Synthesis and Properties of Optically Transparent Fluoro-Containing Polyimide Films with Reduced Linear Coefficients of Thermal Expansion from Organo-Soluble Resins Derived from Aromatic Diamine with Benzanilide Units

Wholly aromatic polyimide (PI) films with good solution processability, light colors, good optical transparency, high storage modulus, and improved heat resistance were prepared and characterized. For this purpose, a multi-component copolymerization methodology was performed from a fluoro-containing dianhydride, 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA), a rigid dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), and a fluoro-containing diamine, 2,2'-bis(trifluoromethyl)-4,4'-bis [4-(4-amino-3-methyl)benzamide]biphenyl (MABTFMB). One homopolymer, FPI-1 (6FDA-MABTFMB), and five copolymers, FPI-2~FPI-6, containing the BPDA units from 10 mol% to 50 mol% in the dianhydride moieties, were prepared, respectively. The derived PI resins showed good solubility in the polar aprotic solvents, such as N-methyl-2-pyrrolidone (NMP) and N,N-dimethylacetamide (DMAc). The flexible PI films obtained by the solution casting procedure showed good optical properties with the transmittances higher than 74.0% at the wavelength of 450 nm. The PI films exhibited excellent thermal properties, including 5% weight loss temperatures (T_5%) over 510 °C, together with glass transition temperatures (T_g) over 350.0 °C according to the peak temperatures of the loss modulus in dynamical mechanical analysis (DMA) measurements. The FPI-6 film also showed the lowest linear coefficient of thermal expansion (CTE) value of 23.4 × 10^-6/K from 50 to 250 °C according to the thermomechanical analysis (TMA) measurements, which was obviously lower than that of FPI-1 (CTE = 30.6 × 10^-6/K).

Synthesis and characterization of an adamantane-based copolyimides with high transparency

In this work, a copolyimide (Co-PI) film with high transparency was prepared by the copolymerization of hexafluoroisopropylidene)diphthalic anhydride (6FDA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 2,2′-Bis(trifluoromethyl)benzidine (TFMB) and adamantane-1,3-diamine (DAA). The effects of DAA monomers on the optical, thermal, and mechanical properties of the co-PIs were discussed in detail. We found that the preparation of polyimide (PI) based on the combination of two dianhydrides and two diamines could obtain the co-PI film with excellent comprehensive performance due to the synergy between the -CF3 group, the aliphatic ring and the aromatic structure. Through the structure and composition optimization, the co-PI film with 1.30% DAA (Q3) has a Tg of 374oC, T5 higher than 530oC, T430 of 82% and the tensile strength higher than 145 MPa. These results indicate that the Co-PI films can be successfully utilized in the development of novel heat-resistant plastic substrates for the optoelectronic engineering applications.

High temperature shape memory poly(amide-imide)s with strong mechanical robustness

Shape memory poly(amide-imide)s with strong mechanical robustness, outstanding heat resistance and low water uptake were fabricated.