Park NW, Lee WY, Hong JE, Park TH, Yoon SG, Im H, Kim HS, Lee SK. Effect of grain size on thermal transport in post-annealed antimony telluride thin films.
NANOSCALE RESEARCH LETTERS 2015;
10:20. [PMID:
25852318 PMCID:
PMC4384892 DOI:
10.1186/s11671-015-0733-6]
[Citation(s) in RCA: 4] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 11/28/2014] [Accepted: 01/05/2015] [Indexed: 06/04/2023]
Abstract
The effects of grain size and strain on the temperature-dependent thermal transport of antimony telluride (Sb2Te3) thin films, controlled using post-annealing temperatures of 200°C to 350°C, were investigated using the 3-omega method. The measured total thermal conductivities of 400-nm-thick thin films annealed at temperatures of 200°C, 250°C, 300°C, 320°C, and 350°C were determined to be 2.0 to 3.7 W/m · K in the 20 to 300 K temperature range. We found that the film grain size, rather than the strain, had the most prominent effect on the reduction of the total thermal conductivity. To confirm the effect of grain size on temperature-dependent thermal transport in the thin films, the experimental results were analyzed using a modified Callaway model approach.
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