Fabrication of thermally conductive and electrically insulating polymer composites with isotropic thermal conductivity by constructing a three-dimensional interconnected network

The transport of polystyrene microplastics in saturated porous media: Impacts of functional groups and solution chemistry

Global attention to microplastics (MPs) pollution has been increasing as it has become a novel environmental issue. Natural aging processes alter MPs surface properties, introducing charged functional groups that affect their transport in porous media. This study investigated the transport of polystyrene microplastics (PSMPs) in saturated porous media through column experiments, including non-functionalized PSMPs (PS-Bare), carboxyl-modified PSMPs (PS-COOH), and amino-modified PSMPs (PS-NH2). Unlike previous studies focusing on pristine microplastics, our research integrated the effects of surface functionalization with complex solution chemistry, including ionic strength, cation valence, and pH. Results indicated that surface functional groups and solution chemistry combined to impact PSMPs migration through zeta potential and hydrodynamic size. Increasing ionic strength decreased migration rates due to double-layer compression and charge screening. Higher cation valence and lower pH decreased PS-Bare and PS-COOH migration rates, while PS-NH2 showed the opposite trend due to differences in surface charges. As pH increased, carboxyl groups dissociated, enhancing the negative charge on PS-COOH and promoting its migration, while amino groups deprotonated, reducing the positive charge on PS-NH2 and inhibiting its migration. PS-NH2 exhibited higher mobility than expected. Despite its positive charge, PS-NH2 preferentially occupied active sites on sand surfaces, reducing aggregation and enhancing transport. In the presence of Al3+, PSMPs recovery rates were PS-NH2 (94.60%) > PS-COOH (41.48%) > PS-Bare (41.12%). This study enhances understanding of functionalized microplastics transport and its potential impact on groundwater contamination.

3D-Networks Based Polymer Composites for Multifunctional Thermal Management and Electromagnetic Protection: A Mini Review

The rapid development of miniaturized, high-frequency, and highly integrated microelectronic devices has brought about critical issues in electromagnetic compatibility and thermal management. In recent years, there has been significant interest in lightweight polymer-based composites that offer both electromagnetic interference (EMI) shielding and thermal conductivity. One promising approach involves constructing three-dimensional (3D) interconnection networks using functional fillers in the polymer matrix. These networks have been proven effective in enhancing the thermal and electrical conductivity of the composites. This mini-review focuses on the preparation and properties of 3D network-reinforced polymer composites, specifically those incorporating metal, carbon, ceramic, and hybrid networks. By comparing the effects of different filler types and distribution on the composite materials, the advantages of 3D interconnected conductive networks in polymer composites are highlighted. Additionally, this review addresses the challenges faced in the field of multifunctional thermal management and electromagnetic protection materials and provides insights into future development trends and application prospects of 3D structured composites.

Constructing Hierarchical Polymer Nanocomposites with Strongly Enhanced Thermal Conductivity

The rapid advancement of communication technology has substantially increased the demand for advanced electronic packaging materials with high thermal conductivity and outstanding electrical insulation properties. In this study, we design polyvinyl alcohol/polydopamine-modified boron nitride nanosheet (PVA/BNNS@PDA) nanocomposites with hierarchical structures by combining electrospinning, vacuum filtration deposition, and hot pressing. The modified BNNS@PDA improves the interaction between the filler and the polymer matrix while reducing the interfacial thermal resistance, resulting in superior thermal conductivity, excellent insulation, and perfect flexibility. The PVA/BNNS@PDA nanocomposites possess an ultrahigh in-plane thermal conductivity of 16.6 W/(m·K) at 35.54 wt % BNNS@PDA content. Even after 2000 folds, the nanocomposites do not undergo any crack, showing their ultrahigh thermal conductivity behavior. Furthermore, the nanocomposites exhibit a volume resistivity above 1014 Ω·cm, which is well above the standard for insulating materials. Based on these results, this work provides a novel method to produce nanocomposites with high thermal conductivity, offering a new perspective to design advanced thermal management materials.

