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Citation(s) in RCA

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For: Agyakwa P, Dai J, Li J, Mouawad B, Yang L, Corfield M, Johnson CM. Three-dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules. J Microsc 2019;277:140-153. [PMID: 31070241 PMCID: PMC7186834 DOI: 10.1111/jmi.12803] [Citation(s) in RCA: 7] [Impact Index Per Article: 1.4] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/08/2019] [Revised: 04/26/2019] [Accepted: 05/07/2019] [Indexed: 11/28/2022]
Number Cited by Other Article(s)
1
Tozzi G, Ahmed F. Preface to ToScA 2018 Special Issue. J Microsc 2021;277:133-134. [PMID: 32251536 DOI: 10.1111/jmi.12883] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/28/2022]
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