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Ivanov S, Tsakova V, Bund A. Formation and electroanalytical performance of polyaniline–palladium nanocomposites obtained via Layer-by-Layer adsorption and electroless metal deposition. Electrochim Acta 2013. [DOI: 10.1016/j.electacta.2012.11.109] [Citation(s) in RCA: 9] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/27/2022]

Lachhman SB, Zorman CA, Ko WH. Adhesion and Moisture Barrier Characteristics of Roller-Cast Polydimethylsiloxane Encapsulants for Implantable Microsystems. PROCEEDINGS OF IEEE SENSORS. IEEE INTERNATIONAL CONFERENCE ON SENSORS 2012;2012:1-4. [PMID: 23418410 DOI: 10.1109/icsens.2012.6411369] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/07/2022]

Luo S, Wong C. Influence of temperature and humidity on adhesion of underfills for flip chip packaging. ACTA ACUST UNITED AC 2005. [DOI: 10.1109/tcapt.2004.838872] [Citation(s) in RCA: 66] [Impact Index Per Article: 3.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/08/2022]

Luo S, Wong C. Surface property of passivation layer on integrated circuit chip and solder mask layer on printed circuit board. ACTA ACUST UNITED AC 2003. [DOI: 10.1109/tepm.2003.822996] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/08/2022]

Luo S, Leisen J, Wong CP. Study on mobility of water and polymer chain in epoxy and its influence on adhesion. J Appl Polym Sci 2002. [DOI: 10.1002/app.10473] [Citation(s) in RCA: 50] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/08/2022]

Shijian Luo, Wong C. Study on effect of coupling agents on underfill material in flip chip packaging. ACTA ACUST UNITED AC 2001. [DOI: 10.1109/6144.910800] [Citation(s) in RCA: 14] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/06/2022]

Shijian Luo, Wong C. Effect of UV/ozone treatment on surface tension and adhesion in electronic packaging. ACTA ACUST UNITED AC 2001. [DOI: 10.1109/6144.910801] [Citation(s) in RCA: 26] [Impact Index Per Article: 1.1] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/08/2022]

Tanielian M, Kim N, Wong C, Pike R, Wu J. Evaluation and characterization of reliable non-hermetic conformal coatings for microelectromechanical system (MEMS) device encapsulation. ACTA ACUST UNITED AC 2000. [DOI: 10.1109/6040.883764] [Citation(s) in RCA: 15] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/09/2022]

Qizhou Yao, Jianmin Qu, Jiali Wu, Wong C. Characterization of underfill/substrate interfacial toughness enhancement by silane additives. ACTA ACUST UNITED AC 1999. [DOI: 10.1109/6104.816092] [Citation(s) in RCA: 8] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/08/2022]

Jiali Wu, Pike R, Wong C. Novel bi-layer conformal coating for reliability without hermeticity MEMS encapsulation. ACTA ACUST UNITED AC 1999. [DOI: 10.1109/6104.795854] [Citation(s) in RCA: 11] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/09/2022]