Polyimide foams derived from poly(4,4'-oxydiphenylpyromellitimide) and poly(α-methylstyrene)

Low-dielectric polyimide nanofoams derived from 4,4′-(hexafluoroisopropylidene)diphthalic anhydride and 2,2′-bis(trifluoromethyl)benzidine

A system is designed to study the properties of nanofoams as well as interactions between the matrix and decomposition products of thermal labile content. With the increase thermal labile content, the dielectric constants of PI nanofoams decrease.

Recent Advances in Low K Polymeric Materials

As microelectronic device dimensions decrease and functionality density increases, a change in interconnect materials, both conductors and insulators must change from currently used materials. To this end, we are actively in search of low dielectric constant materials that can be integrated into integrated circuit production. The greatest limiting factor in materials qualification are the stringent IC processing conditions (thermal stability, resistance to chemical/mechanical treatments). Current specifications for back-end-of-the-line (BEOL) thin film insulators call for materials with dielectric constants of 3.0–3.5 and turn of the century CMOS devices may require materials with dielectric constants approaching 2.0. While there are a number of possible candidates for current uses, the list of usable materials with dielectric constants <3.0 is very limited. Future low K candidates being examined include fluorinated polyimides and porous materials.