Exploring Lipoic Acid-Mediated Dynamic Bottlebrush Elastomers as a New Platform for the Design of High-Performance Thermally Conductive Materials

The development of high-performance thermally conductive interface materials is the key to unlocking the serious bottleneck of modern microelectronic technology through enhanced heat dispersion. Existing methods that utilize silicone composites rely either on loading large doses of randomly distributed thermal conductive fillers or on filling prealigned thermal conductive scaffolds with liquid silicone precursors. Both approaches suffer from several limitations in terms of physical traits and processability. We describe an alternative approach in which malleable silicone matrices, based on the dynamic cyclic disulfide nature cross-linker (α-lipoic acid), are readily prepared using ring-opening polymerization. The mechanical properties of the resultant dynamic silicone matrix are readily tunable. Stress-dependent depolymerization of the disulfide network demonstrates the ability to reprocess the silicone elastomer matrix, which allows for the fabrication of highly efficient thermal conductive composites with a 3D interconnecting, thermally conductive network (3D-graphite/MxBy composites) via in situ methods. Applications of the composites as thermal dispersion interface materials are demonstrated by LEDs and CPUs, suggesting great potential in advanced electronics.

Cerium Methacrylate Assisted Preparation of Highly Thermally Conductive and Anticorrosive Multifunctional Coatings for Heat Conduction Metals Protection

Preparing polymeric coatings with well corrosion resistance and high thermal conductivity (TC) to prolong operational life and ensure service reliability of heat conductive metallic materials has long been a substantive and urgent need while a difficult task. Here we report a multifunctional epoxy composite coating (F-CB/CEP) by synthesizing cerium methacrylate and ingeniously using it as a novel curing agent with corrosion inhibit for epoxy resin and modifier for boron nitride through "cation-π" interaction. The prepared F-CB/CEP coating presents a high TC of 4.29 W m-1 K-1, which is much higher than other reported anti-corrosion polymer coatings and thereby endowing metal materials coated by this coating with outstanding thermal management performance compared with those coated by pure epoxy coating. Meanwhile, the low-frequency impedance remains at 5.1 × 1011 Ω cm2 even after 181 days of immersion in 3.5 wt% NaCl solution. Besides, the coating also exhibits well hydrophobicity, self-cleaning properties, temperature resistance and adhesion. This work provides valuable insights for the preparation of high-performance composite coatings with potential to be used as advanced multifunctional thermal management materials, especially for heat conduction metals protection.

Reliability of printed stretchable electronics based on nano/micro materials for practical applications

Recent decades have witnessed the booming development of stretchable electronics based on nano/micro composite inks. Printing is a scalable, low-cost, and high-efficiency fabrication tool to realize stretchable electronics through additive processes. However, compared with conventional flexible electronics, stretchable electronics need to experience more severe mechanical deformation which may cause destructive damage. Most of the reported works in this field mainly focus on how to achieve a high stretchability of nano/micro composite conductors or single working modules/devices, with limited attention given to the reliability for practical applications. In this minireview, we summarized the failure modes when printing stretchable electronics using nano/micro composite ink, including dysfunction of the stretchable interconnects, the stress-concentrated rigid-soft interfaces for hybrid electronics, the vulnerable vias upon stretching, thermal accumulation, and environmental instability of stretchable materials. Strategies for tackling these challenges to realize reliable performances are proposed and discussed. Our review provides an overview on the importance of reliable, printable, and stretchable electronics, which are the key enablers in propelling stretchable electronics from fancy demos to practical applications.

