Comprehensive structural, surface-chemical and electrochemical characterization of nickel-based metallic foams

Nickel-based metallic foams are commonly used in electrochemical energy storage devices (rechargeable batteries) as both current collectors and active mass support. These materials attract attention as tunable electrode materials because they are available in a range of chemical compositions, pore structures, pore sizes, and densities. This contribution presents structural, chemical, and electrochemical characterization of Ni-based metallic foams. Several materials and surface science techniques (transmission electron microscopy (TEM), scanning electron microscopy (SEM), energy dispersive spectrometer (EDS), focused ion beam (FIB), and X-ray photoelectron spectroscopy (XPS)) and electrochemical methods (cyclic voltammetry (CV)) are used to examine the micro-, meso-, and nanoscopic structural characteristics, surface morphology, and surface-chemical composition of these materials. XPS combined with Ar-ion etching is employed to analyze the surface and near-surface chemical composition of the foams. The specific and electrochemically active surface areas (As, Aecsa) are determined using CV. Though the foams exhibit structural robustness typical of bulk materials, they have large As, in the range of 200-600 cm(2) g(-1). In addition, they are dual-porosity materials and possess both macro- and mesopores.

Surface science and electrochemical analysis of nickel foams

Open-pore nickel (Ni) foams are characterized using surface science and electrochemical techniques. A scanning electron microscopy analysis reveals interconnected Ni struts that generate small and large pores of ca. 50 and 500 μm in size, respectively. An X-ray photoelectron spectroscopy (XPS) analysis of the surface-chemical composition of the Ni foams shows that there are oxidized and metallic sections within their surfaces despite being prepared by sintering in an oxidizing atmosphere at a high temperature and being stored in moist air. The ratio of the areas of oxidized and metallic sections is evaluated using XPS data. Chemical etching of the Ni foams results in removal of the native surface oxide/hydroxide without altering the three-dimensional structure; it also increases the roughness (R) of the surfaces of Ni struts giving rise to an increase in the electrochemically active surface area (Aecsa). Thermal treatment of Ni foams in an H2(g) atmosphere at 500 °C reduces the native surface oxide/hydroxide but does not increase R or Aecsa. Electrochemical behavior of the Ni foams is examined in 0.5 M aqueous KOH solution using cyclic-voltammetry (CV) and electrochemical impedance spectroscopy (EIS). As-received, chemically etched, thermally reduced and electro-oxidized Ni foams generate distinct CV profiles; their features are assigned to oxidized and metallic surface states. The observations made on the basis of XPS measurements are corroborated by the results of CV analyses. The application of CV and XPS or EIS allows in situ determination of Aecsa and the specific surface area (As) of the chemically etched and thermally reduced Ni foams. The values of As determined on the basis of joint CV and XPS measurements are 227 ± 74 and 149 ± 48 cm(2) g(-1) for the etched and reduced Ni foams, respectively. The values of As determined on the basis of CV, XPS and EIS measurements are 241 ± 80 and 160 ± 23 cm g(-1) for the etched and reduced Ni foams, respectively.

Fabrication of a metal membrane on a perforated polymer substrate by palladium aerosol activation and subsequent electroless plating

Fabrication of a metal membrane on a perforated flexible poly(tetrafluoroethylene) (PTFE) substrate was developed by employing spark-generated palladium (Pd) aerosol activation and the subsequent electroless plating of Pd. After aerosol activation, Pd agglomerates of spark-generated primary particles (approximately 2.6 nm in diameter) with a face-centered-cubic structure were deposited uniformly on the PTFE substrate. Homogeneous Pd particles with an average size of 188 nm were tightly packed together to form a Pd membrane after Pd plating. The average plating rate of Pd during 30 min of plating at an activation intensity of 25 microg/cm(2) was 14.2 microg/cm(2) x min.