Reference Citation Analysis: Find an Article, Find a Category, Find a Journal, Find a Scholar

For:	Varvara S, Muresan L, Popescu I, Maurin G. J APPL ELECTROCHEM 2003;33:685-692. [DOI: 10.1023/a:1025069004355] [Citation(s) in RCA: 18] [Impact Index Per Article: 0.9] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/12/2022]

Number

Cited by Other Article(s)

Bengoa L, Pary P, Conconi M, Seré P, Egli W. Glutamate-based mildly alkaline electrolyte as a green and safe alternative for zinc plating. J Electroanal Chem (Lausanne) 2023. [DOI: 10.1016/j.jelechem.2022.117048] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/12/2022]

Revealing the inhibition effect of quaternary ammonium cations on Cu electrodeposition. J APPL ELECTROCHEM 2019. [DOI: 10.1007/s10800-019-01381-4] [Citation(s) in RCA: 5] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/25/2022]

Tang M, Zhang S, Qiang Y, Chen S, Luo L, Gao J, Feng L, Qin Z. 4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper. RSC Adv 2017. [DOI: 10.1039/c7ra06857c] [Citation(s) in RCA: 23] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/27/2022] Open

Zhang Q, Yu X, Hua Y, Xue W. The effect of quaternary ammonium-based ionic liquids on copper electrodeposition from acidic sulfate electrolyte. J APPL ELECTROCHEM 2014. [DOI: 10.1007/s10800-014-0774-z] [Citation(s) in RCA: 17] [Impact Index Per Article: 1.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/29/2022]

Influence of branched quaternary ammonium surfactant molecules as levelers for copper electroplating from acidic sulfate bath. Electrochim Acta 2013. [DOI: 10.1016/j.electacta.2013.07.017] [Citation(s) in RCA: 31] [Impact Index Per Article: 2.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/23/2022]

An effective triblock copolymer as a suppressor for microvia filling via copper electrodeposition. Electrochim Acta 2013. [DOI: 10.1016/j.electacta.2013.07.127] [Citation(s) in RCA: 22] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/21/2022]

The effect of thiourea, l(−) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition. J APPL ELECTROCHEM 2013. [DOI: 10.1007/s10800-013-0596-4] [Citation(s) in RCA: 13] [Impact Index Per Article: 1.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/25/2022]

Huerta Garrido M, Pritzker M. EIS and statistical analysis of copper electrodeposition accounting for multi-component transport and reactions. J Electroanal Chem (Lausanne) 2006. [DOI: 10.1016/j.jelechem.2006.05.026] [Citation(s) in RCA: 22] [Impact Index Per Article: 1.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/29/2022]

Varvara S, Muresan L, Popescu IC, Maurin G. Comparative study of copper electrodeposition from sulphate acidic electrolytes in the presence of IT-85 and of its components. J APPL ELECTROCHEM 2005. [DOI: 10.1007/s10800-004-2398-1] [Citation(s) in RCA: 8] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/30/2022]