Efficient Preconstruction of Three-Dimensional Graphene Networks for Thermally Conductive Polymer Composites

Electronic devices generate heat during operation and require efficient thermal management to extend the lifetime and prevent performance degradation. Featured by its exceptional thermal conductivity, graphene is an ideal functional filler for fabricating thermally conductive polymer composites to provide efficient thermal management. Extensive studies have been focusing on constructing graphene networks in polymer composites to achieve high thermal conductivities. Compared with conventional composite fabrications by directly mixing graphene with polymers, preconstruction of three-dimensional graphene networks followed by backfilling polymers represents a promising way to produce composites with higher performances, enabling high manufacturing flexibility and controllability. In this review, we first summarize the factors that affect thermal conductivity of graphene composites and strategies for fabricating highly thermally conductive graphene/polymer composites. Subsequently, we give the reasoning behind using preconstructed three-dimensional graphene networks for fabricating thermally conductive polymer composites and highlight their potential applications. Finally, our insight into the existing bottlenecks and opportunities is provided for developing preconstructed porous architectures of graphene and their thermally conductive composites.

Aggregation of carboxyl-modified polystyrene nanoplastics in water with aluminum chloride: Structural characterization and theoretical calculation

Nanoplastics (NPs) pollution of aquatic systems is becoming an emerging environmental issue due to their stable structure, high mobility, and easy interactions with ambient contaminants. Effective removal technologies are urgently needed to mitigate their toxic effects. In this study, we systematically investigated the removal effectiveness and mechanisms of a commonly detected nanoplastics, carboxyl-modified polystyrene (PS-COOH) via coagulation and sedimentation processes using aluminum chloride (AlCl₃) as a coagulant. PS-COOH appeared as clearly defined and discrete spherical nanoparticles in water with a hydrodynamic diameter of 50 nm. The addition of 10 mg/L AlCl₃ compressed and even destroyed the negatively charged PS-COOH surface layer, decreased the energy barrier, and efficiently removed 96.6% of 50 mg/L PS-COOH. The dominant removal mechanisms included electrostatic adsorption and intermolecular interactions. Increasing the pH from 3.5 to 8.5 sharply enhanced the PS-COOH removal, whereas significant loss was observed at pH 10.0. High temperature (23 °C) favored the removal of PS-COOH compared to lower temperature (4 °C). High PS-COOH removal efficiency was observed over the salinity range of 0 - 35‰. The presence of positively charged Al₂O₃ did not affect the PS-COOH removal, while negatively charged SiO₂ reduced the PS-COOH removal from 96.6% to 93.2%. Moreover, the coagulation and sedimentation process efficiently removed 90.2% of 50 mg/L PS-COOH in real surface water even though it was rich in inorganic ions and total organic carbon. The fast and efficient capture of PS-COOH by AlCl₃ via a simple coagulation and sedimentation process provides a new insight for the treatment of NPs from aqueous environment.

Beyond homogeneous dispersion: oriented conductive fillers for high κ nanocomposites

Rational design of structures for regulating the thermal conductivities (κ) of materials is critical to many components and products employed in electrical, electronic, energy, construction, aerospace, and medical applications. As such, considerable efforts have been devoted to developing polymer composites with tailored conducting filler architectures and thermal conduits for highly improved κ. This paper is dedicated to overviewing recent advances in this area to offer perspectives for the next level of future development. The limitations of conventional particulate-filled composites and the issue of percolation are discussed. In view of different directions of heat dissipation in polymer composites for different end applications, various approaches for designing the micro- and macroscopic structures of thermally conductive networks in the polymer matrix are highlighted. Methodological approaches devised to significantly ameliorate thermal conduction are categorized with respect to the pathways of heat dissipation. Future prospects for the development of thermally conductive polymer composites with modulated thermal conduction pathways are highlighted.

