Analysis and Design of High-Frequency 1-D CMUT Imaging Arrays in Noncollapsed Mode

Pre-Charged Collapse-Mode Capacitive Micromachined Ultrasonic Transducer (CMUT) Receivers for Efficient Power Transfer

Capacitive micromachined ultrasonic transducers (CMUTs) offer several advantages over standard lead zirconate titanate (PZT) transducers, particularly for implantable devices. To eliminate their typical need for an external bias voltage, we embedded a charge storage layer in the dielectric. The objective of this study was to evaluate the performance of plasma-enhanced chemical vapor deposition (PECVD) Si3N4 and atomic layer deposition (ALD) Al2O3 as materials for the charge storage layer and two different dielectric layer thicknesses, focusing on their application as receivers in a wireless power transfer link. Capacitance-voltage (CV) measurements revealed that Si3N4 has a higher charge storage capacity compared to Al2O3. Additionally, a thicker dielectric layer between the bottom electrode and the charge storage layer (Bdiel) improved both charge trapping and retention, as assessed in dynamic accelerated lifetime transmit (TX)-mode tests. We then analyzed the power conversion performance of the fabricated CMUTs through both simulations and experiments. We performed extensive modeling based on an equivalent circuit derived from electrical impedance measurements of the fabricated CMUTs. The model was used to predict the power conversion efficiency under various conditions, including the charging field strength, the operating frequency, and parasitic series resistance. Power transfer experiments at 1- and 2.4-MHz recorded efficiencies exceeding 80% with an optimally matched load and up to 54% with a purely resistive load. Results confirmed that, with optimal load matching, the efficiency of different CMUT variants is comparable, indicating that the optimal variant should be selected based on additional criteria, such as charge retention time.

A low-complexity and high-frequency ASIC transceiver for an ultrasound imaging system

This article presents a high-frequency application-specific integrated circuit (ASIC) transceiver for an ultrasound imaging system designed with a focus on low complexity. To simplify the design, it employs a conventional Class-D power amplifier structure for the transmitter (TX) and a resistive feedback transimpedance amplifier (TIA), which consists of a common-source amplifier followed by a source follower for the receiver (RX). Through careful optimization, the RX achieves a measured transimpedance gain of 90 dBΩ and an input-referred noise of 5.6 pA/√Hz at 30 MHz while maintaining a wide bandwidth of up to 30 MHz for both the TX and RX. The power consumption of the TX and RX is measured to be 7.767 mW and 2.5 mW, respectively. Further acoustic performance, assessed using an annular capacitive micromachined ultrasonic transducer (CMUT), showed a 1.78 kPa peak pressure from a 20 V pulser and confirmed the full bandwidth compatibility of the CMUT's bandwidth. The ASIC transceiver has been fabricated using a 0.18 μm HV bipolar-CMOS-DMOS (BCD) process.

A High Sensitivity CMUT-Based Passive Cavitation Detector for Monitoring Microbubble Dynamics During Focused Ultrasound Interventions

Tracking and controlling microbubble (MB) dynamics in the human brain through acoustic emission (AE) monitoring during transcranial focused ultrasound (tFUS) therapy are critical for attaining safe and effective treatments. The low-amplitude MB emissions have harmonic and ultra-harmonic components, necessitating a broad bandwidth and low-noise system for monitoring transcranial MB activity. Capacitive micromachined ultrasonic transducers (CMUTs) offer high sensitivity and low noise over a broad bandwidth, especially when they are tightly integrated with electronics, making them a good candidate technology for monitoring the MB activity through human skull. In this study, we designed a 16-channel analog front-end (AFE) electronics with a low-noise transimpedance amplifier (TIA), a band-gap reference circuit, and an output buffer stage. To assess AFE performance and ability to detect MB AE, we combined it with a commercial CMUT array. The integrated system has 12.3 - [Formula: see text] receive sensitivity with 0.085 - [Formula: see text] minimum detectable pressure (MDP) up to 3 MHz for a single element CMUT with 3.78 [Formula: see text] area. Experiments with free MBs in a microfluidic channel demonstrate that our system is able to capture key spectral components of MBs' harmonics when sonicated at clinically relevant frequencies (0.5 MHz) and pressures (250 kPa). Together our results demonstrate that the proposed CMUT system can support the development of novel passive cavitation detectors (PCD) to track MB activity for attaining safe and effective focused ultrasound (FUS) treatments.

Dual-modality rigid endoscope for photoacoustic imaging and white light videoscopy

Significance

There has been significant interest in the development of miniature photoacoustic imaging probes for a variety of clinical uses, including the in situ assessment of tumors and minimally invasive surgical guidance. Most of the previously implemented probes are either side viewing or operate in the optical-resolution microscopy mode in which the imaging depth is limited to ∼ 1    mm . We describe a forward-viewing photoacoustic probe that operates in tomography mode and simultaneously provides white light video images.

