Exceptionally High-Temperature-Resistant Kapton-Type Polyimides with Tg > 520 °C: Synthesis via Incorporation of Spirobis(indene)-bis(benzoxazole)-Containing Diamines

Polyimides (PIs), recognized for their exceptional thermal stability, are extensively employed in advanced applications, including aerospace, flexible displays, flexible solar cells, flame-retardant materials, and high-temperature filtration materials. However, with the continuous advancements in science and technology, the demand for improved thermal performance of PIs in these application areas has increased significantly. In this study, four spirobis(indene)-bis(benzoxazole) diamine monomers (5a, 5aa, 5b and 5bb) were designed and synthesized. These monomers were copolymerized with pyromellitic dianhydride (PMDA) and 4,4-diaminodiphenylmethane (ODA) to develop Kapton-type PIs. By varying the copolymerization molar ratios of the different diamines, a series of novel ultrahigh-temperature-resistant PI films were successfully prepared, and it was found that incorporating a highly rigid and twisted spirobis(indene)-bis(benzoxazole) structure into the PI matrix enhances the rigidity of the polymer chains and restricts their mobility, thereby significantly improving the thermal performance of the PI films. When 5a and ODA were copolymerized at molar ratios of 1:9 and 4:6, the glass transition temperature (Tg) of Kapton-type films significantly increased from 396 °C to 467 °C and >520 °C, respectively. These PI films also exhibit exceptional mechanical properties, with the modulus increasing from 1.6 GPa to 4.7 GPa, while demonstrating low dielectric performance, as evidenced by a decrease in the dielectric constant (Dk) from 3.51 to 3.08 under a 10 GHz high-frequency electric field. Additionally, molecular dynamics simulations were employed to further explore the relationships between polymer molecular structure, condensed states, and film properties, providing theoretical guidance for the development of polymers with ultrahigh thermal resistance and superior overall performance.

Thermally Stable and Transparent Polyimide Derived from Side-Group-Regulated Spirobifluorene Unit for Substrate Application

Advancements in flexible electronic technology, especially the progress in foldable displays and under-display cameras (UDC), have created an urgent demand for high-performance colorless polyimide (CPI). However, current CPIs lack sufficient heat resistance for substrate applications. In this work, four kinds of rigid spirobifluorene diamines are designed, and the corresponding polyimides are prepared by their condensation with 5,5'-(perfluoropropane-2,2-diyl) bis(isobenzofuran-1,3-dione) (6FDA) or 9,9-bis(3,4-dicarboxyphenyl) fluorene dianhydride (BPAF). The rigid and conjugated spirobifluorene units endow the polyimides with higher glass transition temperature (Tg) ranging from 356 to 468 °C. Their optical properties are regulated by small side groups and spirobifluorene structure with a periodically twisted molecular conformation. Consequently, a series of CPIs with an average transmittance ranging from 75% to 88% and a yellowness index (YI) as low as 2.48 are obtained. Among these, 27SPFTFA-BPAF presents excellent comprehensive performance, with a Tg of 422 °C, a 5 wt.% loss temperature (Td5) of 562 °C, a YI of 3.53, and a tensile strength (δmax) of 140 MPa, respectively. The mechanism underlying the structure-property relationship is investigated by experimental comparison and theoretical calculation, and the proposed method provides a pathway for designing highly rigid conjugated CPIs with excellent thermal stability and transparency for photoelectric engineering.

A Comprehensive Review on the Thermal Stability Assessment of Polymers and Composites for Aeronautics and Space Applications

This review article provides an exhaustive survey on experimental investigations regarding the thermal stability assessment of polymers and polymer-based composites intended for applications in the aeronautical and space fields. This review aims to: (1) come up with a systematic and critical overview of the state-of-the-art knowledge and research on the thermal stability of various polymers and composites, such as polyimides, epoxy composites, and carbon-filled composites; (2) identify the key factors, mechanisms, methods, and challenges that affect the thermal stability of polymers and composites, such as the temperature, radiation, oxygen, and degradation; (3) highlight the current and potential applications, benefits, limitations, and opportunities of polymers and composites with high thermal stability, such as thermal control, structural reinforcement, protection, and energy conversion; (4) give a glimpse of future research directions by providing indications for improving the thermal stability of polymers and composites, such as novel materials, hybrid composites, smart materials, and advanced processing methods. In this context, thermal analysis plays a crucial role in the development of polyimide-based materials for the radiation shielding of space solar cells or spacecraft components. The main strategies that have been explored to improve the processability, optical transparency, and radiation resistance of polyimide-based materials without compromising their thermal stability are highlighted. The combination of different types of polyimides, such as linear and hyperbranched, as well as the incorporation of bulky pendant groups, are reported as routes for improving the mechanical behavior and optical transparency while retaining the thermal stability and radiation shielding properties. Furthermore, the thermal stability of polymer/carbon nanocomposites is discussed with particular reference to the role of the filler in radiation monitoring systems and electromagnetic interference shielding in the space environment. Finally, the thermal stability of epoxy-based composites and how it is influenced by the type and content of epoxy resin, curing agent, degree of cross-linking, and the addition of fillers or modifiers are critically reviewed. Some studies have reported that incorporating mesoporous silica micro-filler or microencapsulated phase change materials (MPCM) into epoxy resin can enhance its thermal stability and mechanical properties. The mesoporous silica composite exhibited the highest glass transition temperature and activation energy for thermal degradation among all the epoxy-silica nano/micro-composites. Indeed, an average activation energy value of 148.86 kJ/mol was recorded for the thermal degradation of unfilled epoxy resin. The maximum activation energy range was instead recorded for composites loaded with mesoporous microsilica. The EMC-5p50 sample showed the highest mean value of 217.6 kJ/mol. This remarkable enhancement was ascribed to the polymer invading the silica pores and forging formidable interfacial bonds.

Ultralow Coefficient of Thermal Expansion and a High Colorless Transparent Polyimide Film Realized Through a Reinforced Hydrogen-Bond Network by In Situ Polymerization of Aromatic Polyamide in Colorless Polyimide

Colorless polyimides (CPIs) are a key substrate material for flexible organic light-emitting diode (OLED) displays and have attracted worldwide attention. Here, in this paper, the dispersion and interfacial interaction of aromatic polyamide (PA) in CPI (synthesized from 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFMB)) were significantly improved by in situ polymerization, and colorless transparent macromolecular polyimide composites (CPI-PAx) were successfully prepared by PA and CPI. By adjusting the ratio of PA to CPI, a high-performance engineering plastic with excellent film-forming properties was obtained. Molecular simulations confirmed the uniform distribution of PA in CPI and its interaction in polymers. In CPI-PAx, the CPI was locked by the PA chain, and numerous molecular chains were mutually entangled to form a hydrogen-bond network structure. Due to the strong interaction between the chains imparted by the hydrogen bonds of the PA, they do not slide under external forces and heating. In addition, the additive PA has excellent dimensional stability, thermal, and mechanical properties, and CPI has outstanding optical properties, so the synthesized CPI-PAx combines the comprehensive properties of PA and CPI. The CPI-PAx has excellent thermal and mechanical properties, with a thermal decomposition temperature of 499 °C, a glass transition temperature of 385 °C, a coefficient of thermal expansion of 0.8 ppm K-1, a tensile strength of 50.9 MPa, and an elastic modulus of 3.9 GPa. Particularly, CPI-PAx has a 90% transmittance in the visible region. These data prove that the strategy of combining PA and CPI by in situ polymerization is an effective method to circumvent the bottleneck of CPI in the current flexible window application, and this design strategy is universal.