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For: Yu Y, Pun SH, Mak PU, Cheng CH, Wang J, Mak PI, Vai MI. Design of a Collapse-Mode CMUT With an Embossed Membrane for Improving Output Pressure. IEEE Trans Ultrason Ferroelectr Freq Control 2016;63:854-863. [PMID: 27101605 DOI: 10.1109/tuffc.2016.2554612] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/05/2023]
Number Cited by Other Article(s)
1
Herickhoff CD, van Schaijk R. cMUT technology developments. Z Med Phys 2023;33:256-266. [PMID: 37316428 PMCID: PMC10517396 DOI: 10.1016/j.zemedi.2023.04.010] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/14/2023] [Revised: 04/28/2023] [Accepted: 04/29/2023] [Indexed: 06/16/2023]
2
Zhu W, Wang L, Wu Z, Liu W, Sun C. Broadband Piezoelectric Micromachined Ultrasonic Transducer With a Resonant Cavity. IEEE TRANSACTIONS ON ULTRASONICS, FERROELECTRICS, AND FREQUENCY CONTROL 2022;69:340-349. [PMID: 34665723 DOI: 10.1109/tuffc.2021.3119669] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/09/2023]
3
Wang L, Zhu W, Wu Z, Liu W, Sun C. A Novel Coupled Piezoelectric Micromachined Ultrasonic Transducer Based on Piston Mode. IEEE TRANSACTIONS ON ULTRASONICS, FERROELECTRICS, AND FREQUENCY CONTROL 2021;68:3396-3405. [PMID: 34138704 DOI: 10.1109/tuffc.2021.3090043] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/12/2023]
4
Wang J, Liu X, Yu Y, Li Y, Cheng C, Zhang S, Mak P, Vai M, Pun S. A Review on Analytical Modeling for Collapse Mode Capacitive Micromachined Ultrasonic Transducer of the Collapse Voltage and the Static Membrane Deflections. MICROMACHINES 2021;12:mi12060714. [PMID: 34207176 PMCID: PMC8235715 DOI: 10.3390/mi12060714] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 02/26/2021] [Revised: 06/10/2021] [Accepted: 06/15/2021] [Indexed: 11/29/2022]
5
He C, Zhang B, Xue C, Zhang W, Zhang S. Wafer-Bonding Fabricated CMUT Device with Parylene Coating. MICROMACHINES 2021;12:mi12050516. [PMID: 34064449 PMCID: PMC8147958 DOI: 10.3390/mi12050516] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 03/25/2021] [Revised: 04/30/2021] [Accepted: 05/03/2021] [Indexed: 11/19/2022]
6
Experimental Characterization of an Embossed Capacitive Micromachined Ultrasonic Transducer Cell. MICROMACHINES 2020;11:mi11020217. [PMID: 32093303 PMCID: PMC7074606 DOI: 10.3390/mi11020217] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 12/18/2019] [Revised: 02/13/2020] [Accepted: 02/19/2020] [Indexed: 11/28/2022]
7
High-Efficiency Output Pressure Performance Using Capacitive Micromachined Ultrasonic Transducers with Substrate-Embedded Springs. SENSORS 2018;18:s18082520. [PMID: 30072601 PMCID: PMC6111897 DOI: 10.3390/s18082520] [Citation(s) in RCA: 10] [Impact Index Per Article: 1.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 06/15/2018] [Revised: 07/25/2018] [Accepted: 07/26/2018] [Indexed: 11/17/2022]
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