Grain boundary and surface energies of fcc metals

The self-annealing phenomenon of electrodeposited nano-twin copper with high defect density

Electroplated copper was prepared under typical conditions and a high defect density to study the effect of the defects on its self-annealing phenomenon. Two conditions, grain growth and stress relaxation during self-annealing, were analyzed with electron backscattered diffraction and a high-resolution X-ray diffractometer. Abnormal grain growth was observed in both conditions; however, the grown crystal orientation differed. The direction and relative rate at which abnormal grain growth proceeds were specified through textured orientation, and the self-annealing mechanism was studied by observing the residual stress changes over time in the films using the sin²Ψ method.

Ultrahigh strength and shear-assisted separation of sliding nanocontacts studied in situ

The behavior of materials in sliding contact is challenging to determine since the interface is normally hidden from view. Using a custom microfabricated device, we conduct in situ, ultrahigh vacuum transmission electron microscope measurements of crystalline silver nanocontacts under combined tension and shear, permitting simultaneous observation of contact forces and contact width. While silver classically exhibits substantial sliding-induced plastic junction growth, the nanocontacts exhibit only limited plastic deformation despite high applied stresses. This difference arises from the nanocontacts’ high strength, as we find the von Mises stresses at yield points approach the ideal strength of silver. We attribute this to the nanocontacts’ nearly defect-free nature and small size. The contacts also separate unstably, with pull-off forces well below classical predictions for rupture under pure tension. This strongly indicates that shearing reduces nanoscale pull-off forces, predicted theoretically at the continuum level, but not directly observed before.

To understand and predict friction, it is crucial to observe sliding at the nanoscale to uncover the mechanisms at play. Here, the authors show that nano-contacts exhibit strength near the ideal limit, and find that pull-off forces predicted by continuum models are reduced by shearing.

Mechanisms-Based Transitional Viscoplasticity

When metal is subjected to extreme strain rates, the conversation of energy to plastic power, the subsequent heat production and the growth of damages may lag behind the rate of loading. The imbalance alters deformation pathways and activates micro-dynamic excitations. The excitations immobilize dislocation, are responsible for the stress upturn and magnify plasticity-induced heating. The main conclusion of this study is that dynamic strengthening, plasticity-induced heating, grain size strengthening and the processes of microstructural relaxation are inseparable phenomena. Here, the phenomena are discussed in semi-independent sections, and then, are assembled into a unified constitutive model. The model is first tested under simple loading conditions and, later, is validated in a numerical analysis of the plate impact problem, where a copper flyer strikes a copper target with a velocity of 308 m/s. It should be stated that the simulations are performed with the use of the deformable discrete element method, which is designed for monitoring translations and rotations of deformable particles.

Regain Strain-Hardening in High-Strength Metals by Nanofiller Incorporation at Grain Boundaries

Grain refinement to the nano/ultrafine-grained regime can make metals several times stronger, but this process is usually accompanied by a dramatic loss of ductility. Such strength-ductility trade-off originates from a lack of strain-hardening capacity in tiny grains. Here, we present a strategy to regain the strain-hardening ability of high-strength metals by incorporation of extrinsic nanofillers at grain boundaries. We demonstrate that the dislocation storage ability in Cu grains can be considerably improved through this novel grain-boundary engineering approach, leading to a remarkably enhanced strain-hardening capacity and tensile ductility (uniform elongation). Experiments and large-scale atomistic simulations reveal that a key benefit of incorporated nanofillers is a reduction in the grain-boundary energy, enabling concurrent dislocation storage near the boundaries and in the Cu grain interior during straining. The strategy of grain-boundary engineering through nanofillers is easily controllable, generally applicable, and may open new avenues for producing nanostructured metals with extraordinary mechanical properties.