Aim

We aim to develop a dual-modality endoscope capable of performing high-resolution PAT imaging and traditional white light videoscopy simultaneously in the forward-viewing configuration.

Approach

We used a Fabry-Pérot ultrasound sensor that operates in the 1500 to 1600 nm wavelength range and is transparent in the visible and near infrared region (580 to 1250 nm). The FP sensor was optically scanned using a miniature MEMs mirror located at the proximal end of the endoscope, resulting in a system that is sufficiently compact (10 mm outer diameter) and lightweight for practical endoscopic use.

Results

The imaging performance of the endoscope is evaluated, and dual-mode imaging capability is demonstrated using phantoms and abdominal organs of an ex vivo mouse including spleen, liver, and kidney.

Conclusions

The proposed endoscope design offers several advantages including the high acoustic sensitivity and wide detection bandwidth of the FP sensor, dual-mode imaging capability, compact footprint, and an all-optical distal end for improved safety. The dual-mode imaging capability also offers the advantage of correlating the tissue surface morphology with the underlying vascular anatomy. Potential applications include the guidance of laparoscopic surgery and other interventional procedures.

A Review of Emerging Electromagnetic-Acoustic Sensing Techniques for Healthcare Monitoring

Conventional electromagnetic (EM) sensing techniques such as radar and LiDAR are widely used for remote sensing, vehicle applications, weather monitoring, and clinical monitoring. Acoustic techniques such as sonar and ultrasound sensors are also used for consumer applications, such as ranging and in vivo medical/healthcare applications. It has been of long-term interest to doctors and clinical practitioners to realize continuous healthcare monitoring in hospitals and/or homes. Physiological and biopotential signals in real-time serve as important health indicators to predict and prevent serious illness. Emerging electromagnetic-acoustic (EMA) sensing techniques synergistically combine the merits of EM sensing with acoustic imaging to achieve comprehensive detection of physiological and biopotential signals. Further, EMA enables complementary fusion sensing for challenging healthcare settings, such as real-world long-term monitoring of treatment effects at home or in remote environments. This article reviews various examples of EMA sensing instruments, including implementation, performance, and application from the perspectives of circuits to systems. The novel and significant applications to healthcare are discussed. Three types of EMA sensors are presented: (1) Chip-based radar sensors for health status monitoring, (2) Thermo-acoustic sensing instruments for biomedical applications, and (3) Photoacoustic (PA) sensing and imaging systems, including dedicated reconstruction algorithms were reviewed from time-domain, frequency-domain, time-reversal, and model-based solutions. The future of EMA techniques for continuous healthcare with enhanced accuracy supported by artificial intelligence (AI) is also presented.

Circuits on miniaturized ultrasound imaging system-on-a-chip: a review

Trends of medical system move from a traditional in-person visit to virtual healthcare increases demands on point-of-care devices. Because ultrasound (US) is non-invasive, the demands highlight US imaging among other imaging modalities. Thanks to the development of US transducer technology, miniaturized US with application-specific integrated circuits (ASIC) have been researched. For example, applications that require small aperture sizes such as intravascular US (IVUS) and intra-cardiac echocardiography (ICE) require integration of system-on-a-chip (SoC) on the transducer. This paper reviews circuit techniques on the transmitter (TX) and receiver (RX) of the US imaging system. As TX circuits, pulser, T/RX switch, TX beamformer, and power management circuits are discussed. State-of-the-art transducer modeling, pre-amplifier, time-gain compensation, RX beamformer, quadrature sampler, and output driver are introduced as RX circuits.

Analysis of Negative Capacitance-Based Broadband Impedance Matching for CMUTs

Tight integration of capacitive micromachined ultrasonic transducer (CMUT) arrays with integrated circuits can make active impedance matching feasible for practical imaging devices. In this article, negative capacitance-based impedance matching for CMUTs is investigated. Simple equivalent circuit model-based calculations show the potential of negative capacitance matching for improving the bandwidth along with electrical power transfer and acoustic reflectivity, but the model has limitations especially for acoustic reflectivity evaluation. For more realistic results, an experimentally validated CMUT array model is applied to a small 1-D CMUT array operating in the 5-15 MHz range. The results highlight the difference between electrical power transfer and acoustic reflectivity as well as the tradeoffs in signal-to-noise ratio (SNR). According to the results, ideal negative capacitance termination matched to the CMUT capacitance provides the broadest bandwidth and highest SNR if acoustic or electrical reflections are of no concern. On the other hand, negative capacitance and resistance matching to minimize acoustic reflectivity provides both lower reflection and closer to ideal SNR as compared with electrical power matching. It is observed that acoustic matching also reduces acoustic crosstalk and improves array uniformity. While several challenges for integrated circuit implementation are present, negative capacitance-based impedance matching can be a viable broadband active impedance matching method for CMUTs operating in conventional and collapsed mode as well as other ultrasound transducers with mainly capacitive impedance.

