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For: Menétrey M, van Nisselroy C, Xu M, Hengsteler J, Spolenak R, Zambelli T. Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects. RSC Adv 2023;13:13575-13585. [PMID: 37152573 PMCID: PMC10155493 DOI: 10.1039/d3ra00611e] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/29/2023] [Accepted: 04/04/2023] [Indexed: 05/09/2023] Open

For:	Menétrey M, van Nisselroy C, Xu M, Hengsteler J, Spolenak R, Zambelli T. Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects. RSC Adv 2023;13:13575-13585. [PMID: 37152573 PMCID: PMC10155493 DOI: 10.1039/d3ra00611e] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/29/2023] [Accepted: 04/04/2023] [Indexed: 05/09/2023] Open

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