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Deng S, Bhatnagar S, He S, Ahmad N, Rahaman A, Gao J, Narang J, Khalifa I, Nag A. Development and Applications of Embedded Passives and Interconnects Employing Nanomaterials. NANOMATERIALS (BASEL, SWITZERLAND) 2022; 12:3284. [PMID: 36234412 PMCID: PMC9565830 DOI: 10.3390/nano12193284] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 04/10/2022] [Revised: 08/10/2022] [Accepted: 09/13/2022] [Indexed: 06/16/2023]
Abstract
The advent of nanotechnology has initiated a profound revolution in almost all spheres of technology. The electronics industry is concerned with the ongoing miniaturization of devices and as such requires packaging technologies that will make the devices more compact and resilient. 3D packaging, system in package, and system on chip are the various packaging techniques that utilize nanoscale components for their implementation. The active components of the ICs have kept pace with Moore's law, but the passive components have proven an impediment in the race for miniaturization. Moreover, the toxic effects and nano-scale problems associated with conventional soldering techniques have entailed the active involvement of nanotechnology in the search for answers. Recent advances in these fields and the diverse nanomaterials which are being employed to resolve these issues have been discussed in detail.
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Affiliation(s)
- Shanggui Deng
- Department of Food Science and Pharmaceutics, Zhejiang Ocean University, Zhoushan 316022, China
| | - Sharad Bhatnagar
- Faculty of Life and Environmental Sciences, University of Tsukuba, 1-1-1, Tennodai, Tsukuba 305-8572, Ibaraki, Japan
| | - Shan He
- Department of Food Science and Pharmaceutics, Zhejiang Ocean University, Zhoushan 316022, China
- Institute for NanoScale Science and Technology, College of Science and Engineering, Flinders University, Bedford Park 5042, Australia
| | - Nabeel Ahmad
- Department of Biotechnology, School of Allied Sciences, Dev Bhoomi Uttarakhand University, Naugaon 248007, India
| | - Abdul Rahaman
- School of Food Science and Engineering, South China University of Technology, Guangzhou 510641, China
| | - Jingrong Gao
- School of Food Science and Engineering, South China University of Technology, Guangzhou 510641, China
| | - Jagriti Narang
- Department of Biotechnology, School of Chemical and Life Sciences, New Delhi 110062, India
| | - Ibrahim Khalifa
- Food Technology Department, Faculty of Agriculture, Benha University, Moshtohor 13736, Egypt
| | - Anindya Nag
- Faculty of Electrical and Computer Engineering, Technische Universität Dresden, 01062 Dresden, Germany
- Centre for Tactile Internet with Human-in-the-Loop (CeTI), Technische Universität Dresden, 01069 Dresden, Germany
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Shim HC, Song JW, Kwak YK, Kim S, Han CS. Preferential elimination of metallic single-walled carbon nanotubes using microwave irradiation. NANOTECHNOLOGY 2009; 20:065707. [PMID: 19417401 DOI: 10.1088/0957-4484/20/6/065707] [Citation(s) in RCA: 7] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/27/2023]
Abstract
This study presents a simple, easy and rapid technique for the preferential destruction of metallic single-walled carbon nanotubes (m-SWNTs) using microwave irradiation. The proportion of m-SWNTs in a randomly networked film that were made of pristine SWNTs was gradually reduced with microwave irradiation of 1000 W at 2.45 GHz ranging from 0 to 20 min. Additionally it was observed that the m-SWNTs with a higher chiral angle were destroyed first. The Raman spectra and drain current-gate voltage characteristics curve show that this method facilitated the selective removal of m-SWNTs.
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Affiliation(s)
- Hyung Cheoul Shim
- School of Mechanical, Aerospace and Systems Engineering, Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Yuseong-gu, Daejeon, Republic of Korea
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