Wood-Derived Composites with High Performance for Thermal Management Applications

Fabricating advanced polymer composites with remarkable mechanical and thermal conductivity performances is desirable for developing advanced devices and equipment. In this study, a novel strategy to prepare anisotropic wood-based scaffolds with a naturally aligned microchannel structure from balsa wood is demonstrated. The wood microchannels were coated with polydopamine-surface-modified small graphene oxide (PGO) nanosheets via assembly. The highly aligned porous microstructures, with thin wood cell walls and large voids along the cellulose microchannels, allow polymers to enter, resulting in the fabrication of the wood-polymer nanocomposite. The tensile stiffness and strength of the resulting nanocomposite reach 8.10 GPa and 90.3 MPa with a toughness of 5.0 MJ m^-3. The thermal conductivity of the nanocomposite is improved significantly by coating a PGO layer onto the wood scaffolds. The nanocomposite exhibits not only ultrahigh thermal conductivity (in-plane about 5.5 W m^-1 K^-1 and through-plane about 2.1 W m^-1 K^-1) but also satisfactory electrical insulation (volume resistivity of about 10¹⁵ Ω·cm). Therefore, the results provide a strategy to fabricate thermal management materials with excellent mechanical properties.

Synergetic integration of thermal conductivity and flame resistance in nacre-like nanocellulose composites

Highly thermally conductive and flame resistant nanocellulose-based composites can synchronously achieve efficient thermal dissipation and low fire hazards of electronic devices, which shows great promise in next-generation green and flexible electronics. However, it has long been intractable to optimize the high thermal conductivity (TC) and flame resistance simultaneously. Herein, synergetic integration of high TC and flame resistance in nacre-like nanocellulose composites has been successfully achieved by the vacuum-assisted filtration of cellulose nanofibers (CNFs) and functionalized boron nitride nanosheets (BNNS-p-APP). Benefiting from the highly oriented hierarchical microstructure, strong hydrogen-bonding interaction, and successful immobilization of ammonium polyphosphate (APP), the as-obtained CNFs/BNNS-p-APP composite film achieves a high in-plane TC of 9.1 W m^-1 K^-1 and outstanding flame resistance. Meantime, this eco-friendly nanocellulose-based composite also exhibits remarkable flexibility, folding endurance, and mechanical robustness, robustness, which may open up a new opportunity for the thermal management of flexible electronics.

Highly thermally conductive and eco-friendly OH-h-BN/chitosan nanocomposites by constructing a honeycomb thermal network

More than 110,000,000 tons of mismanaged plastics were to be produced in 2020. Polymers are favored in the preparation of thermally conductive materials due to their excellent comprehensive properties. However, most polymers fabricated for thermally conductive materials are difficult to degrade in the natural environment. To alleviate the increasingly severe environmental problems, we reported a novel eco-friendly material with high thermal conductivity, which was composited of chitosan microspheres (CSM) and hydroxyl-functionalized hexagonal boron nitride (OH-h-BN) nanoplatelets. Utilizing their significant difference in scales, the OH-h-BN nanoplatelets were arranged between each CSM. Their overall structure was similar to the honeycomb: CSM were honeycomb cores, and OH-h-BN nanoplatelets were honeycomb network. The routine-structure OH-h-BN/CS nanocomposites were only 0.94 ± 0.02 W·m^-1·K^-1 at 50 wt% in thermal conductivity. However, the OH-h-BN/CSM nanocomposites with honeycomb structure can reach 5.66 ± 0.32 W·m^-1·K^-1 in the same loading, for enhancement of 502% and 1914% than OH-h-BN/CS nanocomposites and pure CS, respectively.

Improvement of thermal conductivity of rigid polyurethane foams with aluminum nitride filler

The aim of this work is the fabrication of electrically insulating composite rigid polyurethane foams with improved thermal conductivity. Therefore, this study is focused on the effect of aluminum nitride (AlN) on the thermal and electrical conductivities of rigid polyurethane foams. For this purpose, aluminum nitride/rigid polyurethane composite foams were prepared using a three-step procedure. The electrical and thermal conductivities of the foams were characterized. The thermal transitions, mechanical properties and morphology of the foams were also examined. The results reveal that AlN induces an increase of the thermal conductivity of rigid polyurethane foam of 24% which seems to be a relatively noticeable increase in polymeric foams. The low electrical conductivity of the foams is preserved.

