and surface segregation in a polymer matrix

The resulting polyurethanes exhibited excellent optical transparency and surface hydrophobicity and acted as effective surface modifiers in poly(methyl methacrylate) (PMMA) by surface segregation.

Supramolecular organogel formation behaviors of beads-on-string shaped poly(azomethine)s dependent on POSS structures in the main chains

Organogel formation was observed for isobutyl-substituted cage octasilsesquioxane (T₈) in the main-chain type polyazomethines, while precipitates instead of gel formation were observed for phenyl-substituted double-decker-shaped silsesquioxanes (DDSQ)-poly(azomethine)s.

Assembly of discrete and oligomeric structures of organotin double-decker silsesquioxanes: inherent stability studies

Discrete and oligomeric organotin DDSQs have been synthesized and characterized, both experimentally and through computational study. The stability of these compounds remains intrigued with the organization of their structure in the crystal lattice.

Characteristics of Thermosetting Polymer Nanocomposites: Siloxane-Imide-Containing Benzoxazine with Silsesquioxane Epoxy Resins

A series of innovative thermosetting polymer nanocomposites comprising of polysiloxane-imide-containing benzoxazine (PSiBZ) as the matrix and double-decker silsesquioxane (DDSQ) epoxy or polyhedral oligomeric silsesquioxane (POSS) epoxy were prepared for improving thermosetting performance. Thermomechanical and dynamic mechanical characterizations indicated that both DDSQ and POSS could effectively lower the coefficient of thermal expansion by up to approximately 34% and considerably increase the storage modulus (up to 183%). Therefore, DDSQ and POSS are promising materials for low-stress encapsulation for electronic packaging applications.

Highly Thermal Stable Phenolic Resin Based on Double-Decker-Shaped POSS Nanocomposites for Supercapacitors

In this study we incorporated various amounts of a double-decker silsesquioxane (DDSQ) into phenolic/DDSQ hybrids, which we prepared from a bifunctionalized phenolic DDSQ derivative (DDSQ-4OH), phenol, and CH₂O under basic conditions (with DDSQ-4OH itself prepared through hydrosilylation of nadic anhydride with DDSQ and subsequent reaction with 4-aminophenol). We characterized these phenolic/DDSQ hybrids using Fourier transform infrared spectroscopy; ¹H, ¹³C, and ²⁹Si nuclear magnetic resonance spectroscopy; X-ray photoelectron spectroscopy (XPS); and thermogravimetric analysis. The thermal decomposition temperature and char yield both increased significantly upon increasing the DDSQ content, with the DDSQ units providing an inorganic protection layer on the phenolic surface, as confirmed through XPS analyses. We obtained carbon/DDSQ hybrids from the phenolic/DDSQ hybrids after thermal curing and calcination at 900 °C; these carbon/DDSQ hybrids displayed electrochemical properties superior to those of previously reported counterparts.

UV-Cured Coatings Prepared with Sulfhydryl-Terminated Branched Polyurethane and Allyl-Terminated Hyperbranched Polycarbosilane

The conventional polyurethane (PU) coatings have poor heat resistance, which will undergo severe pyrolysis when the temperature exceeds 200 °C. To overcome the shortcoming of conventional PU coatings, an ultraviolet (UV)-cured solvent-free hyperbranched polycarbosilane modified PU coatings was prepared by sulfhydryl-terminated polyurethane and allyl-terminated hyperbranched polycarbosilane. The initial decomposition temperature (Td5%) of the UV-cured coating ranges from 258 to 268 °C, which is obviously higher than those of the conventional PU coatings reported. The coating shows fairly low water absorption in the range of 0.6–1.36 wt% and exhibits grade 1, grade 2 and grade 3 adhesion to glass, tin plate and aluminum sheet, respectively.

Progress in the Synthesis of Bifunctionalized Polyhedral Oligomeric Silsesquioxane

Polyhedral oligomeric silsesquioxane (POSS) has been considered as one of the most promising nanofillers in academic and industrial research due to its unique multifunctional nanostructure, easy functionalization, hybrid nature, and high processability. The progress of POSS has been extensive, particularly applications based on single- or multiple-armed POSS. In polymer hybrids, in order to enhance the properties, bifunctional POSS has been incorporated into the backbone chain of the polymer. This review summarizes recent developments in the synthesis, modification, and application of bifunctional POSS-containing composite materials. This includes amino-POSS, hydroxyl-POSS, aromatic ring-POSS, ether-POSS, and vinyl groups-POSS and their applications, exemplified by polyurethanes (PUs) and polyimides (PIs). In addition, the review highlights the enhancement of thermal, mechanical, and optical properties of the composites.

Transparent, High Glass-Transition Temperature, Shape Memory Hybrid Polyimides Based on Polyhedral Oligomeric Silsesquioxane

Optically transparent polyimides with excellent thermal stability and shape memory effect have potential applications in optoelectronic devices and aerospace industries. A series of optically transparent shape memory polyimide hybrid films are synthesized from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 2,2′-bis-(trifluoromethyl)biphenyl-4,4′-diamine (TFMB) with various polyhedral oligomeric silsesquioxane (POSS) contents and then subjected to thermal imidization. The hybrid films show good optical transparency (>80% at 400 nm and >95% at 500 nm) with cutoff wavelengths ranging from 318 to 336 nm. Following the incorporation of the inorganic POSS structure, the hybrid films exhibit excellent thermal stability with glass transition temperature (T_g) ranging from 351 to 372 °C. The hybrid films possess the highest T_g compared with the previously-reported shape memory polymers. These findings show that POSS is successfully utilized to develop transparent polyimides with excellent thermal stability and shape memory effect.

