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Shin S, Lim DG, Kang T, Chun H, Cho JK. Thermal and electrical properties of glass fiber reinforced o-cresol novolac epoxy composites cured with allylated phenol novolac hardener. POLYM INT 2012. [DOI: 10.1002/pi.4224] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/05/2022]
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Liu W, Wang Z. Silicon-Containing Cycloaliphatic Epoxy Resins with Systematically Varied Functionalities: Synthesis and Structure/Property Relationships. MACROMOL CHEM PHYS 2011. [DOI: 10.1002/macp.201000779] [Citation(s) in RCA: 28] [Impact Index Per Article: 2.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/06/2022]
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Liu W, Wang Z, Chen Z, Li J, Zhao L. Synthesis and properties of two novel silicon-containing cycloaliphatic epoxy resins for electronic packaging application. POLYM ADVAN TECHNOL 2011. [DOI: 10.1002/pat.1882] [Citation(s) in RCA: 23] [Impact Index Per Article: 1.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/09/2022]
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Sulaiman S, Brick CM, De Sana CM, Katzenstein JM, Laine RM, Basheer RA. Tailoring the Global Properties of Nanocomposites. Epoxy Resins with Very Low Coefficients of Thermal Expansion. Macromolecules 2006. [DOI: 10.1021/ma060996j] [Citation(s) in RCA: 42] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/29/2022]
Affiliation(s)
- Santy Sulaiman
- Departments of Materials Science and Engineering and Chemistry, and the Macromolecular Science and Engineering Center, University of Michigan, Ann Arbor, Michigan 48109-2136, and Delphi Research Laboratories, Shelby Township, Michigan 48315
| | - Chad M. Brick
- Departments of Materials Science and Engineering and Chemistry, and the Macromolecular Science and Engineering Center, University of Michigan, Ann Arbor, Michigan 48109-2136, and Delphi Research Laboratories, Shelby Township, Michigan 48315
| | - Christopher M. De Sana
- Departments of Materials Science and Engineering and Chemistry, and the Macromolecular Science and Engineering Center, University of Michigan, Ann Arbor, Michigan 48109-2136, and Delphi Research Laboratories, Shelby Township, Michigan 48315
| | - Joshua M. Katzenstein
- Departments of Materials Science and Engineering and Chemistry, and the Macromolecular Science and Engineering Center, University of Michigan, Ann Arbor, Michigan 48109-2136, and Delphi Research Laboratories, Shelby Township, Michigan 48315
| | - Richard M. Laine
- Departments of Materials Science and Engineering and Chemistry, and the Macromolecular Science and Engineering Center, University of Michigan, Ann Arbor, Michigan 48109-2136, and Delphi Research Laboratories, Shelby Township, Michigan 48315
| | - Rafil A. Basheer
- Departments of Materials Science and Engineering and Chemistry, and the Macromolecular Science and Engineering Center, University of Michigan, Ann Arbor, Michigan 48109-2136, and Delphi Research Laboratories, Shelby Township, Michigan 48315
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Sham ML, Kim JK. Curing behavior and residual stresses in polymeric resins used for encapsulanting electronic packages. J Appl Polym Sci 2005. [DOI: 10.1002/app.21384] [Citation(s) in RCA: 13] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/11/2022]
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