Enhanced thermal conductivity and tensile strength of Al-17Si-3.5Cu with SiC-nanoparticle addition

Carbon Fiber/Phenolic Composites with High Thermal Conductivity Reinforced by a Three-Dimensional Carbon Fiber Felt Network Structure

The formation of highly thermally conductive composites with a three-dimensional (3D) oriented structure has become an important means to solve the heat dissipation problem of electronic components. In this paper, a carbon fiber (CF) felt with a 3D network structure was constructed through the airflow netting forming technology and needle punching. The carbon fiber/phenolic composites were then fabricated by CF felt and phenolic resin through vacuum impregnation and compression molding. The effects of CF felt content and porosity on the thermal conductivity of carbon fiber/phenolic composites were investigated. The enhancement of carbon skeleton content promotes the conduction of heat inside the composites, and the decrease of porosity also significantly improves the thermal conductivity of the composites. The results indicate that the composites exhibit a maximum in-plane thermal conductivity of 1.3 W/mK, which is about 650% that of pure phenolic resin, showing that the construction of 3D thermal network structure is conducive to the reinforcement of thermal conductivity of composites. The method can provide a certain theoretical basis for constructing a thermally conductive composite with a three-dimensional structure.