Model-based research toward design of innovative materials: molecular weight prediction of bridged polysilsesquioxanes

Robust and Transparent Antifogging Polysilsesquioxane Film Containing a Hydroxy Group

Poly(glycidyloxypropyl)silsesquioxane (PGPS) was successfully synthesized by hydrolysis and polycondensation using the nitrogen flow method. A poly(3-(2,3-dihydroxypropoxypropyl)silsesquioxane) (PSQ-OH) film was prepared via two routes. In route A, PSQ-OH was prepared by the hydrolysis of the epoxy group of PGPS in an aqueous hydrochloric acid (HCl)/tetrahydrofuran solution, affording a diol group; then, PSQ-OH was coated on a glass substrate and heated. The antifogging performance of the PSQ-OH film was evaluated in terms of water uptake (WU) and scratch resistance. The obtained PSQ-OH film exhibited a low WU of 5% and a scratch resistance of 1.6. In route B, PGPS was coated on a glass substrate and immersed in a 0.5 mol/L aqueous sulfuric acid solution for 1-15 h at room temperature, producing a diol group. The solid-state ¹³C nuclear magnetic resonance spectrum indicated that the epoxy group was completely hydrolyzed after immersion for 15 h. The WU of the PSQ-OH film prepared via route B increased from 5 to 19% with the increase in the immersion time and was higher than that of the PSQ-OH film prepared via route A. The PSQ-OH film on a glass substrate retained transparency under water vapor exposure at 60 °C. The PSQ-OH film prepared via route B exhibited a high scratch resistance of 2.7-3.6, similar to that of a poly(3-(2-aminoethylaminopropyl)silsesquioxane) film. The scratch resistance of the PSQ-OH film was 5-7 times higher than that of the poly(vinyl alcohol) film. The PSQ-OH film was uniform with no pinholes and cracks. The PSQ-OH film was transparent and colorless and exhibited a high transmittance of >90% in the wavelength range of 400-800 nm. Overall, the prepared PSQ-OH film exhibits good antifogging, transparency, and mechanical properties.

Ethylene-bridged polysilsesquioxane/hollow silica particle hybrid film for thermal insulation material

Ethylene-bridged polysilsesquioxane (EBPSQ) was prepared by the sol–gel reaction of bis(triethoxysilyl)ethane. The whitish slurry was prepared by mixing EBPSQ and hollow silica particles (HSPs) with a median diameter of 18–65 μm at 80 °C, and it formed a hybrid film by heating at 80 and 120 °C for 1 h at each temperature, then at 200 °C for 20 min. The surface temperatures of EBPSQ films containing 10 wt% and 20 wt% of HSPs (90.2 °C–90.5 °C) were lower than those of EBPSQ films (93.6 °C), when the films on the duralumin plate were heated at 100 °C for 10 min from the bottom of the duralumin plate. The thermal conductivity/heat flux (k/q) obtained from the temperature difference between the surface temperature and bottom temperature of the films and the film thickness also decreased with adding the HSPs. EBPSQ film without HSPs exhibited T⁵_d of 258 °C and T¹⁰_d of 275 °C. However, EBPSQ film containing 20 wt% of HSPs exhibited high thermal stability, and T⁵_d and T¹⁰_d were 299 °C and 315 °C, respectively. Interestingly, T⁵_d and T¹⁰_d of the hybrid films increased with an increase in the number of HSPs. Overall, it was shown that HSPs could improve the thermal insulation properties and thermal stability.

Ethylene-bridged polysilsesquioxane/hollow silica particle hybrid films were prepared by the sol–gel reaction. The hybrid film containing hollow silica particles exhibited good thermal insulation properties and thermal stability.

Crack- and Shrinkage-Free Ethylene-Bridged Polysilsesquioxane Film Prepared by a Hydrosilylation Reaction

With the aim of developing an improved strategy for the preparation of ethylene-bridged polysilsesquioxanes as thermal insulator materials, this paper describes the synthesis of a crack- and shrinkage-free ethylene-bridged polysilsesquioxane film by the hydrosilylation reaction of hydrodimethyl-silylated oligomethylsilsesquioxane (MSQ-SiH) and dimethylvinyl-silylated oligomethylsilsesquioxane (MSQ-SiVi) in the presence of Karstedt's catalyst. Polysilsesquioxane precursors were prepared by the sol-gel reaction of triethoxymethylsilane and the successive capping reaction with chlorodimethylsilane and chlorodimethylvinylsilane. The obtained ethylene-bridged polysilsesquioxane film showed lower density and thermal diffusivity (1.13 g/cm3 and 1.15 × 10-7 m2/s, respectively) than a polymethylsilsesquioxane film (1.34 g/cm3 and 1.36 × 10-7 m2/s, respectively). As a result of the introduction of the SiCCSi ethylene bridge, the thermal insulation property of the polysilsesquioxane film was enhanced.