3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity

In this study, hybrid fillers of spherically shaped aggregated boron nitride (a-BN) attached with SAC305, were fabricated via simple stirring and the vacuum filtration method. a-BN was used as the primary conductive filler incorporated with epoxy resin, and these fillers were interconnected each other via the coalescence behavior of SAC305 during the thermal curing process. Based on controlled a-BN content (1 g) on 3 g of epoxy, the thermal conductivity of the composite filled with hybrid filler (a-BN:SAC305 = 1:0.5) reached 0.95 W/mK (33 wt%) due to the construction of the 3D filler network, whereas that of composite filled with raw a-BN was only 0.60 W/mK (25 wt%). The thermal conductivity of unfilled epoxy was 0.19 W/mK.

Highly Oriented Graphite Aerogel Fabricated by Confined Liquid-Phase Expansion for Anisotropically Thermally Conductive Epoxy Composites

Graphene-based thermally conductive polymer composites are of great importance for the removal of the excess heat generated by electronic devices. However, due to the orientation of graphene sheets in the polymer matrix, the through-plane thermal conductivity of polymer/graphene composites remains far from satisfactory. We here demonstrate a confined liquid-phase expansion strategy to fabricate highly oriented confined expanded graphite (CEG) aerogels. After being incorporated into epoxy resin (EP), the resulting EP/CEG composites exhibit a high through-plane thermal conductivity (4.14 ± 0.21 W m^-1 K^-1) at a quite low filler loading of 1.75 wt % (0.91 vol %), nearly 10 times higher than that of neat EP resin and 7.5 times higher than the in-plane thermal conductivity of the composite, indicating that the CEG aerogel has a high through-plane thermal conductivity enhancement efficiency that outperforms those of many graphite/graphene-based fillers. The facile preparation method holds great industrial application potential in fabricating anisotropic thermally conductive polymer composites.

Polydopamine-Modified Al2O3/Polyurethane Composites with Largely Improved Thermal and Mechanical Properties

Alumina/polyurethane composites were prepared via in situ polymerization and used as thermal interface materials (TIMs). The surface of alumina particles was modified using polydopamine (PDA) and then evaluated via Fourier transform infrared spectroscopy (FTIR), thermogravimetric analysis (TG), and Raman spectroscopy (Raman). Scanning electron microscope (SEM) images showed that PDA-Al2O3 has better dispersion in a polyurethane (PU) matrix than Al2O3. Compared with pure PU, the 30 wt% PDA-Al2O3/PU had 95% more Young's modulus, 128% more tensile strength, and 76% more elongation at break than the pure PU. Dynamic mechanical analysis (DMA) results showed that the storage modulus of the 30 wt% PDA-Al2O3/PU composite improved, and the glass transition temperature (Tg) shifted to higher temperatures. The thermal conductivity of the 30 wt% PDA-Al2O3/PU composite increased by 138%. Therefore, the results showed that the prepared PDA-coated alumina can simultaneously improve both the mechanical properties and thermal conductivity of PU.

A facile route to fabricate thermally conductive and electrically insulating polymer composites with 3D interconnected graphene at an ultralow filler loading

Thermally conductive polymer composites show attractive prospects as thermal management materials in many applications such as microelectronic devices. However, traditional approaches in the preparation of thermally conductive polymer composites usually have the disadvantages of complex processes. In this study, a facile method for highly thermally conductive silicone rubber composites is reported, based on 3D interconnected graphene sponges by using an inorganic salt as a sacrificial template. The composites exhibit a high thermal conductivity of 1.50 W m-1 k-1 and a thermal conductivity enhancement of 752% at a very low graphene loading of 1.46 wt%. More significantly, highly thermally conductive epoxy and styrene-butadiene rubber composites are also fabricated by the same method. The composites also show excellent electrical insulating properties (>1013 Ω cm). Thus, this effective method is proved to be widely used for the facile fabrication of polymer composites of both plastic and rubber matrices which are thermally conductive and have excellent electrical insulating properties.