Adhesive bonding with SU-8 at wafer level for microfluidic devices

Fabrication and characterization of a two-dimensional individually addressable electrowetting microlens array

We demonstrate a two-dimensional, individually tunable electrowetting microlens array fabricated using standard microfabrication techniques. Each lens in our array has a large range of focal tunability from -1.7 mm to -∞ in the diverging regime, which we verify experimentally from 0 to 75 V for a device coated in Parylene C. Additionally, each lens can be actuated to within 1% of their steady-state value within 1.5 ms. To justify the use of our device in a phase-sensitive optical system, we measure the wavefront of a beam passing through the center of a single lens in our device over the actuation range and show that these devices have a surface quality comparable to static microlens arrays. The large range of tunability, fast response time, and excellent surface quality of these devices open the door to potential applications in compact optical imaging systems, transmissive wavefront shaping, and beam steering.

Comparison of different bonding techniques for efficient strain transfer using piezoelectric actuators

In this paper, strain transfer efficiencies from a single crystalline piezoelectric lead magnesium niobate-lead titanate substrate to a GaAs semiconductor membrane bonded on top are investigated using state-of-the-art x-ray diffraction (XRD) techniques and finite-element-method (FEM) simulations. Two different bonding techniques are studied, namely, gold-thermo-compression and polymer-based SU8 bonding. Our results show a much higher strain-transfer for the "soft" SU8 bonding in comparison to the "hard" bonding via gold-thermo-compression. A comparison between the XRD results and FEM simulations allows us to explain this unexpected result with the presence of complex interface structures between the different layers.

A practical guide for the fabrication of microfluidic devices using glass and silicon

This paper describes the main protocols that are used for fabricating microfluidic devices from glass and silicon. Methods for micropatterning glass and silicon are surveyed, and their limitations are discussed. Bonding methods that can be used for joining these materials are summarized and key process parameters are indicated. The paper also outlines techniques for forming electrical connections between microfluidic devices and external circuits. A framework is proposed for the synthesis of a complete glass/silicon device fabrication flow.

Biofriendly bonding processes for nanoporous implantable SU-8 microcapsules for encapsulated cell therapy

Mechanically robust, cell encapsulating microdevices fabricated using photolithographic methods can lead to more efficient immunoisolation in comparison to cell encapsulating hydrogels. There is a need to develop adhesive bonding methods which can seal such microdevices under physiologically friendly conditions. We report the bonding of SU-8 based substrates through (i) magnetic self assembly, (ii) using medical grade photocured adhesive and (iii) moisture and photochemical cured polymerization. Magnetic self-assembly, carried out in biofriendly aqueous buffers, provides weak bonding not suitable for long term applications. Moisture cured bonding of covalently modified SU-8 substrates, based on silanol condensation, resulted in weak and inconsistent bonding. Photocured bonding using a medical grade adhesive and of acrylate modified substrates provided stable bonding. Of the methods evaluated, photocured adhesion provided the strongest and most stable adhesion.