One-pot strategy for synthesis of open-cage silsesquioxane monomers

A novel synthetic strategy to access POSS monomers has been proposed; one reaction site of an open-cage POSS was capped, and the remaining two silanol groups were functionalized for polymerization. Importantly, the monomer can be obtained by one-pot synthesis without any troublesome isolation process.

Functional Polyimide/Polyhedral Oligomeric Silsesquioxane Nanocomposites

The preparation of hybrid nanocomposite materials derived from polyhedral oligomeric silsesquioxane (POSS) nanoparticles and polyimide (PI) has recently attracted much attention from both academia and industry, because such materials can display low water absorption, high thermal stability, good mechanical characteristics, low dielectric constant, flame retardance, chemical resistance, thermo-redox stability, surface hydrophobicity, and excellent electrical properties. Herein, we discussed the various methods that have been used to insert POSS nanoparticles into PI matrices, through covalent chemical bonding and physical blending, as well as the influence of the POSS units on the physical properties of the PIs.

Beads-on-String-Shaped Poly(azomethine) Applicable for Solution Processing of Bilayer Devices Using a Same Solvent

Solvent-based deposition techniques for fabrication of organic field-effect transistors (OFETs) generally require orthogonal solvents for deposition of a conjugated polymer layer on a polymer gate insulator layer. Here, we found significantly reduced dissolution rate of the polymeric film in the same solvent after casting a homegeneous polymerization solution of para-bis(3-aminopropyl)hexaisobutyl-substituted T₈ cage (1) with terephthalaldehyde. The limited dissolution rate in the solvent provided enough chance for fabrication of a regioregular poly(3-hexylthiophene-2,5-diyl) (P3HT) layer on the present polymer films without using an orthogonal solvent. The rheological properties indicate that physical interaction between the polymer chains provides the significantly reduced dissolution rate after the deposition onto a substrate without any cross-linking treatments.

High Performance Soluble Polyimides from Ladder-Type Fluorinated Dianhydride with Polymorphism

A novel rigid semi-alicyclic dianhydride 9,10-difluoro-9,10-bis(trifluoromethyl)-9,10-dihydroanthracene-2,3,6,7-tetracarboxylic acid dianhydride (8FDA) was reported, and its single crystal X-ray diffraction result revealed the existence of the polymorphic structure in this compound. The detail geometric configuration transition during the synthesized process was investigated, exhibiting a transition of from trans- to cis- when the hydroxyl groups were substituted by fluoride with diethylaminosulfur trifluoride (DAST). Compared with the dianhydride 4,4'-(Hexaflouroisopropylidene) diphthalic anhydride (6FDA) and 1S,2R,4S,5R-cyclohexanetetracarboxylic dianhydride (HPMDA), the resulting polyimide (PI) films based on 8FDA exhibited an obviously higher glass transition temperature (Tg, 401 °C) and a much lower coefficient of thermal expansion (CTE, 14 ppm K-1). This indicates that 8FDA is an ideal building block in high-performance soluble PIs with low CTE.

Multi-Alkenylsilsesquioxanes as Comonomers and Active Species Modifiers of Metallocene Catalyst in Copolymerization with Ethylene

The copolymers of ethylene (E) with open-caged iso-butyl-substituted tri-alkenyl-silsesquioxanes (POSS-6-3 and POSS-10-3) and phenyl-substituted tetra-alkenyl-silsesquioxane (POSS-10-4) were synthesized by copolymerization over the ansa-metallocene catalyst. The influence of the kind of silsesquioxane and of the copolymerization conditions on the reaction performance and on the properties of the copolymers was studied. In the case of copolymerization of E/POSS-6-3, the positive comonomer effect was observed, which was associated with the influence of POSS-6-3 on transformation of the bimetallic ion pair to the active catalytic species. Functionality of silsesquioxanes and polymerization parameters affected the polyhedral oligomeric silsesquioxanes (POSS) contents in the copolymers which varied in the range of 1.33–7.43 wt %. Tri-alkenyl-silsesquioxanes were incorporated into the polymer chain as pendant groups while the tetra-alkenyl-silsesquioxane derivative could act as a cross-linking agent which was proved by the changes in the contents of unsaturated end groups, by the glass transition temperature values, and by the gel contents (up to 81.3% for E/POSS-10-4). Incorporation of multi-alkenyl-POSS into the polymer chain affected also the melting and crystallization behaviors.

Bis-phenylethynyl polyhedral oligomeric silsesquioxanes: new high-temperature, processable thermosetting materials

Bis-phenylethynyl polyhedral oligomeric silsesquioxane (bis-PE-POSS) compounds were synthesized and thermally cured yielding crosslinked materials. After curing at 370 °C, thermal decomposition occurs near 600 °C under nitrogen. These materials were synthesized by condensation of a new phenylethynyl-functional dichlorosilane onto tetrasilanol phenyl POSS, yielding two geometric isomers.

After thermal crosslinking, bis-phenylethynyl POSS exhibits 5% mass loss temperatures approaching 600 °C, the highest of reported POSS compounds.

Open-cage silsesquioxane necklace polymers having closed-cage silsesquioxane pendants

A novel POSS monomer design has been proposed; a closed-cage POSS was tethered to an open-cage POSS, and the remaining two functional groups were employed for polymerization. The thermal and optical properties of the obtained main-chain type POSS polymers can be widely tuned by the substituents at the corners of the POSSs.