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Lee SH, Kim BH, Han WT. Effect of filler metals on the temperature sensitivity of side-hole fiber. OPTICS EXPRESS 2009;17:9712-9717. [PMID: 19506620 DOI: 10.1364/oe.17.009712] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/27/2023]

Dohle G, Drabik T, Callahan J, Martin K. Low temperature bonding of epitaxial lift off devices with AuSn. ACTA ACUST UNITED AC 1996. [DOI: 10.1109/96.533898] [Citation(s) in RCA: 6] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/08/2022]

Lee C, Wang C, Matijasevic G. A new bonding technology using gold and tin multilayer composite structures. ACTA ACUST UNITED AC 1991. [DOI: 10.1109/33.87322] [Citation(s) in RCA: 111] [Impact Index Per Article: 3.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/06/2022]

A bonding technique for thin GaAs dice with via holes using gold-tin composites. ACTA ACUST UNITED AC 1991. [DOI: 10.1109/33.105148] [Citation(s) in RCA: 12] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/06/2022]

Matijasevic G, Wang C, Lee C. Void free bonding of large silicon dice using gold-tin alloys. ACTA ACUST UNITED AC 1990. [DOI: 10.1109/33.62563] [Citation(s) in RCA: 42] [Impact Index Per Article: 1.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/09/2022]