An Investigation of Silica Aerogel to Reduce Acoustic Crosstalk in CMUT Arrays

This paper presents a novel technique to reduce acoustic crosstalk in capacitive micromachined ultrasonic transducer (CMUT) arrays. The technique involves fabricating a thin layer of diisocyanate enhanced silica aerogel on the top surface of a CMUT array. The silica aerogel layer introduces a highly nanoporous permeable layer to reduce the intensity of the Scholte wave at the CMUT-fluid interface. 3D finite element analysis (FEA) simulation in COMSOL shows that the developed technique can provide a 31.5% improvement in crosstalk reduction for the first neighboring element in a 7.5 MHz CMUT array. The average improvement of crosstalk level over the -6 dB fractional bandwidth was 22.1%, which is approximately 5 dB lower than that without an aerogel layer. The results are in excellent agreement with published experimental results to validate the efficacy of the new technique.

S-MRUT: Sectored-Multiring Ultrasonic Transducer for Selective Powering of Brain Implants

One of the main challenges of the current ultrasonic transducers for powering brain implants is the complexity of focusing ultrasonic waves in various axial and lateral directions. The available transducers usually use electrically controlled phased array for beamforming the ultrasonic waves, which increases the complexity of the system even further. In this article, we propose a straightforward solution for selective powering of brain implants to remove the complexity of conventional phased arrays. Our approach features a Sectored-Multiring Ultrasonic Transducer (S-MRUT) on a single piezoelectric sheet, specifically designed for powering implantable devices for optogenetics in freely moving animals. The proposed unidirectional S-MRUT is capable of focusing the ultrasonic waves on brain implants located at different depths and regions of the brain. The S-MRUT is designed based on Fresnel Zone Plate (FZP) theory, simulated in COMSOL, and fabricated with the microfabrication process. The acoustic profile of the seven different configurations of the S-MRUT was measured using a hydrophone with the total number of 7436 grid points. The measurements show the ability of the proposed S-MRUT to sweep the focus point of the acoustic waves in the axial direction in depths of 1 - 3 mm, which is suitable for powering implants in the striatum of the mouse. Furthermore, the proposed S-MRUT demonstrates a steering area with an average radius of 0.862 mm and 0.678 mm in experiments and simulations, respectively. The S-MRUT is designed with the size of 3.8×3.8×0.5 mm³ and the weight of 0.054gr , showing that it is compact and light enough to be worn by a mouse. Finally, the S-MRUT was tested in our measurement setup, where it successfully transfers sufficient power to a 2.8-mm³ optogentic stimulator to turn on a micro-LED on the stimulator.

Application of ultrasound in the diagnosis of gastrointestinal tumors

Gastrointestinal tumors are common tumors in the digestive system. Early diagnosis of gastrointestinal tumors is the key to improve prognosis and curative effect of patients with tumors. Compared with other methods of examination and diagnosis, ultrasound examination has the advantages of simple operation, non-invasive, economical, and repeatable operation. With the advancement of ultrasound technology and the development of ultrasound contrast agents, ultrasound examination is more and more applied to gastrointestinal examination. Ultrasound cannot only observe the gastrointestinal wall, but also evaluate the surrounding lesions and metastases, as well as preoperative analysis and postoperative follow-up of gastrointestinal tumors. We reviewed the diagnostic applications of ultrasound in gastrointestinal tumors.

Highly Integrated Guidewire Ultrasound Imaging System-on-a-Chip

In this article, we present a highly integrated guidewire ultrasound (US) imaging system-on-a-chip (GUISoC) for vascular imaging. The SoC consists of a 16-channel US transmitter (Tx) and receiver (Rx) electronics, on-chip power management IC (PMIC), and quadrature sampler. Using a synthetic aperture imaging algorithm, a Tx/Rx pair, connected to capacitive micromachined ultrasound transducers (CMUTs), can be activated at any time. The Tx generates acoustic waves by driving the CMUT, while the Rx picks up the echo signal and amplify it to be delivered through an interconnect that is driven by a buffer. On-chip logic controls the pulsers that generate the high-voltage (HV)-pulse for Tx. An on-chip PMIC provides 1.8-, 5-, 39-, and 44-V supplies and a clock signal from the two interconnects besides GND. A quadrature sampler down-converts the Rx echo signal to baseband, reducing its bandwidth requirement for the output interconnect. The system design, including transimpedance amplifier (TIA) optimization, based on the equivalent circuit of a specific CMUT is presented. The SoC was fabricated by a 0.18-μm HV CMOS process, occupying 1.5-mm2 active area and consuming 25.2 and 44 mW from 1.8 to 44 V supplies, respectively. The US Tx and Rx show bandwidths of 32-42 and 32.7-37.5 MHz, respectively. The input-referred noise of the system was measured as 9.66 nA in band with 2-m-long 52 American Wire Gauge (AWG) wire interconnects. The functionality of the GUISoC was verified in vitro by imaging wire targets.