Oulfarsi M, David N, Aranda L, Medjahdi G, Ihou-Mouko H, Dauscher A. Thermal Stability of Mg
2Si
0.6Sn
0.4 under Oxidation Conditions.
ACS APPLIED MATERIALS & INTERFACES 2023;
15:22616-22625. [PMID:
37126574 DOI:
10.1021/acsami.2c21971]
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Abstract
The use of Mg2Si0.6Sn0.4 under air in thermoelectric modules in the mid-temperature range of 400-600 °C is linked to its ability to resist oxidation. In this study, oxidation experiments performed at 400 °C under air evidenced the stability of the material, either under static conditions (up to 100 h) or under severe heating-cooling cyclic conditions (up to 400 cycles), showing its ability to be used in a reliable way at this temperature. By combining thermogravimetry, scanning electron microscopy, temperature X-ray diffraction analysis, and mechanical and thermodynamic considerations, a mechanism is proposed explaining how Mg2Si0.6Sn0.4 further undergoes decomposition with time under air when treated above 500 °C. The presence of Sn and the formation of various oxides are the key parameters of the material's degradation.
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