Bioinspired Functional Composites for Enhanced Thermally Conductivity via Fractal-Growth CuNP Fillers

Thermal conduction for electronic devices has attracted extensive attention in light of the development of 5G communication. Thermally conductive materials with high thermal conductivity and extensive mechanical flexibility are extremely desirable in practical applications. However, the construction of efficient interconnected conductive pathways and continuous conductive networks is inadequate for either processing or actual usage in existing technologies. In this work, spherical copper nanoparticles (S-CuNPs) and urchin-inspired fractal-growth CuNPs (U-CuNPs), thermally conductive metal fillers induced by ionic liquids, were fabricated successfully through the electrochemical deposition method. Compared to S-CuNPs, the U-CuNPs shows larger specific surface contact area, thus making it easier to build a continuous conductive pathway network in the corresponding U-CuNPs/liquid silicone rubber (LSR) thermally conductive composites. The optimal loading of CuNP fillers was determined by evaluating the rheological performance of the prepolymer and the mechanical properties and thermal conductivity performances of the composites. When the filler loading is 150 phr, the U-CuNPs/LSR produces optimal mechanical properties (e.g., tensile strength and modulus), thermal conductivity (above 1000% improvement compared to pure LSR), and heating/cooling efficiency. The enhanced thermal conductivity of U-CuNPs/LSR was also confirmed through the finite element analysis (FEA) overall temperature distribution, indicating that U-CuNPs with larger specific surface contact areas exhibit more advantages in forming a continuous network in composites than S-CuNPs, making U-CuNPs/LSR a promising and competitive alternative to traditional flexible thermally interface materials.

Stretchy and disordered: Toward understanding fracture in soft network materials via mesoscopic computer simulations

Soft network materials exist in numerous forms ranging from polymer networks, such as elastomers, to fiber networks, such as collagen. In addition, in colloidal gels, an underlying network structure can be identified, and several metamaterials and textiles can be considered network materials as well. Many of these materials share a highly disordered microstructure and can undergo large deformations before damage becomes visible at the macroscopic level. Despite their widespread presence, we still lack a clear picture of how the network structure controls the fracture processes of these soft materials. In this Perspective, we will focus on progress and open questions concerning fracture at the mesoscopic scale, in which the network architecture is clearly resolved, but neither the material-specific atomistic features nor the macroscopic sample geometries are considered. We will describe concepts regarding the network elastic response that have been established in recent years and turn out to be pre-requisites to understand the fracture response. We will mostly consider simulation studies, where the influence of specific network features on the material mechanics can be cleanly assessed. Rather than focusing on specific systems, we will discuss future challenges that should be addressed to gain new fundamental insights that would be relevant across several examples of soft network materials.

Atomistic-scale analysis of the deformation and failure of polypropylene composites reinforced by functionalized silica nanoparticles

Interfacial adhesion between polymer matrix and reinforcing silica nanoparticles plays an important role in strengthening polypropylene (PP) composite. To improve the adhesion strength, the surface of silica nanoparticles can be modified by grafted functional molecules. Using atomistic simulations, we examined the effect of functionalization of silica nanoparticles by hexamethyldisilazane (HMDS) and octyltriethoxysilane (OTES) molecules on the deformation and failure of silica-reinforced PP composite. We found that the ultimate tensile strength (UTS) of PP composite functionalized by OTES (28 MPa) is higher than that of HMDS (25 MPa), which is in turn higher than that passivated only by hydrogen (22 MPa). To understand the underlying mechanistic origin, we calculated the adhesive energy and interfacial strength of the interphase region, and found that both the adhesive energy and interfacial strength are the highest for the silica nanoparticles functionalized by OTES molecules, while both are the lowest by hydrogen. The ultimate failure of the polymer composite is initiated by the cavitation in the interphase region with the lowest mass density, and this cavitation failure mode is common for all the examined PP composites, but the cavitation position is dependent on the tail length of the functional molecules. The present work provides interesting insights into the deformation and cavitation failure mechanisms of the silica-reinforced PP composites, and the findings can be used as useful guidelines in selecting chemical agents for surface treatment of silica nanoparticles.

Cavitation, crazing and bond scission in chemically cross-linked polymer nanocomposites

It is very important to understand the molecular mechanism of the fracture behavior of chemically cross-linked polymer nanocomposites (PNCs). Thus, in this work, by employing a coarse-grained molecular dynamics simulation we investigated the effect of the cross-link density and the cross-link distribution on it by calculating the void formation and the chemical bond scission. Considering the fracture energy, the optimal fracture properties of PNCs are realized at the moderate cross-link density which results from the competition between the chain slippage induced voids and the bond scission induced voids. Meanwhile, more bond scission occurs on the chain backbone while a high broken percentage of the cross-link bonds appears between chains because of the higher average stress borne by one cross-linked bead than by one other bead. In addition, the number of voids is quantified which first increases and then decreases with the strain at low cross-link density. However, the number of newly formed voids increases again at high cross-link density. Finally, it decreases because of the low rate of bond scission. Furthermore, the chemical bonds are broken at a similar strain for the uniform cross-link distribution while they are broken at any strain for the nonuniform cross-link distribution. The low number of broken bonds induces the disappearance of the second peak of the number of voids with the strain for the nonuniform cross-link distribution. In summary, this work could provide a clear understanding of the fracture mechanism of the chemically cross-linked PNCs on the molecular level.